MAX3637 Reliability Report

MAX3637
RELIABILITY REPORT
FOR MAX3637ETM+
PLASTIC ENCAPSULATED DEVICES
June 21, 2010
MAXIM INTEGRATED PRODUCTS
120 SAN GABRIEL DR.
SUNNYVALE, CA 94086
Approved by
Richard Aburano
Quality Assurance
Manager, Reliability Operations
Maxim Integrated Products. All rights reserved.
Page 1
MAX3637
Conclusion
The MAX3637ETM+ successfully meets the quality and reliability standards required of all Maxim products. In addition, Maxim’s
continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim’s quality and reliability standards.
Table of Contents
I. ........Device Description
V. ........Quality Assurance Information
II. ........Manufacturing Information
VI. .......Reliability Evaluation
III. .......Packaging Information
IV. .......Die Information
.....Attachments
I. Device Description
A. General
The MAX3637 is a highly flexible, precision phase-locked loop (PLL) clock generator optimized for the next generation of network equipment that
demands low-jitter clock generation and distribution for robust high-speed data transmission. The device features subpicosecond jitter generation,
excellent power-supply noise rejection, and pin-programmable LVDS/LVPECL output interfaces. The MAX3637 provides nine differential outputs and
one LVCMOS output, divided into three banks. The frequency and output interface of each output bank can be individually programmed, making this
device an ideal replacement for multiple crystal oscillators and clock distribution ICs on a system board, saving cost and space. This 3.3V IC is
available in a 7mm x 7mm, 48-pin TQFN package and operates from -40°C to +85°C.
Maxim Integrated Products. All rights reserved.
Page 2
MAX3637
II. Manufacturing Information
A. Description/Function:
Low-Jitter, Wide Frequency Range, Programmable Clock Generator with 10
Outputs
B. Process:
MB3
C. Number of Device Transistors:
32219
D. Fabrication Location:
California
E. Assembly Location:
Thailand and China
F. Date of Initial Production:
October 15, 2009
III. Packaging Information
A. Package Type:
48-pin TQFN 7x7
B. Lead Frame:
Copper
C. Lead Finish:
100% matte Tin
D. Die Attach:
Conductive
E. Bondwire:
Au (1 mil dia.)
F. Mold Material:
Epoxy with silica filler
G. Assembly Diagram:
#05-9000-3657
H. Flammability Rating:
Class UL94-V0
I. Classification of Moisture Sensitivity per
JEDEC standard J-STD-020-C
Level 1
J. Single Layer Theta Ja:
36°C/W
K. Single Layer Theta Jc:
0.8°C/W
L. Multi Layer Theta Ja:
25°C/W
M. Multi Layer Theta Jc:
0.8°C/W
IV. Die Information
A. Dimensions:
130 X 130 mils
B. Passivation:
BCB
C. Interconnect:
Al with top layer 100% Cu
D. Backside Metallization:
None
E. Minimum Metal Width:
0.35µm
F. Minimum Metal Spacing:
0.35µm
G. Bondpad Dimensions:
5 mil. Sq.
H. Isolation Dielectric:
SiO2
I. Die Separation Method:
Wafer Saw
Maxim Integrated Products. All rights reserved.
Page 3
MAX3637
V. Quality Assurance Information
A. Quality Assurance Contacts:
Richard Aburano (Manager, Reliability Operations)
Bryan Preeshl (Managing Director of QA)
B. Outgoing Inspection Level:
0.1% for all electrical parameters guaranteed by the Datasheet.
0.1% For all Visual Defects.
C. Observed Outgoing Defect Rate:
< 50 ppm
D. Sampling Plan:
Mil-Std-105D
VI. Reliability Evaluation
A. Accelerated Life Test
The results of the 135°C biased (static) life test are shown in Table 1. Using these results, the Failure Rate ( ) is calculated as follows:
=
1
MTTF
=
= 22.9 x 10
1.83
(Chi square value for MTTF upper limit)
192 x 4340 x 48 x 2
(where 4340 = Temperature Acceleration factor assuming an activation energy of 0.8eV)
-9
= 22.9 F.I.T. (60% confidence level @ 25°C)
The following failure rate represents data collected from Maxim’s reliability monitor program. Maxim performs quarterly life test
monitors on its processes. This data is published in the Reliability Report found at http://www.maxim-ic.com/qa/reliability/monitor.
Cumulative monitor data for the MB3 Process results in a FIT Rate of 0.08 @ 25C and 1.33 @ 55C (0.8 eV, 60% UCL)
B. Moisture Resistance Tests
The industry standard 85°C/85%RH or HAST testing is monitored per device process once a quarter.
C. E.S.D. and Latch-Up Testing
The HQ01 die type has been found to have all pins able to withstand a HBM transient pulse of +/- 2500V per
JEDEC JESD22-A114. Latch-Up testing has shown that this device withstands a current of +/- 250mA and overvoltage
per JEDEC JESD78.
Maxim Integrated Products. All rights reserved.
Page 4
MAX3637
Table 1
Reliability Evaluation Test Results
MAX3637ETM+
TEST ITEM
TEST CONDITION
Static Life Test (Note 1)
Ta = 135°C
Biased
Time = 192 hrs.
Moisture Testing (Note 2)
HAST
Ta = 130°C
RH = 85%
Biased
Time = 96hrs.
Mechanical Stress (Note 2)
Temperature
-65°C/150°C
Cycle
1000 Cycles
Method 1010
FAILURE
IDENTIFICATION
SAMPLE SIZE
NUMBER OF
FAILURES
DC Parameters
& functionality
48
0
DC Parameters
& functionality
77
0
DC Parameters
& functionality
77
0
Note 1: Life Test Data may represent plastic DIP qualification lots.
Note 2: Generic Package/Process data
Maxim Integrated Products. All rights reserved.
Page 5