GLASS MINI-MELF Zener Diode ZMM5221B THRU ZMM5267B Formosa MS List List................................................................................................. 1 Package outline............................................................................... 2 Features.......................................................................................... 2 Mechanical data............................................................................... 2 Maximum ratings ............................................................................. 2 Electrical characteristics................................................................... 3 Rating and characteristic curves........................................................ 4.5 Pinning information........................................................................... 6 Suggested solder pad layout............................................................. 6 Packing information.......................................................................... 7 Reel packing.................................................................................... 8 Suggested thermal profiles for soldering processes............................. 8 High reliability test capabilities...........................................................9 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 1 Document ID Issued Date DS-221703 2008/02/10 Revised Date - Revision Page. A 9 Formosa MS GLASS MINI-MELF Zener Diode ZMM5221B THRU ZMM5267B 500mW Surface Mount Zener Diodes - 2.4V-75V Package outline Features SOD-80 • Silicon epitaxial planar chip structure. • Wide zener reverse voltage range 2.4V to 67V. • Small package size for high density applications. • Glass hermetically sealed package. • Ideally suited for automated assembly processes. • Lead-free parts meet environmental standards of .142(3.6) .134(3.4) MIL-STD-19500 /228 SOLDERABLE ENDS .019(.48) .011(.28) .063(1.6) .055(1.4) Mechanical data • Case : Glass Mini-Melf / SOD-80 • Terminals :Plated terminals, solderable per MIL-STD-750, Dimensions in inches and (millimeters) Method 2026 • Polarity : Indicated by cathode band • Mounting Position : Any • Weight : Approximated 0.03 gram Maximum ratings (at T =25 C unless otherwise noted) o A PARAMETER Forward voltage CONDITIONS I F = 200 mA DC MIN. TYP. VF Power Dissipation PD Storage temperature Operating temperature http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Symbol Page 2 MAX. UNIT 1.10 V 500 mW T STG -55 +150 o C TJ -65 +175 o C Document ID Issued Date DS-221703 2008/02/10 Revised Date - Revision Page. A 9 Electrical characteristics (at T =25 C unless otherwise noted) o A Part No. Marking code Zener voltage Test current Zener impedance V Z @ I ZT I ZT Z ZT @ I ZT Z ZK @ I ZK Leakage current I ZK Surge current IR VR I Surge mA Volts mA OHMs OHMs mA uA Volts ZMM5221B 2.4 20.0 30 1200 0.25 100 1.0 ZMM5222B 2.5 20.0 30 1250 0.25 100 1.0 ZMM5223B 2.7 20.0 30 1300 0.25 75 1.0 ZMM5224B 2.8 20.0 30 1400 0.25 75 1.0 ZMM5225B 3.0 20.0 30 1600 0.25 50 1.0 ZMM5226B 3.3 20.0 28 1600 0.25 25 1.0 ZMM5227B 3.6 20.0 24 1700 0.25 15 1.0 ZMM5228B 3.9 20.0 23 1900 0.25 10 1.0 ZMM5229B 4.3 20.0 22 2000 0.25 5.0 1.0 ZMM5230B 4.7 20.0 19 1900 0.25 5.0 2.0 ZMM5231B 5.1 20.0 17 1600 0.25 5.0 2.0 ZMM5232B 5.6 20.0 11 1600 0.25 5.0 3.0 ZMM5234B 6.2 20.0 7 1000 0.25 5.0 4.0 ZMM5235B 6.8 20.0 5 750 0.25 3.0 5.0 ZMM5236B 7.5 20.0 6 500 0.25 3.0 6.0 ZMM5237B 8.2 20.0 8 500 0.25 3.0 6.5 ZMM5238B 8.7 20.0 8 600 0.25 3.0 6.5 ZMM5239B 9.1 20.0 10 600 0.25 3.0 7.0 ZMM5240B 10 20.0 17 600 0.25 3.0 8.0 ZMM5241B 11 20.0 22 600 0.25 2.0 8.4 ZMM5242B 12 20.0 30 600 0.25 1.0 9.1 ZMM5243B 13 9.5 13 600 0.25 0.5 9.9 ZMM5244B 14 9.0 15 600 0.25 0.1 9.0 ZMM5245B 15 8.5 16 600 0.25 0.1 11 ZMM5246B 16 7.8 17 600 0.25 0.1 12 ZMM5247B 17 7.4 19 600 0.25 0.1 13 ZMM5248B 18 7.0 21 600 0.25 0.1 14 ZMM5249B 19 6.6 23 600 0.25 0.1 14 ZMM5250B 20 6.2 25 600 0.25 0.1 15 ZMM5251B 22 5.6 29 600 0.25 0.1 17 ZMM5252B 24 5.2 33 600 0.25 0.1 18 ZMM5253B 25 5.0 35 600 0.25 0.1 19 ZMM5254B 27 4.6 41 600 0.25 0.1 21 ZMM5255B 28 4.5 44 600 0.25 0.1 21 ZMM5256B 30 4.2 49 600 0.25 0.1 23 ZMM5257B 33 3.8 58 700 0.25 0.1 25 ZMM5258B 36 3.4 70 700 0.25 0.1 27 ZMM5259B 39 3.2 80 800 0.25 0.1 30 ZMM5260B 43 3.0 93 900 0.25 0.1 33 ZMM5261B 47 2.7 105 1000 0.25 0.1 36 ZMM5262B 51 2.5 125 1100 0.25 0.1 39 ZMM5263B 56 2.2 150 1300 0.25 0.1 43 ZMM5264B 60 2.1 170 1400 0.25 0.1 46 ZMM5265B 62 2.0 185 1400 0.25 0.1 47 ZMM5266B 68 1.8 230 1600 0.25 0.1 52 ZMM5267B 75 1.7 270 1700 0.25 0.1 56 Note : 5% tolerance of Zener voltage http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 3 Document ID Issued Date DS-221703 2008/02/10 Revised Date - Revision Page. A 9 Rating and characteristic curves (ZMM5221B THRU ZMM5267B) FIG.1-TOTAL POWER DISSIPATION VS. AMBIENT TEMPERATURE FIG. 2-TYPICAL CHANGE OF WORKING VOLTAGE o UNDER OPERATING CONDITIONS AT T A =25 C 1000 500 VOLTAGE CHANGE (mV) TOTAL POWER DISSIPATION (mW) 600 400 300 200 I Z = 5mA 100 10 100 0 0 0 40 80 120 160 200 0 5 o 15 20 25 ZENER VOLTAGE (V) FIG. 3-TYPICAL CHANGE OF WORKING VOLTAGE VS. JUNCTION TEMPERATURE FIG. 4-TEMPERATURE COEFFICIENT OF VZ VS. Z-VOLTAGE 15 -4 TEMPERATURE COEFFICIENT (10 / K) 1.3 RELATIVE VOLTAGE CHANGE 10 AMIBIENT TEMPERATURE ( C) 1.2 -4 10 x 10 /K -4 8 x 10 /K -4 6 x 10 /K 1.1 -4 4 x 10 /K -4 2 x 10 /K 0 -4 -2 x 10 /K -4 -4 x 10 /K 1.0 0.9 0.8 10 I Z = 5mA 5 0 -5 -60 0 60 120 180 240 0 o JUNCTION TEMPERATURE ( C) 10 20 30 40 50 ZENER VOLTAGE (V) FIG. 5-DIODE CAPACITANCE VS. Z-VOLTAGE DIODE CAPACITANCE (pF) 200 150 100 50 0 0 5 10 15 20 25 ZENER VOLTAGE (V) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 4 Document ID Issued Date DS-221703 2008/02/10 Revised Date - Revision Page. A 9 Rating and characteristic curves (ZMM5221B THRU ZMM5267B) FIG. 7-Z-CURRENT VS. Z-VOLTAGE 100 50 10 40 ZENER CURRENT (mA) FORWARD CURRENT (mA) FIG. 6-FORWARD CURRENT VS. FORWARD VOLTAGE 1 0.1 P tot = 500mW 30 20 10 0.01 0.001 0 0 0.2 0.4 0.6 0.8 1.0 15 25 30 35 ZENER VOLTAGE (V) FIG. 8-Z-CURRENT VS. Z-VOLTAGE FIG. 9-DIFFERENTIAL Z-RESISTANCE VS. Z-VOLTAGE 1000 DIFFERENTIAL Z-RESISTANCE (ohm) 100 80 P tot = 500mW 60 40 20 0 I Z = 1mA 100 I Z = 5mA 10 I Z = 10mA 1 0 4 8 12 16 20 0 5 ZENER VOLTAGE (V) 10 15 20 25 ZENER VOLTAGE (V) FIG. 10-THERMAL RESPONSE THERMAL RESISTANCE FOR PULSE Cond. (K/W) ZENER CURRENT (mA) 20 FORWARD VOLTAGE (V) 1000 t p / T= 0.5 100 t p / T= 0.2 Single Pulse t p / T= 0.01 10 t p / T= 0.1 t p / T= 0.02 t p / T= 0.05 1 0.1 1 10 100 1000 PULSE LENGTH (mS) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 5 Document ID Issued Date DS-221703 2008/02/10 Revised Date - Revision Page. A 9 GLASS MINI-MELF Zener Diode ZMM5221B THRU ZMM5267B Formosa MS Pinning information Pin Pin1 Pin2 Simplified outline cathode anode 1 Symbol 2 1 2 Suggested solder pad layout C A B Dimensions in inches and (millimeters) PACKAGE A B C SOD-80 0.071 (1.80) 0.035 (0.90) 0.102 (2.60) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 6 Document ID Issued Date DS-221703 2008/02/10 Revised Date - Revision Page. A 9 Formosa MS GLASS MINI-MELF Zener Diode ZMM5221B THRU ZMM5267B Packing information P0 P1 d E F B A W P D2 D1 T C W1 D unit:mm Item Symbol Tolerance SOD-80 Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 13" Reel inner diameter 7" Reel outside diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width Reel width A B C d D D1 D D1 D2 E F P P0 P1 T W W1 0.1 0.1 0.1 0.1 2.0 min 2.0 min 0.5 0.1 0.1 0.1 0.1 0.1 0.1 0.3 1.0 2.00 3.70 1.80 1.50 330.00 50.00 178.00 62.00 13.00 1.75 5.50 4.00 4.00 2.00 0.23 12.00 18.00 Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 7 Document ID Issued Date DS-221703 2008/02/10 Revised Date - Revision Page. A 9 GLASS MINI-MELF Zener Diode ZMM5221B THRU ZMM5267B Formosa MS Reel packing PACKAGE REEL SIZE 7" SOD-80 REEL (pcs) COMPONENT SPACING (m/m) 2500 4.0 25,000 REEL DIA, (m/m) INNER BOX (m/m) BOX (pcs) 185*120*180 178 CARTON SIZE (m/m) CARTON (pcs) 400*250*200 100,000 APPROX. GROSS WEIGHT (kg) 7.0 Suggested thermal profiles for soldering processes 1.Storage environment: Temperature=10 oC~35 oC Humidity=65%±15% 2.Reflow soldering of surface-mount devices Critical Zone T L to T P tP TP Ramp-up TL tL Temperature T smax T smin TS ts Preheat 25 Ramp-down t25 oC to Peak Wave Soldering IR Reflow Time 3.Flow (wave)soldering (solder dipping) Profile Feature Soldering Condition Average ramp-up rate(T L to TP ) <3oC/sec Preheat -Temperature Min(Tsmin) -Temperature Max(Tsmax) -Time(min to max)(t s ) 100oC 150oC 60~120sec Tsmax to TL -Ramp-upRate <3oC/sec Time maintained above: -Temperature(TL ) -Time(tL ) 183oC 60~150sec 255oC-0/+5 oC Peak Temperature(T P ) Time within 5 oC of actual Peak Temperature(tP ) 10~30sec Ramp-down Rate <6 oC/sec Time 25oC to Peak Temperature <6minutes http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 8 Document ID Issued Date DS-221703 2008/02/10 Revised Date - Revision Page. A 9 GLASS MINI-MELF Zener Diode ZMM5221B THRU ZMM5267B Formosa MS High reliability test capabilities Item Test Conditions Reference O 1. Solder Resistance at 260±5 C for 10±2sec. immerse body into solder 1/16"±1/32" MIL-STD-750D METHOD-2031 2. Solderability at 245±5 OC for 5 sec. MIL-STD-202F METHOD-208 3. High Temperature Reverse Bias V R=V Z at TA=150 OC for 168 hrs. MIL-STD-750D METHOD-1026 4. Forward Operation Life Rated zener current at T=25OC for 500hrs. MIL-STD-750D METHOD-1027 T A = 25OC, IF = 200mA On state: power on for 5 min. off state: power off for 5 min. on and off for 500 cycles. MIL-STD-750D METHOD-1036 5. Intermittent Operation Life 6. Pressure Cooker 15P SIG at TA=121 OC for 4 hrs. 7. Temperature Cycling -55 OC to +125OC dwelled for 30 min. and transferred for 5min. total 10 cycles. 8. Thermal Shock 9. Forward Surge 10. Humidity 11. High Temperature Storage Life 12. Solvent Resistance http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 MIL-STD-750D METHOD-1051 MIL-STD-750D METHOD-1056 0 OC for 5 min. rise to 100 OC for 5 min. total 10 cycles. MIL-STD-750D METHOD-4066-2 8.3ms single half sine-wave superimposed on rated load, one surge. at TA=65 OC, RH=98% for 1000hrs. MIL-STD-750D METHOD-1038 at 175OC for 1000 hrs. MIL-STD-750D METHOD-1031 Dip into Freon at 25OC for 1 min. MIL-STD-202F METHOD-215 Page 9 Document ID Issued Date DS-221703 2008/02/10 Revised Date - Revision Page. A 9