RB495D : Diodes

Data Sheet
Schottky Barrier Diode
RB495D
Applications
General rectification.
Dimensions (Unit : mm)
Land size figure (Unit : mm)
1.9
2.9±0.2
各 リー ドと も
Each
lead
同寸
法 has same dimension
Features
1) Small mold type. (SMD3)
2) Low IR
3) High reliability
+0.1
0.15 -0.06
0.8MIN.
0.3~0.6
0~ 0.1
(2)
(1)
0.95
Construction
Silicon epitaxial planar
0.95
1.0MIN.
+0.2
1.6-0.1
2.8±0.2
(3)
0.8±0.1
0.95
2.4
+0.1
0.4 -0.05
SMD3
1.1±0.2
0.01
1.9±0.2
Structure
ROHM : SMD3
JEDEC :S0T-346
JEITA : SC-59
week code
Taping specifications (Unit : mm)
φ1.5±0.1
0
2.0±0.05
0.3±0.1
Limits
40
25
0.4
2
125
40 to 125
Symbol
VRM
VR
Io
IFSM
Tj
Tstg
3.2±0.1
8.0±0.2
0~0.5
3.2±0.1
Absolute maximum ratings (Ta=25°C)
Parameter
Reverse voltage (repetitive peak)
Reverse voltage (DC)
Average rectified forward current (*1)
Forward current surge peak (60Hz・1cyc) (*1)
Junction temperature
Storage temperature
φ1.05MIN
4.0±0.1
3.2±0.1
5.5±0.2
3.5±0.05
1.75±0.1
4.0±0.1
1.35±0.1
Unit
V
V
A
A
°C
°C
(*1) Rating of per diode : lo/2
Electrical characteristics (Ta=25°C)
Parameter
Forward voltage
Reverse current
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Conditions
Symbol
VF 1
VF 2
Min.
Typ.
Max.
Unit
-
-
0.30
0.50
V
V
IF=10mA
IF=200mA
IR1
-
-
70
μA
VR=25V
1/3
2012.09 - Rev.C
Data Sheet
RB495D
1
Ta=25℃
Ta=-25℃
0.01
CAPACITANCE BETWEEN
TERMINALS:Ct(pF)
REVERSE CURRENT:IR(uA)
Ta=75℃
1000
100
Ta=25℃
10
Ta=-25℃
1
10
0.1
0
100
200
300
400
500
FORWARD VOLTAGE:VF(mV)
VF-IF CHARACTERISTICS
0
600
5
10
15
20
25
30
35
1
40
0
200
360
350
340
AVE:359.0mV
330
160
140
120
100
80
60
AVE:33.62uA
40
REVERSE RECOVERY TIME:trr(ns)
1cyc
Ifsm
8.3ms
20
85
80
75
70
65
60
55
0
50
AVE:71.8pF
Ct DISPERSION MAP
20
30
25
90
IR DISPERSION MAP
30
15
10
5
AVE:12.50A
Ta=25℃
IF=0.5A
IR=1A
Irr=0.25*IR
n=10pcs
25
20
15
10
5
AVE:8.6ns
0
0
Ifsm
15
8.3ms 8.3ms
1cyc
10
5
0
1
trr DISPERSION MAP
IFSM DISRESION MAP
t
15
10
5
0
1
10
TIME:t(ms)
IFSM-t CHARACTERISTICS
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100
100
Per chip
Rth(j-a)
Rth(j-c)
100
Mounted on epoxy board
10
IM=1mA
1ms
IF=10mA
FORWARD POWER
DISSIPATION:Pf(W)
Ifsm
10
NUMBER OF CYCLES
IFSM-CYCLE CHARACTERISTICS
0.3
1000
TRANSIENT
THAERMAL IMPEDANCE:Rth (℃/W)
PEAK SURGE
FORWARD CURRENT:IFSM(A)
20
30
Ta=25℃
f=1MHz
VR=0V
n=10pcs
95
20
VF DISPERSION MAP
10
15
20
25
REVERSE VOLTAGE:VR(V)
VR-Ct CHARACTERISTICS
100
Ta=25℃
VR=25V
n=30pcs
180
REVERSE CURRENT:IR(uA)
Ta=25℃
IF=200mA
n=30pcs
CAPACITANCE BETWEEN
TERMINALS:Ct(pF)
380
370
5
REVERSE VOLTAGE:VR(V)
VR-IR CHARACTERISTICS
PEAK SURGE
FORWARD CURRENT:IFSM(A)
FORWARD CURRENT:IF(A)
Ta=125℃
0.1
10000
0.001
PEAK SURGE
FORWARD CURRENT:IFSM(A)
f=1MHz
Ta=125℃
Ta=75℃
FORWARD VOLTAGE:VF(mV)
100
100000
D=1/2
0.2
Sin(θ=180)
DC
0.1
time
300us
1
0.001
0
0.1
10
TIME:t(s)
Rth-t CHARACTERISTICS
2/3
1000
0
0.1
0.2
0.3
0.4
AVERAGE RECTIFIED
FORWARD CURRENT:Io(A)
Io-Pf CHARACTERISTICS
0.5
2012.09 - Rev.C
Data Sheet
RB495D
Per chip
Per chip
AVERAGE RECTIFIED
FORWARD CURRENT:Io(A)
REVERSE POWER
DISSIPATION:PR (W)
0.8
0.6
D=1/2
0.4
DC
Sin(θ=180)
0.2
0
0A
0V
0.4
DC
Io
t
T
VR
D=t/T
VR=20V
Tj=125℃
0.3
D=1/2
0.2
0.1
Sin(θ=180)
0
0
10
20
30
REVERSE VOLTAGE:VR(V)
VR-PR CHARACTERISTICS
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40
0.5
Per chip
AVERAGE RECTIFIED
FORWARD CURRENT:Io(A)
0.5
1
0A
0V
Io
t
0.4
DC
T
VR
D=t/T
VR=20V
Tj=125℃
0.3
D=1/2
0.2
0.1
Sin(θ=180)
0
0
25
50
75
100
AMBIENT TEMPERATURE:Ta(℃)
Derating Curve゙(Io-Ta)
3/3
125
0
25
50
75
100
CASE TEMPARATURE:Tc(℃)
Derating Curve゙(Io-Tc)
125
2012.09 - Rev.C
Notice
Notes
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R1120A