High Speed Characterization Report

High Speed Characterization Report
HDAM-15-12.0-S-13-2
Mates with
HDAF-15-18.0-S-13-2
Description:
HDMezz Elevated Array, 1.2mm x 2mm Grid Interconnect
30mm Stack Height
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 6/4/2007
All Rights Reserved
High Speed Characterization Report
Series: HDAM/HDAF Series (HDMezz)
Description: 1.2mm x 2mm grid interconnect system, high density array, 30mm Stack Height
Table of Contents
Connector Overview........................................................................................................ 1
Connector System Speed Rating .................................................................................... 1
Frequency Domain Data Summary ................................................................................. 2
Table 1 - Single-Ended Signaling System Performance .............................................. 2
Table 2 – Differential Pair Signaling System Performance .......................................... 3
Time Domain Data Summary .......................................................................................... 5
Table 3 - Single-Ended Impedance (Ω) – Line B14 (SE1) ........................................... 5
Table 4 - Differential Impedance (Ω) – Pair B14-C14 (DP1) ........................................ 5
Table 5 - Single-Ended Crosstalk (%).......................................................................... 6
Table 6 – Differential Crosstalk (%) ............................................................................. 7
Table 7 - Propagation Delay (Mated Connector) ......................................................... 8
Characterization Details .................................................................................................. 9
Differential and Single-Ended Data.............................................................................. 9
Connector Signal to Ground Ratio ............................................................................... 9
Frequency Domain Data............................................................................................ 12
Time Domain Data..................................................................................................... 13
Appendix A – Frequency Domain Response Graphs .................................................... 14
Single-Ended Application – Insertion Loss ................................................................ 14
Single-Ended Application – Return Loss ................................................................... 14
Single-Ended Application – NEXT ............................................................................. 15
Single-Ended Application – FEXT.............................................................................. 15
Differential Application – Insertion Loss..................................................................... 16
Differential Application – Return Loss........................................................................ 16
Differential Application – NEXT ................................................................................. 17
Differential Application – FEXT .................................................................................. 17
Appendix B – Time Domain Response Graphs............................................................. 18
Single-Ended Application – Input Pulse..................................................................... 18
Single-Ended Application – Impedance ..................................................................... 19
Single-Ended Application – Propagation Delay ......................................................... 19
Single-Ended Application – NEXT, “Worst Case SE 2” Configuration ....................... 20
Single-Ended Application – FEXT, “Worst Case SE 2” Configuration........................ 20
Single-Ended Application – NEXT, “Best Case SE 1” Configuration ......................... 21
Single-Ended Application – FEXT, “Best Case SE 1” Configuration.......................... 21
Single-Ended Application – NEXT, “Worst Case SE 4” Configuration ....................... 22
Single-Ended Application – FEXT, “Worst Case SE 4” Configuration........................ 22
Single-Ended Application – NEXT, “Best Case SE 3” Configuration ......................... 23
Single-Ended Application – FEXT, “Best Case SE 3” Configuration.......................... 23
Differential Application – Input Pulse ......................................................................... 24
Differential Application – Impedance ......................................................................... 25
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:ii
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 6/4/2007
All Rights Reserved
High Speed Characterization Report
Series: HDAM/HDAF Series (HDMezz)
Description: 1.2mm x 2mm grid interconnect system, high density array, 30mm Stack Height
Differential Application – Propagation Delay.............................................................. 25
Differential Application – NEXT, “Worst Case DP 2” Configuration ........................... 26
Differential Application – FEXT, “Worst Case DP 2” Configuration............................ 26
Differential Application – NEXT, “Best Case DP 1” Configuration.............................. 27
Differential Application – FEXT, “Best Case DP 1” Configuration .............................. 27
Differential Application – NEXT, “Worst Case DP 3” Configuration ........................... 28
Differential Application – FEXT, “Worst Case DP 3” Configuration............................ 28
Differential Application – NEXT, “Best Case DP 3” Configuration.............................. 29
Differential Application – FEXT, “Best Case DP 3” Configuration .............................. 29
Appendix C – Product and Test System Descriptions ................................................... 30
Product Description ................................................................................................... 30
Test System Description............................................................................................ 30
Single-Ended Characterization Conditions ................................................................ 31
DP 1 & DP 2 Characterization Conditions ................................................................. 32
DP 3 Characterization Conditions.............................................................................. 33
HDAX Calibration Board Map .................................................................................... 34
Appendix D – Test and Measurement Setup................................................................. 35
CSA8000/TDA IConnect Measurements Capability................................................... 35
Four Position Dual 40 GHz Microprobe Setup........................................................... 36
Test Instruments ........................................................................................................ 36
Measurement Station Accessories ............................................................................ 36
Test Cables & Adapters............................................................................................. 36
Appendix E - Frequency and Time Domain Measurements .......................................... 37
Sample Preparation ................................................................................................... 37
Frequency (S-Parameter) Domain Procedures ......................................................... 37
CSA8000 Setup ..................................................................................................... 37
Insertion Loss (TDA conversion) ............................................................................ 38
Return Loss (TDA conversion) ............................................................................... 38
Near-End Crosstalk (TDA conversion) ................................................................... 39
Far-End Crosstalk (TDA conversion) ..................................................................... 39
Time Domain Procedures .......................................................................................... 40
Impedance(TD) ...................................................................................................... 40
Propagation Delay (TD) ......................................................................................... 40
Near-End Crosstalk (TD)........................................................................................ 40
Far-End Crosstalk (TD) .......................................................................................... 40
Appendix F – Glossary of Terms................................................................................... 42
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:iii
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 6/4/2007
All Rights Reserved
High Speed Characterization Report
Series: HDAM/HDAF Series (HDMezz)
Description: 1.2mm x 2mm grid interconnect system, high density array, 30mm Stack Height
Connector Overview
HDAM/HDAF is a 1.2mm x 2mm grid interconnects system for elevated high-speed
board-to-board applications. The high density array’s open pin field design allows both
single-ended and differential pair routing. The HDAM/HDAF Series is developed with
143, 195, or 299 signal routing selections. The series is available in 20mm, 25mm
30mm, and 35 mm stack heights. This report depicts the hi-speed electrical characteristics specific to a mated 30mm stack height HDAM/HDAF board-to-board test system.
Connector System Speed Rating
HDAM/HDAF Series, 1.2mm x 2mm (.0472” x .0875”) grid interconnect, 30mm Stack
Height
Signaling
Speed Rating
Single-Ended:
Differential:
10.0 GHz / 20Gbps
7.5 GHz / 15Gbps
The Speed Rating is based on the -3 dB insertion loss point of the connector system.
The -3 dB point can be used to estimate usable system bandwidth in a typical, two-level
signaling environment.
To calculate the Speed Rating, the measured -3 dB point is rounded up to the nearest
half-GHz level. The up-rounding corrects for a portion of the test board’s trace loss,
since trace losses are included in the loss data in this report. The resulting loss value is
then doubled to determine the approximate maximum data rate in Gigabits per second
(Gbps).
For example, a connector with a -3 dB point of 7.8 GHz would have a Speed Rating of 8
GHz/ 16 Gbps. A connector with a -3 dB point of 7.2 GHz would have a Speed Rating
of 7.5 GHz/15 Gbps.
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:1
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 6/4/2007
All Rights Reserved
High Speed Characterization Report
Series: HDAM/HDAF Series (HDMezz)
Description: 1.2mm x 2mm grid interconnect system, high density array, 30mm Stack Height
Frequency Domain Data Summary
Table 1 - Single-Ended Signaling System Performance
Test Parameter
Insertion Loss
Return Loss
Near-End Crosstalk
Far-End Crosstalk
Source
port1=HDAM_B14;
port2=HDAF_B14
port1=HDAM_B14;
port2=HDAF_B14
HDAM_C3
Victim
HDAM_D3
≤ - 8dB to 9.72 GHz
HDAM_B14
HDAM_D14
≤ -22dB to 9.72 GHz
HDAM_B14
HDAM_B13
≤ -20dB to 9.72 GHz
HDAM_C3
HDAM_B2
≤ -22dB to 9.72 GHz
-3dB @ 9.72 GHz
≤ -5dB to 9.72 GHz
HDAM_C3
HDAF_D3
≤ -10dB to 9.72 GHz
HDAM_B14
HDAF_D14
≤ -22dB to 9.72 GHz
HDAM_B14
HDAF_B13
≤ -22dB to 9.72 GHz
HDAM_C3
HDAF_B2
≤ -32dB to 9.72 GHz
Pin Map (reference Appendix C for full description of test boards)
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:2
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 6/4/2007
All Rights Reserved
High Speed Characterization Report
Series: HDAM/HDAF Series (HDMezz)
Description: 1.2mm x 2mm grid interconnect system, high density array, 30mm Stack Height
Table 2 – Differential Pair Signaling System Performance
Test Parameter
Insertion Loss
Return Loss
Near-End Crosstalk
Far-End Crosstalk
Source
port1=HDAM_B14-C14;
port2=HDAF_B14-C14
port1=HDAM_B14-C14;
port2=HDAF_B14-C14
HDAM_B3-C3
Victim
HDAM_D3-E3
≤ -15dB to 7.32 GHz
HDAM_B14-C14
HDAM_E14-F14
≤ -35dB to 7.32 GHz
HDAM_E8-F8
HDAM_E7-F7
≤ -28dB to 7.32 GHz
HDAM_E8-F8
HDAM_B7-C7
≤ -35dB to 7.32GHz
-3dB D33 7.32 GHz
≤ -5dB to 7.32 GHz
HDAM_B3-C3
HDAF_D3-E3
≤ -42dB to 7.32 GHz
HDAM_B14-C14
HDAF_E14-F14
≤ -34dB to 7.32 GHz
HDAM_E8-F8
HDAM_E7-F7
≤ -25dB to 7.32 GHz
HDAM_E8-F8
HDAM_B7-C7
≤ -38dB to 7.32 GHz
Pin Map (reference Appendix C for full description of test boards)
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:3
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 6/4/2007
All Rights Reserved
High Speed Characterization Report
Series: HDAM/HDAF Series (HDMezz)
Description: 1.2mm x 2mm grid interconnect system, high density array, 30mm Stack Height
Bandwidth Chart – Single-Ended & Differential Insertion Loss
PCB/Connector Test System
Single Ended & Differential Applications
30mm Stack HDAM /HDAF Grid Array Series
1
0
-1
-2
-3
-4
-5
-6
-7
-8
-9
Single Ended
Differential
0
1
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
2
3
4
5
6
Frequency (GHz)
7
8
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:4
9
10
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 6/4/2007
All Rights Reserved
High Speed Characterization Report
Series: HDAM/HDAF Series (HDMezz)
Description: 1.2mm x 2mm grid interconnect system, high density array, 30mm Stack Height
Time Domain Data Summary
Table 3 - Single-Ended Impedance (Ω) – Line B14 (SE1)
Signal Risetime
Maximum
Impedance
Minimum
Impedance
35±5ps
50 ps
100 ps
250 ps
500 ps
750 ps
1 ns
67.1
65.1
64.1
61.4
57.5
55.7
54.7
48.0
49.0
49.3
49.8
50.2
50.4
50.5
Single Ended Application
Im pedance vs. Risetim e
80
70
60
maximum
50
minimum
40
30
20
35
50
100
250
500
750
1000
Risetime (pSec)
Table 4 - Differential Impedance (Ω) – Pair B14-C14 (DP1)
Signal Risetime
Maximum
Impedance
Minimum
Impedance
35±5ps
50 ps
100 ps
250 ps
500 ps
750 ps
1 ns
105.4
104.7
104.1
103.3
102.6
102.1
101.6
82.4
90.1
93.9
96.0
97.0
97.2
97.2
Differential Application
Im pedance vs. Risetim e
130
120
110
maximum
100
minimum
90
80
70
35
50
100
250
500
750
1000
Risetime (pSec)
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:5
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 6/4/2007
All Rights Reserved
High Speed Characterization Report
Series: HDAM/HDAF Series (HDMezz)
Description: 1.2mm x 2mm grid interconnect system, high density array, 30mm Stack Height
Table 5 - Single-Ended Crosstalk (%)
Input
(tr)
NEXT
FEXT
Source
Victim
30±5ps
50 ps
100 ps
250 ps
500 ps
750 ps
1 ns
HDAM_C3
D3
15.9
15.5
15.1
13.1
8.8
5.4
5.2
HDAM_B14
D14
1.2
1.0
< 1.0%
< 1.0%
< 1.0%
< 1.0%
< 1.0%
HDAM_B14
B13
2.3
2.1
2.0
1.8
1.1
< 1.0%
< 1.0%
HDAM_C3
B2
2.4
2.1
1.8
1.6
1.2
< 1.0%
< 1.0%
HDAM_C3
D3
7.9
5.3
3.7
3.2
2.1
1.6
1.3
HDAM_B14
D14
< 1.0%
< 1.0%
< 1.0%
< 1.0%
< 1.0%
< 1.0%
< 1.0%
HDAM_B14
B13
4.3
2.9
1.8
1.0
< 1.0%
< 1.0%
< 1.0%
HDAM_C3
B2
2.3
1.7
1.1
< 1.0%
< 1.0%
< 1.0%
< 1.0%
Pin Map (reference Appendix C for full description of test boards)
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:6
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 6/4/2007
All Rights Reserved
High Speed Characterization Report
Series: HDAM/HDAF Series (HDMezz)
Description: 1.2mm x 2mm grid interconnect system, high density array, 30mm Stack Height
Table 6 – Differential Crosstalk (%)
Input
(tr)
Source
NEXT
HDAM
B3-C3
HDAM
B14-C14
HDAM
E8-F8
HDAM
E8-F8
FEXT
HDAM
B3-C3
HDAM
B14-C14
HDAM
E8-F8
HDAM
E8-F8
Victim
30±5ps
50 ps
100 ps
250 ps
500 ps
750 ps
1 ns
D3-E3
5.4
5.3
5.2
4.8
3.2
2.4
1.9
E14F14
< 1.0%
< 1.0%
< 1.0%
< 1.0%
< 1.0%
< 1.0%
< 1.0%
E7-F7
1.2
1.1
1.0
< 1.0%
< 1.0%
< 1.0%
< 1.0%
B7-C7
< 1.0%
< 1.0%
< 1.0%
< 1.0%
< 1.0%
< 1.0%
< 1.0%
D3-E3
< 1.0%
< 1.0%
< 1.0%
< 1.0%
< 1.0%
< 1.0%
< 1.0%
E14F14
< 1.0%
< 1.0%
< 1.0%
< 1.0%
< 1.0%
< 1.0%
< 1.0%
E7-F7
1.2
< 1.0%
< 1.0%
< 1.0%
< 1.0%
< 1.0%
< 1.0%
B7-C7
< 1.0%
< 1.0%
< 1.0%
< 1.0%
< 1.0%
< 1.0%
< 1.0%
Pin Map (reference Appendix C for full description of test boards)
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:7
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 6/4/2007
All Rights Reserved
High Speed Characterization Report
Series: HDAM/HDAF Series (HDMezz)
Description: 1.2mm x 2mm grid interconnect system, high density array, 30mm Stack Height
Table 7 - Propagation Delay (Mated Connector)
Single-Ended
176ps
Differential
184ps
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:8
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 6/4/2007
All Rights Reserved
High Speed Characterization Report
Series: HDAM/HDAF Series (HDMezz)
Description: 1.2mm x 2mm grid interconnect system, high density array, 30mm Stack Height
Characterization Details
This report presents data which characterizes the signal integrity response of a connector pair in a controlled printed circuit board (PCB) environment. All efforts are made to
reveal typical best-case responses inherent to the system under test (SUT).
In this report, the SUT includes the test PCB from drive side probe tips to receive side
probe tips. PCB effects are not removed or de-embedded from test data. PCB designs
with impedance mismatch, large losses, skew, cross talk, or similar impairments can
have a significant impact on observed test data. Therefore, great design effort is put
forth to limit these effects in the PCB utilized in these tests. Some board related effects,
such as pad-to-ground capacitance and trace loss, are included in the data presented in
this report. But other effects, such as via coupling or stub resonance, are not evaluated
here. Such effects are addressed and characterized fully by the Samtec Final Inch®
products.
Additionally, intermediate test signal connections can mask the connectors’ true performance. Such connection effects are minimized by using high performance test cables, adapters, and microwave probes. Where appropriate, calibration and deembedding routines are also used to reduce residual effects.
Differential and Single-Ended Data
Most Samtec connectors can be used successfully in both differential and single-ended
applications. However, electrical performance will differ depending on the signal drive
type. In this report, data is presented for both differential and single-ended drive scenarios.
Connector Signal to Ground Ratio
Samtec connectors are most often designed for generic applications, and can be implemented using various signal and ground pin assignments. In high speed systems,
provisions must be made in the interconnect for signal return currents. Such paths are
often referred to as “ground”. In some connectors, a ground plane or blade, or an outer
shield is used as the signal return, while in others; connector pins are used as signal
returns. Various combinations of signal pins, ground blades, and shields can also be
utilized. Electrical performance can vary significantly depending upon the number and
location of ground pins.
In general, the more pins dedicated to ground, the better electrical performance will be.
But dedicating pins to ground reduces signal density of a connector. So care must be
taken when choosing signal/ground ratios in cost- or density-sensitive applications.
For this connector, the following array configurations are evaluated:
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:9
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 6/4/2007
All Rights Reserved
High Speed Characterization Report
Series: HDAM/HDAF Series (HDMezz)
Description: 1.2mm x 2mm grid interconnect system, high density array, 30mm Stack Height
open pin field
P#
grounded pin field
signal aggressor or signal victim pins
1
M
L
K
J
I
H
G
F
E
D
C
B
A
X
X
X
X
X
X
1
2
3
X
X
X
B2
X
2
X
D3
C3
X
X
3
SE4
SE2
4
X
X
X
X
X
4
5
5
6
6
7
7
8
8
9
9
10
10
11
11
12
X
X
X
X
X
12
13
14
X
X
X D14
X
X
B13 B14
X
X
13
14
SE3
15
X
X
X
X
X
15
M
L
K
J
I
H
G
F
E
D
C
B
A
SE 1
Single-Ended Impedance:
• Well-referenced line (reference SE1:1)
Single-Ended Crosstalk:
• Well-referenced line; mimics 1:1 S:G ratio (reference SE1:1)
• 2:1 S:G ratio (reference SE2:1)
Only one single-ended signal was driven for crosstalk measurements.
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:10
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 6/4/2007
All Rights Reserved
High Speed Characterization Report
Series: HDAM/HDAF Series (HDMezz)
Description: 1.2mm x 2mm grid interconnect system, high density array, 30mm Stack Height
1
M
L
K
J
I
H
G
F
E
D
C
B
A
2
3
4
5
6
7
8
9
10
11
12
X
X
X
X
X
X
1
X
X
X E3
X D3
X C3
X B3
X
X
2
3
DP 2
X
X
X
X
X
X
4
5
6
7
8
9
10
11
12
1
2
4
5
6
7
8
9
10
11
12
3
M
L
K
J
I
H
G
F
E
D
C
B
A
1
2
3
4
5
X
X
X
X
X
X
X
6
X
X
F7 F8
E7 E8
X
X
C7 C8
B7 B8
X
X
7
8
DP3
X
X
X
X
X
X
X
9
13
14
X
X
X F14
X E14
X
X
X C14
X B14
X
X
13 14
DP 1
13
14
15
X
X
X
X
X
X
X
15
M
L
K
J
I
H
G
F
E
D
C
B
A
15
M
L
K
J
I
H
G
F
E
D
C
B
A
10
11
12
13
14
15
Differential Impedance:
• Well-referenced line (reference DP1)
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:11
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 6/4/2007
All Rights Reserved
High Speed Characterization Report
Series: HDAM/HDAF Series (HDMezz)
Description: 1.2mm x 2mm grid interconnect system, high density array, 30mm Stack Height
Differential Crosstalk:
• Well-referenced line; mimics 1:1 S:G ratio (reference DP1)
• Higher Signal Density (reference DP3)
• Full-Column Differential (reference DP2)
Only one differential pair was driven for crosstalk measurements.
In all cases where a center ground blade is present in the connector it is always
grounded to the PCB. Only one single-ended signal or differential pair was driven for
crosstalk measurements.
Other configurations can be evaluated upon request. Please contact [email protected]
for more information.
In a real system environment, active signals might be located at the outer edges of the
signal contacts of concern, as opposed to the ground signals utilized in laboratory testing. For example, in a single-ended system, a pin-out of “SSSS”, or four adjacent single
ended signals, might be encountered, as opposed to the “GSG” and “GSSG” configurations tested in the laboratory. Electrical characteristics in such applications could vary
slightly from laboratory results. But in most applications, performance can safely be considered equivalent.
Signal Edge Speed (Rise Time):
In pulse signaling applications, the perceived performance of the interconnect, can vary
significantly depending on the edge rate or rise time of the exciting signal. For this report, the fastest rise time used was 35 +/-5 ps. Generally, this should demonstrate worst case performance.
In many systems, the signal edge rate will be significantly slower at the connector than
at the driver launch point. To estimate interconnect performance at other edge rates,
data is provided for several rise times between 30 ps and 1.0 ns.
For this report, measured rise times were at 10%-90% signal levels.
Frequency Domain Data
Frequency domain parameters are helpful in evaluating the connector system’s signal
loss and crosstalk characteristics across a range of sinusoidal frequencies. In this report, parameters presented in the frequency domain are insertion loss, return loss, and
near-end and far-end crosstalk. Other parameters or formats, such as VSWR or Sparameters, may be available upon request. Please contact our Signal Integrity Group
at [email protected] for more information.
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:12
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 6/4/2007
All Rights Reserved
High Speed Characterization Report
Series: HDAM/HDAF Series (HDMezz)
Description: 1.2mm x 2mm grid interconnect system, high density array, 30mm Stack Height
Frequency performance characteristics for the SUT are generated from time domain
measurements using Fourier Transform calculations. Procedures and methods used in
generating the SUT’s frequency domain data are provided in the frequency domain test
procedures in Appendix E of this report.
Time Domain Data
Time Domain parameters indicate impedance mismatch versus length, signal propagation time, and crosstalk in a pulsed signal environment. Time Domain data is provided
in Appendix E of this report. Parameters or formats not included in this report may be
available upon request. Please contact our Signal Integrity Group at [email protected]
for more information.
Reference plane impedance is 50 ohms for single-ended measurements and 100 ohms
for differential measurements. The fastest risetime signal exciting the SUT is 35 ± 5
picoseconds.
In this report, propagation delay is defined as the signal propagation time through the
PCB connector pads and connector pair. It does not include PCB traces. Delay is
measured at 35 ± 5 picoseconds signal risetime. Delay is calculated as the difference
in time measured between the 50% amplitude levels of the input and output pulses.
Crosstalk or coupled noise data is provided for various signal configurations. All measurements are single disturber. Crosstalk is calculated as a ratio of the input line voltage
to the coupled line voltage. The input line is sometimes described as the active or drive
line. The coupled line is sometimes described as the quiet or victim line. Crosstalk ratio
is tabulated in this report as a percentage. Measurements are made at both the nearend and far-end of the SUT.
Data for other configurations may be available. Please contact our Signal Integrity
Group at [email protected] for further information.
As a rule of thumb, 10% crosstalk levels are often used as a general first pass limit for
determining acceptable interconnect performance. But modern system crosstalk tolerance can vary greatly. For advice on connector suitability for specific applications,
please contact our Signal Integrity Group at [email protected].
Additional information concerning test conditions and procedures is located in the appendices of this report. Further information may be obtained by contacting our Signal
Integrity Group at [email protected].
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:13
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 6/4/2007
All Rights Reserved
High Speed Characterization Report
Series: HDAM/HDAF Series (HDMezz)
Description: 1.2mm x 2mm grid interconnect system, high density array, 30mm Stack Height
Appendix A – Frequency Domain Response Graphs
Single-Ended Application – Insertion Loss
Configuration: (Port1 = HDAM_B14; Port2 = HDAF_B14)
PCB/Connector Test System
Single Ended Application
30mm Stack HDAM/HDAF Grid Array Series
Insertion Loss (dB)
1
0
-1
-2
-3
-4
-5
-6
-7
Single Ended
-8
-9
0
1
2
3
4
5
6
7
8
9
10
Frequency (GHz)
Single-Ended Application – Return Loss
Configuration: (Port1 = HDAM_B14)
PCB/Connector Test System
Single Ended Application
30mm Stack HDAM/HDAF Grid Array Series
0
Return Loss (dB)
-10
-20
-30
-40
Single Ended
-50
-60
-70
-80
-90
0
1
2
3
4
5
6
7
8
9
10
Frequency (GHz)
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:14
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 6/4/2007
All Rights Reserved
High Speed Characterization Report
Series: HDAM/HDAF Series (HDMezz)
Description: 1.2mm x 2mm grid interconnect system, high density array, 30mm Stack Height
Single-Ended Application – NEXT
PCB/Connector Test System
Single Ended Application
30mm Stack HDAM/HDAF Grid Array Series
Near-End Crosstalk (dB)
0
-10
-20
-30
Worst Case SE2
-40
Best Case SE1
-50
-60
Worst Case SE4
-70
-80
Best Case SE3
-90
0
1
2
3
4
5
6
7
8
9
10
Frequency (GHz)
Single-Ended Application – FEXT
PCB/Connector Test System
Single Ended Application
30mm Stack HDAM/HDAF Grid Array Series
0
Far-End Crosstalk (dB)
-10
-20
Worst Case SE2
-30
-40
Best Case SE1
-50
-60
Worst Case SE4
-70
Best Case SE3
-80
-90
0
1
2
3
4
5
6
7
8
9
10
Frequency (GHz)
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:15
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 6/4/2007
All Rights Reserved
High Speed Characterization Report
Series: HDAM/HDAF Series (HDMezz)
Description: 1.2mm x 2mm grid interconnect system, high density array, 30mm Stack Height
Differential Application – Insertion Loss
Configuration: (Port1 = HDAM_B14-C14; Port2 = HDAF_B14-C14)
PCB/Connector Test System
Single Ended Application
30mm Stack HDAM/HDAF Grid Array Series
Insertion Loss (dB)
1
0
-1
-2
-3
-4
-5
Differential
-6
-7
-8
-9
0
1
2
3
4
5
6
7
8
9
Frequency (GHz)
Differential Application – Return Loss
Configuration: (Port1 = HDAM_B14-C14)
PCB/Connector Test System
Differential Application
30mm Stack HDAM/HDAF Grid Array Series
0
Return Loss (dB)
-10
-20
-30
-40
-50
Differential
-60
-70
-80
-90
0
1
2
3
4
5
6
7
8
9
Frequency (GHz)
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:16
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 6/4/2007
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High Speed Characterization Report
Series: HDAM/HDAF Series (HDMezz)
Description: 1.2mm x 2mm grid interconnect system, high density array, 30mm Stack Height
Differential Application – NEXT
PCB/Connector Test System
Differential Application
30mm Stack HDAM/HDAF Grid Array Series
Near-End Crosstalk (dB)
0
-10
-20
Worst Case DP2
-30
-40
Best Case DP1
-50
-60
Worst Case DP3
-70
Best Case DP3
-80
-90
0
1
2
3
4
5
6
7
8
9
Frequency (GHz)
Differential Application – FEXT
PCB/Connector Test System
Differential Application
30mm Stack HDAM/HDAF Grid Array Series
0
Far-End Crosstalk (dB)
-10
-20
Worst Case DP2
-30
-40
Best Case DP1
-50
-60
Worst Case DP3
-70
-80
-90
Best Case DP3
-100
0
1
2
3
4
5
6
7
8
9
Frequency (GHz)
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:17
Phone: 812-944-6733
Fax: 812-948-5047
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High Speed Characterization Report
Series: HDAM/HDAF Series (HDMezz)
Description: 1.2mm x 2mm grid interconnect system, high density array, 30mm Stack Height
Appendix B – Time Domain Response Graphs
Single-Ended Application – Input Pulse
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:18
Phone: 812-944-6733
Fax: 812-948-5047
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High Speed Characterization Report
Series: HDAM/HDAF Series (HDMezz)
Description: 1.2mm x 2mm grid interconnect system, high density array, 30mm Stack Height
Single-Ended Application – Impedance
Configuration: (Port1 = HDAM_B14)
Single-Ended Application – Propagation Delay
Configuration: (Port1 = HDAM_B14; Port2 = HDAF_B14)
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:19
Phone: 812-944-6733
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High Speed Characterization Report
Series: HDAM/HDAF Series (HDMezz)
Description: 1.2mm x 2mm grid interconnect system, high density array, 30mm Stack Height
Single-Ended Application – NEXT, “Worst Case SE 2” Configuration
Configuration: (Port1 = HDAM_C3; Port3 = HDAM_D3)
Single-Ended Application – FEXT, “Worst Case SE 2” Configuration
Configuration: (Port1 = HDAM_C3; Port4 = HDAF_D3)
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:20
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 6/4/2007
All Rights Reserved
High Speed Characterization Report
Series: HDAM/HDAF Series (HDMezz)
Description: 1.2mm x 2mm grid interconnect system, high density array, 30mm Stack Height
Single-Ended Application – NEXT, “Best Case SE 1” Configuration
Configuration: (Port1 = HDAM_C3; Port3 = HDAM_D14)
Single-Ended Application – FEXT, “Best Case SE 1” Configuration
Configuration: (Port1 = HDAM_C3; Port4 = HDAF_D14)
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:21
Phone: 812-944-6733
Fax: 812-948-5047
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High Speed Characterization Report
Series: HDAM/HDAF Series (HDMezz)
Description: 1.2mm x 2mm grid interconnect system, high density array, 30mm Stack Height
Single-Ended Application – NEXT, “Worst Case SE 4” Configuration
Configuration: (Port1 = HDAM_B14; Port3 = HDAM_B13)
Single-Ended Application – FEXT, “Worst Case SE 4” Configuration
Configuration: (Port1 = HDAM_B14; Port4 = HDAF_B13)
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:22
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 6/4/2007
All Rights Reserved
High Speed Characterization Report
Series: HDAM/HDAF Series (HDMezz)
Description: 1.2mm x 2mm grid interconnect system, high density array, 30mm Stack Height
Single-Ended Application – NEXT, “Best Case SE 3” Configuration
Configuration: (Port1 = HDAM_C3; Port3 = HDAM_B2)
Single-Ended Application – FEXT, “Best Case SE 3” Configuration
Configuration: (Port1 = HDAM_C3; Port4 = HDAF_B2)
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:23
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 6/4/2007
All Rights Reserved
High Speed Characterization Report
Series: HDAM/HDAF Series (HDMezz)
Description: 1.2mm x 2mm grid interconnect system, high density array, 30mm Stack Height
Differential Application – Input Pulse
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:24
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 6/4/2007
All Rights Reserved
High Speed Characterization Report
Series: HDAM/HDAF Series (HDMezz)
Description: 1.2mm x 2mm grid interconnect system, high density array, 30mm Stack Height
Differential Application – Impedance
Configuration: (Port1 = HDAM_B14-C14)
Differential Application – Propagation Delay
Configuration: (Port1 = HDAM_B14-C14; Port2 = HDAF_B14-C14)
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:25
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 6/4/2007
All Rights Reserved
High Speed Characterization Report
Series: HDAM/HDAF Series (HDMezz)
Description: 1.2mm x 2mm grid interconnect system, high density array, 30mm Stack Height
Differential Application – NEXT, “Worst Case DP 2” Configuration
Configuration: (Port1 = HDAM_B3-C3; Port3 = HDAM_D3-E3)
Differential Application – FEXT, “Worst Case DP 2” Configuration
Configuration: (Port1 = HDAM_B3-C3; Port4 = HDAF_D3-E3)
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
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Phone: 812-944-6733
Fax: 812-948-5047
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High Speed Characterization Report
Series: HDAM/HDAF Series (HDMezz)
Description: 1.2mm x 2mm grid interconnect system, high density array, 30mm Stack Height
Differential Application – NEXT, “Best Case DP 1” Configuration
Configuration: (Port1 = HDAM_B14-C14; Port3 = HDAM_E14-F14)
Differential Application – FEXT, “Best Case DP 1” Configuration
Configuration: (Port1 = HDAM_B14-C14; Port4 = HDAF_E14-F14)
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:27
Phone: 812-944-6733
Fax: 812-948-5047
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High Speed Characterization Report
Series: HDAM/HDAF Series (HDMezz)
Description: 1.2mm x 2mm grid interconnect system, high density array, 30mm Stack Height
Differential Application – NEXT, “Worst Case DP 3” Configuration
Configuration: (Port1 = HDAM_E8-F8; Port3 = HDAM_E7-F7)
Differential Application – FEXT, “Worst Case DP 3” Configuration
Configuration: (Port1 = HDAM_E8-F8; Port4 = HDAF_E7-F7)
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:28
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 6/4/2007
All Rights Reserved
High Speed Characterization Report
Series: HDAM/HDAF Series (HDMezz)
Description: 1.2mm x 2mm grid interconnect system, high density array, 30mm Stack Height
Differential Application – NEXT, “Best Case DP 3” Configuration
Configuration: (Port1 = HDAM_E8-F8; Port3 = HDAM_B7-C7)
Differential Application – FEXT, “Best Case DP 3” Configuration
Configuration: (Port1 = HDAM_E8-F8; Port4 = HDAF_B7-C7)
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:29
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 6/4/2007
All Rights Reserved
High Speed Characterization Report
Series: HDAM/HDAF Series (HDMezz)
Description: 1.2mm x 2mm grid interconnect system, high density array, 30mm Stack Height
Appendix C – Product and Test System Descriptions
Product Description
HDMezz is a high-density array connector designed with open pin fields for differential
or single-ended signaling options. The HDAM-15-17.0-S-13-12 /HDAF-15-18.0-S-13-2
mating array design includes 13 signal rows providing 15 signal pins per row. Board-toBoard mating provides a 35mm elevation.
Test System Description
The test fixtures are composed of a 4-layer FR-4 material with 50Ω and100Ω signal
trace and pad configurations designed for the electrical characterization of Samtec hispeed connector products. The fixture pictured is 1 of 3 signaling card conventions required for a full SI characterization. Configuration conventions and the application details are on the following pages.
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
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Phone: 812-944-6733
Fax: 812-948-5047
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High Speed Characterization Report
Series: HDAM/HDAF Series (HDMezz)
Description: 1.2mm x 2mm grid interconnect system, high density array, 30mm Stack Height
Single-Ended Characterization Conditions
Fixture Identity
PCB-100669-TST-11 REV – HDAM SE TEST BOARD
PCB-100669-TST-01 REV – HDAF SE TEST BOARD
SE THRU Parameters - Insertion Loss, Return Loss, Propagation Delay, Impedance
Configuration: GSG
SE 1
HDAM_B14,
HDAF_B14
Crosstalk Parameters –
TD NEXT, TD NEXT, FD FEXT,
Configuration: GAVG, 2:1
SE 2
Near-End
HDAM_C3,
HDAM_D3
Far-End
HDAM_C3,
HDAF_D3
Configuration: GAGVG, 1:1
SE 1
Near-End
HDAM_B14,
HDAM_D14
Far-End
HDAM_B14,
HDAF_D14
Configuration: GAVG/GAVG, 1:1
SE 4
Near-End
HDAM_B14,
HDAM_B13
Far-End
HDAM_B14,
HDAF_B13
Configuration: GAGVG/GAGVG, 2:1
SE 3
Near-End
HDAM_C3,
HDAM_B2
Far-End
HDAM_C3,
HDAF_B2
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
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Page:31
TD FEXT
Phone: 812-944-6733
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High Speed Characterization Report
Series: HDAM/HDAF Series (HDMezz)
Description: 1.2mm x 2mm grid interconnect system, high density array, 30mm Stack Height
DP 1 & DP 2 Characterization Conditions
Fixture Identity
PCB-100669-TST-12 REV – HDAM DIFF TEST BOARD 1
PCB-100669-TST-02 REV – HDAF DIFF TEST BOARD 1
Thru Parameters - Insertion Loss, Return Loss, Propagation Delay, Impedance
Configuration: GSSG
DP 1
HDAM_B14-C14, HDAF_B14-C14
Crosstalk Parameters –
TD NEXT, TD NEXT,
Configuration: GAAVVG:
DP 2
Near-End
HDAM_B3-C3,
Far-End
HDAM_B3-C3,
Configuration: GAAGVVG
DP 1
Near-End
HDAM_B14-C14,
Far-End
HDAM_B14-C14,
Samtec Inc.
520 Park East Blvd.
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Page:32
FD FEXT,
TD FEXT
HDAM_D3-E3
HDAF_D3-E3
HDAM_E14-F14
HDAF_E14-F14
Phone: 812-944-6733
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High Speed Characterization Report
Series: HDAM/HDAF Series (HDMezz)
Description: 1.2mm x 2mm grid interconnect system, high density array, 30mm Stack Height
DP 3 Characterization Conditions
Fixture Identity
PCB-100669-TST-13 REV – HDAM DIFF TEST BOARD 2
PCB-100669-TST-03 REV – HDAF DIFF TEST BOARD 2
Crosstalk Parameters –
TD NEXT,
TD NEXT,
Configuration: GAAVVG/GAAVVG
DP 3
Near-End
HDAM_E8-F8,
Far-End
HDAM_E8-F8,
Configuration: GAAGVVG/GAAGVVG
DP 3
Near-End
HDAM_E8-F8,
Far-End
HDAM_E8-F8,
Samtec Inc.
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Page:33
FD FEXT,
TD FEXT
HDAM_E7-F7
HDAF_E7-F7
HDAM_B7-C7
HDAF_B7-C7
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High Speed Characterization Report
Series: HDAM/HDAF Series (HDMezz)
Description: 1.2mm x 2mm grid interconnect system, high density array, 30mm Stack Height
HDAX Calibration Board Map
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
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Phone: 812-944-6733
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High Speed Characterization Report
Series: HDAM/HDAF Series (HDMezz)
Description: 1.2mm x 2mm grid interconnect system, high density array, 30mm Stack Height
Appendix D – Test and Measurement Setup
The test instrument is the Tektronix CSA8000 Communication Signal Analyzer Mainframe. Four bays of the CSA8000 are occupied with three Tektronix 80E04
TDR/Sampling Heads and one Tektronix 80E03 Sampling Head. Time domain results
are generated using the TDR/Sampling Head capability. S-parameter data is generated from a TDR based software tool called I-Connect Probing is accomplished using
a video microscopy system, microprobe positioners, and 40GHz capable probes. The
450 micron pitch probes are located to PCB launch points with 25X to 175X magnification and XYZ fine positioning adjustments available from both the probe table and micro-probe positioners. Electrically the microwave probes rate a < 1.0 dB insertion loss,
a ≥18 dB return loss, and an isolation of 38 dB providing high-bandwidth and low parasitic measurement results. Combined, the above technology provides a stable measurement environment along with the electrical accuracies for obtaining precise calibrations and signal launch capabilities
CSA8000/TDA IConnect Measurements Capability
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
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Phone: 812-944-6733
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High Speed Characterization Report
Series: HDAM/HDAF Series (HDMezz)
Description: 1.2mm x 2mm grid interconnect system, high density array, 30mm Stack Height
Four Position Dual 40 GHz Microprobe Setup
Test Instruments
QTY Description
1
Tektronix CSA8000 Communication Signal Analyzer
3
Tektronix 80E04 Dual Channel 20 GHz TDR Sampling Module
1
Tektronix 80E03 Dual Channel 20 GHz Sampling Module
Measurement Station Accessories
QTY Description
1
GigaTest Labs Model (GTL3030) Probe Station
4
GTL Micro-Probe Positioners
4
Picoprobe by GGB Ind. Dual Model 40A GSG-GSG (differential applications)
1
Keyence VH-5910 High Resolution Video Microscope
1
Keyence VH-W100 Fixed Magnification Lens 100 X
1
Keyence VH-Z25 Standard Zoom Lens 25X-175X
Test Cables & Adapters
QTY Description
4
Pasternack Enterprises 2.9mm Semi-Rigid (.086) 9” Cable Assemblies
2
Tektronix 1 Meter Module Extenders
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:36
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 6/4/2007
All Rights Reserved
High Speed Characterization Report
Series: HDAM/HDAF Series (HDMezz)
Description: 1.2mm x 2mm grid interconnect system, high density array, 30mm Stack Height
Appendix E - Frequency and Time Domain Measurements
It is important to note before gathering measurement data that TDA Systems IConnect
measurements and CSA8000 measurements are virtually the same measurements with
diverse formats. This means that the operator, being extremely aware, can obtain SI
time and frequency characteristics in an almost simultaneous fashion.
Since IConnect setup procedures are specific to the frequency information sought, it is
mandatory that the sample preparation and CSA8000 functional setups be consistent
throughout the waveform gathering process. If the operators test equipment permits
recall sequencing between the various test parameter setups, it insures IConnect functional setups remain consistent with the TDR/TDT waveforms previously recorded. Related time and frequency test parameter data recorded for this report were gathered simultaneously.
Sample Preparation
Determine signal launch and monitoring test points by referencing the pin-out maps of
interest
Single-ended pinout:
se
Differential parameters:
dp in row
dp across row
Calibration board
pcb-100669-tst-20
It is a good practice to terminate all non-active signal lines immediately adjacent to the
designated active or quiet signal lines under test.
Frequency (S-Parameter) Domain Procedures
Frequency data extraction involves a two step process. The first step determines two
SUT time domain waveform relationships utilizing a Tektronix CSA8000 time based instrument. The second step involves the conversion of the time based waveforms into
frequency domain response format using the TDA Systems IConnect software tool. TDA
Systems labels time related conversion waveforms as the Step and DUT waveform references. This section establishes the setup procedures for defining the Step and DUT
reference for conversion to frequency s-parameters presented in this report.
CSA8000 Setup
Listed below is the CSA 8000 functional menu setups used for single-ended and differential frequency response extractions. Both signal types utilize I-Connect software tools
to generate S-parameter upper and lower frequency boundaries along with the step frequency. These frequency boundaries are determined by the time domain instruments
functional settings such as window length, number of points and averaging capability.
Once window length, number of points and averaging functions are set, maintain the
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:37
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 6/4/2007
All Rights Reserved
High Speed Characterization Report
Series: HDAM/HDAF Series (HDMezz)
Description: 1.2mm x 2mm grid interconnect system, high density array, 30mm Stack Height
same instrument settings throughout the extraction process. The single channel pulsed
source processes s-parameters in single-ended format. A dual channel differential
pulsed source processes s-parameters in differential format.
Vertical Scale:
Offset:
Horizontal Scale:
Max. Record Length:
Averages:
Single-Ended Signal
100 mV/ Div:
Default / Scroll
1nSec/ Div = 20 MHz step
frequency
4000 = Min. Resolution
≥ 128
Differential Signal
100 mV/ Div:
Default / Scroll
1nSec/ Div = 20 MHz step
frequency
4000 = Min. Resolution
≥ 128
Insertion Loss (TDA conversion)
Step Waveform - determine TD waveform by making a TDT transmission measurement that includes all cables, adapters, and probes connected in the test systems
transmission path. The transmission path is completed by inserting a negligible length
of transmission standard between the system test probes. Calibration or waveform referencing utilizes 3 pads for each probe touchdown (ie; se thru = 6 pads or diff thru = 12
pads).
Reference cal board, use standard labeled thru_cal.
DUT Waveform - determine waveform by making an active TDT transmission measurement that includes all cables, adapters, and probes connected in the test systems
transmission path. Insert the SUT between the probes in place of the transmission
THRU_CAL standard and record the measurement.
Return Loss (TDA conversion)
Step Waveform – determine TD waveform by making an active TDR reflection measurement that includes all cables, adapters, and probes connected in the test systems
electrical path up to and including an open standard. Calibration or waveform referencing utilizes 3 pads for each probe touchdown (ie; se reflect = 3 pads or diff reflect = 6
pads).
Reference cal board, use standard labeled thru_cal.
DUT Waveform – determine waveform by making an active TDR reflection measurement that includes all cables, adapters, and probes connected in the test systems
transmission path. Insert the SUT between the probes in place of the THRU_CAL reflection standard and record the measurement. In this condition cables and adapters
located at the far-end of the inserted SUT function as the systems 50Ω single-ended
and/or 100Ω differential matching impedance.
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:38
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 6/4/2007
All Rights Reserved
High Speed Characterization Report
Series: HDAM/HDAF Series (HDMezz)
Description: 1.2mm x 2mm grid interconnect system, high density array, 30mm Stack Height
Reference se thru, for specified single-ended signal path
Reference diff thru, for specified differential signal path
Near-End Crosstalk (TDA conversion)
Step Waveform – Use Return Loss step waveform.
DUT Waveform - determine waveforms by driving specified signal type and monitoring
coupled energy levels at the configurations adjacent near-end signal line(s).
Far-End Crosstalk (TDA conversion)
Step Waveform - Use Insertion Loss step waveform.
DUT Waveform - determine waveform by driving specified signal type and monitoring
coupled energy levels at the configurations adjacent far-end signal line(s).
Reference se 1 thru 4 for all single-ended near-end and far-end crosstalk worst or best
case configurations.
Reference dp 1 & dp 2 for differential in row near-end and far-end crosstalk worst and
best case configurations.
Reference dp 3 for differential across row near-end and far-end crosstalk worst and best
case configurations.
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:39
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 6/4/2007
All Rights Reserved
High Speed Characterization Report
Series: HDAM/HDAF Series (HDMezz)
Description: 1.2mm x 2mm grid interconnect system, high density array, 30mm Stack Height
Time Domain Procedures
Measurements involving digital type pulses are performed utilizing the Time Domain Reflectometer (TDR) or Time Domain Transmission (TDT) methods. For this series of
tests, TDR methods are employed for the impedance and propagation delay measurements. Crosstalk measurements utilize TDT methods. The Tektronix 80E04 TDR/ Sampling Head provide both the signaling type and sampling capability necessary to accurately
and fully characterize the SUT.
Impedance(TD)
The signal line(s) of the SUT’s signal configuration are energized with a TDR pulse.
The far-end of the energized signal lines are terminated in the test systems characteristic impedance (e.g.; 50Ω or 100Ω termination).
Use specified se thru path for SE impedance profile.
Use specified differential thru path for DIFF impedance profile.
Propagation Delay (TD)
This test reports differential or single ended signal delay as the measured difference of
propagation between a combined electrical length of the input/output signal pads and
traces (35 ± 5 ps edge rate) and the device under test (DUT) plus a referenced electrical length of the signal pads and signal traces (PDpads/traces- PDDUT + PDpads/traces).
PDpads/traces is the nomenclature representing the electrical length of PCB signal pads &
traces equal to physical lengths of PCB pads & traces entering and leaving the device
under test (DUT). The PDDUT + PDpads/traces variable is the mated DUT fixture. Both
PDpads/traces & PDDUT + PDpads/traces waveform edgerates are measured and recorded at
50 % amplitude of each recorded rising edge. The distance in time between the rising
edges is the propagation delay of the device under test (DUT).
Use 1473 mil trace and se thru for single-ended PD measurements.
Use 1712 mil trace and differential thru for differential PD measurements.
Near-End Crosstalk (TD)
Energize the pre-determined signal line(s) with the appropriate signal type. Monitor the
configurations adjacent quiet signal line at the near-end for magnitudes of coupled energy. Adjacent signal lines not undergoing testing are terminated in the test systems
characteristic impedance.
Far-End Crosstalk (TD)
Energize the pre-determined signal line(s) with the appropriate signal type. Monitor the
configurations adjacent quiet signal line at the far-end for magnitudes of coupled energy. Adjacent signal lines not undergoing testing are terminated in the test systems
characteristic impedance.
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:40
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 6/4/2007
All Rights Reserved
High Speed Characterization Report
Series: HDAM/HDAF Series (HDMezz)
Description: 1.2mm x 2mm grid interconnect system, high density array, 30mm Stack Height
Use specified SE 1 & SE 2 configurations for single-ended Worse Case, Best Case,
Parallel Across Row and Staggered Across Row near-end and far-end crosstalk measurements.
Use specified DP 1 & DP 2 configurations for differential Worse Case, Best Case, nearend and far-end crosstalk measurements.
Use specified DP 3 crosstalk configurations for differential parallel across row and staggered across row near-end and far-end crosstalk measurements.
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:41
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 6/4/2007
All Rights Reserved
High Speed Characterization Report
Series: HDAM/HDAF Series (HDMezz)
Description: 1.2mm x 2mm grid interconnect system, high density array, 30mm Stack Height
Appendix F – Glossary of Terms
TD – Time Domain
FD – Frequency domain
DUT – Device under test, term used for TDA IConnect & Propagation Delay waveforms
EC6 – Edge Card with a .635mm signal pad pitch
FEXT – Far-End Crosstalk
GSG – Ground–Signal-Ground; geometric configuration
GSSG - Ground–Signal-Signal-Ground; geometric configuration
LEC6 – Signal Launch Edge Card with a .635 mm signal pad pitch
NEXT – Near-End Crosstalk
PCB – Printed Circuit Board
SE – Single-Ended
SI – Signal Integrity
SUT – System Under Test
TDR – Time Domain Reflectometry
TDT – Time Domain Transmission
WC – Worst Case crosstalk configuration
BC – Best Case crosstalk configuration
Z – Impedance (expressed in ohms)
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:42
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 6/4/2007
All Rights Reserved