GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB (needs tooling holes) with hardware. Top View High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 36.225mm Ball guide prevents over compression of elastomer Easily removable swivel socket lid A A 1 Socket Lid: Black anodized Aluminum. Thickness = 2.5mm. 2 Socket base: Black anodized Aluminum. Thickness = 6.5mm. 3 Compression Plate: Black anodized Aluminum. Thickness = 2.5mm. 4 Compression screw: Clear anodized Aluminum. Thickness = 5mm, Hex socket = 5mm. 5 Elastomer: 20 micron dia gold plated brass filaments arranged symmetrically in a silicone rubber (63.5 degree angle). Thickness = 0.5mm. 6 Elastomer Guide: Cirlex or equivalent. Thickness = 0.475mm. 7 Ball Guide: Kapton polyimide. 8 Socket base screw: Socket head cap, alloy steel with black oxide finish, 0-80 fine thread , 15.875mm long. 9 Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine thread. 10 Insulation Plate: FR4/G10, Thickness = 1.59mm. 11 Backing Plate: Black anodized Aluminum. Thickness = 6.35mm. 36.225mm Recommended torque = 18 in lbs. 4 9 1 3 Assembled 8.25mm + IC thickness 8 7 2 Side View (Section AA) 10 6 11 SG-BGA-8000 Drawing © 2009 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Customer's BGA IC 5 Status: Released Customer's Target PCB Scale: - Rev: C Drawing: J. Glab Date: 3/16/07 File: SG-BGA-8000 Dwg Modified: 7/22/09, AE All tolerances: ±0.125mm (unless stated otherwise). Materials and specifications are subject to change without notice. PAGE 1 of 4 *Note: BGA pattern is not symmetrical with respect to the mounting holes. Recommended PCB Layout Top View Orientation Mark 1.25mm±0.13mm(x4) 1.25mm±0.13mm(x4) 2.61mm* 1mm typ. 2.36mm 2.54mm Ø 0.85mm±0.025mm(x2) Non plated alignment hole 36.225mm±0.125mm (x4) Socket size Ø 0.51mmxPAD 5.08mm 2.5mm±0.13mm 2.5mm±0.13mm Ø 1.75mm±0.05mm(x8) Non plated mounting hole 16.8625mm (x8) 38.725mm±0.125mm (x4) Backing plate size Target PCB Recommendations Total thickness: 2.4mm min. Plating: Gold or Solder finish PCB Pad height: Same or higher than solder mask NOTE: Steel backing plate may be required based on end user's application SG-BGA-8000 Drawing © 2009 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Status: Released Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise. Scale: 2:1 Rev: C Drawing: J. Glab Date: 3/16/07 File: SG-BGA-8000 Dwg Modified: 7/22/09, AE PAGE 2 of 4 Compatible BGA Spec D X DETAIL Y e E 3 Øb Ø0.25 Z X Y Ø0.10 0.20 Dimensions are in millimeters. 2. Interpret dimensions and tolerances per ASME Y14.5M-1994. 3 Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z. 4 Datum Z (seating plane) is defined by the spherical crowns of the solder balls. 5 Parallelism measurement shall exclude any effect of mark on top surface of package. 0.25 Z A A1 DIM 1. 5 DETAIL Z BOTTOM VIEW SIDE VIEW TOP VIEW 4 0.25 Z MIN MAX 3.42 A A1 0.3 b 0.7 D 31.00 BSC E 31.00 BSC e 1.0 BSC Array 30x30 SG-BGA-8000 Drawing © 2009 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Status: Released Scale: - Rev: C Drawing: J. Glab Date: 3/16/07 File: SG-BGA-8000 Dwg Modified: 7/22/09, AE PAGE 3 of 4 2.5mm 1.27mm (x4) 2.5mm 16.863mm±0.025mm (x8) Top View 38.725mm Ø 1.61mm±0.05mm (x8) Note: Backing plate holes are tapped to accept 0-80 screws. 10mm Sqr. 17mm (x4) 38.725mm 1.59mm Insulation Plate Side View 6.35mm Backing Plate Description: Insulation Plate and Backing Plate Scale: - SG-BGA-8000 Drawing Status: Released © 2009 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Drawing: J. Glab Date: 3/16/07 File: SG-BGA-8000 Dwg Modified: 7/22/09, AE Rev: C PAGE 4 of 4