Formosa MS Glass Sealed SMD Switching Diode MCL4148 List List................................................................................................. 1 Package outline............................................................................... 2 Features.......................................................................................... 2 Mechanical data............................................................................... 2 Maximum ratings ............................................................................. 2 Rating and characteristic curves........................................................ 3 Pinning information........................................................................... 4 Marking........................................................................................... 4 Suggested solder pad layout............................................................. 4 Packing information.......................................................................... 5 Reel packing.................................................................................... 6 Suggested thermal profiles for soldering processes............................. 6 High reliability test capabilities........................................................... 7 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 1 Document ID Issued Date DS-221903 2008/02/10 Revised Date - Revision A Page. 7 Formosa MS Glass Sealed SMD Switching Diode MCL4148 150mA Surface Mount Switching Diode- 100V Package outline Features GLASS MICRO-MELF • Fast speed switching. • For general purpose switching application. • High conductance. • Hermetically sealed glass • Silicon epitaxial planar chip. • Lead-free parts meet RoHS requirments. .078(2.0) .070(1.8) SOLDERABLE ENDS .019(.48) .011(.28) .048(1.2) .040(1.0) ss (1 G la .3 5) .0 53 Mechanical data • Case : GLASS MICRO-MELF • Terminals : Solder plated, solderable per MIL-STD-750, Method 2026 • Polarity : Indicated by cathode band • Mounting Position : Any • Weight : Approximated 0.013 gram Dimensions in inches and (millimeters) Maximum ratings and Electrical Characteristics (AT PARAMETER CONDITIONS T A=25 oC unless otherwise noted) Symbol MIN. TYP. MAX. UNIT Repetitive peak reverse voltage V RRM 100 V Reverse voltage VR 75 V I FSM 500 mA Forward current IF 300 mA Average forward current I FAV 150 mA Power dissipation PV 500 mW Junction temperature TJ Peak forward surge current tp = 1 s Storage temperature Forward voltage T STG I F = 10 mA -55 -65 VF o C +150 o C 1.00 V IR 25 nA V R = 20 V , T J = 150 C IR 50 uA V R = 75 V IR 5.0 uA Diode capacitance V R = 0 V , f = 1MHz CD 4.0 pF Reverse recovery time I F = 10 mA , V R = 6V , I RR = 0.1 X I R , R L = 100Ω t rr 4.0 ns V R = 20 V Reverse current http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 o Page 2 0.86 +150 Document ID Issued Date DS-221903 2008/02/10 Revised Date - Revision A Page. 7 Rating and characteristic curves (MCL4148) Fig.1 ADMISSIBLE REPETITIVE PEAK FORWARD CURRENT VERSUS PULSE DURATION A 10 2 I v= tp / T T= 1/ fp tp I FRM I FRM t T 10 1 V= 0 V= 0. 1 V= 0. 2 10 0 V= 0. 3 -1 10 -5 10 10 -4 10 -3 10 -2 10 -1 10 0 10 S 1 tp Fig.2-DYNAMIC FORWARD RESISTANCE VERSUS FORWARD CURRENT 10 Fig.3 FORWARD CHARACTERISTICS 4 10 3 10 10 FORWARD CURRENT, mA FORWARD RESISTANCE, TJ= 25°C f=1KHz 3 2 10 1 0 10 -2 10 10 -1 10 0 10 1 10 10 2 10 1 10 0 10 -1 10 -2 2 0 1 2 FORWARD VOLTAGE, VOLTS FORWARD CURRENT, mA Fig.5 TYPICAL JUNCTION CAPACITANCE 5.0 TJ=25°C f=1KHz 500 CAPACITANCE, pF POWER DISSIPATION, mW Fig.4 DERATING CURVE 300 4.0 3.0 2.0 100 1.0 0 100 200 0 AMBIENT TEMPERATURE http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 2 4 6 8 1.0 R E V E R S E V O LTA G E , VO LT S Page 3 Document ID Issued Date DS-221903 2008/02/10 Revised Date - Revision A Page. 7 Formosa MS Glass Sealed SMD Switching Diode MCL4148 Pinning information Pin Pin1 Pin2 Simplified outline cathode anode 1 Symbol 2 1 2 Marking Type number Marking code MCL4148 cathode band only Suggested solder pad layout C A B Dimensions in inches and (millimeters) PACKAGE A B C MICRO-MELF 0.055(1.40) 0.024(0.60) 0.051(1.30) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 4 Document ID Issued Date DS-221903 2008/02/10 Revised Date - Revision A Page. 7 Formosa MS Glass Sealed SMD Switching Diode MCL4148 Packing information P0 P1 d E F B A W P D2 D1 T C W1 D unit:mm Symbol Tolerance Carrier width Carrier length Carrier depth Sprocket hole A B C d 0.1 0.1 0.1 0.1 2.00 3.70 1.80 1.50 7" Reel outside diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width Reel width D D1 D2 E F P P0 P1 T W W1 2.0 min 0.5 0.1 0.1 0.1 0.1 0.1 0.1 0.3 0.1 178.00 50.00 13.00 1.75 3.50 4.00 4.00 2.00 0.23 8.00 11.40 Item MICRO-MELF Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 5 Document ID Issued Date DS-221903 2008/02/10 Revised Date - Revision A Page. 7 Formosa MS Glass Sealed SMD Switching Diode MCL4148 Reel packing PACKAGE REEL SIZE REEL (pcs) COMPONENT SPACING (m/m) GLASS MICRO -MELF 7" 2,500 4.0 BOX (pcs) INNER BOX (m/m) 25,000 183*183*123 REEL DIA, (m/m) CARTON SIZE (m/m) CARTON (pcs) APPROX. GROSS WEIGHT (kg) 178 382*262*387 200,000 9.6 Suggested thermal profiles for soldering processes 1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%±25% 2.Reflow soldering of surface-mount devices Critical Zone TL to TP Tp TP Ramp-up TL TL Tsmax Temperature Tsmin tS Preheat Ramp-down 25 t25o C to Peak Time 3.Reflow soldering Profile Feature Soldering Condition Average ramp-up rate(T L to T P ) o <3 C /sec Preheat -Temperature Min(Tsmin) -Temperature Max(Tsmax) -Time(min to max)(t s ) 150 oC 200 oC 60~120sec Tsmax to T L -Ramp-upRate <3 oC/sec Time maintained above: -Temperature(T L ) -Time(t L ) 217 oC 60~260sec 255 oC-0/+5 oC Peak Temperature(T P ) Time within 5 oC of actual Peak Temperature(t P ) 10~30sec Ramp-down Rate <6 oC/sec Time 25 oC to Peak Temperature <6minutes http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 6 Document ID Issued Date DS-221903 2008/02/10 Revised Date - Revision A Page. 7 Formosa MS Glass Sealed SMD Switching Diode MCL4148 High reliability test capabilities Item Test Conditions Reference O 1. Solder Resistance at 260 ± 5 C for 10 ± 2sec. immerse body into solder 1/16"±1/32" MIL-STD-750D METHOD-2031 2. Solderability at 245±5 OC for 5 sec. MIL-STD-202F METHOD-208 3. High Temperature Reverse Bias V R=80% rate at T J=150 OC for 168 hrs. MIL-STD-750D METHOD-1038 4. Forward Operation Life Rated average rectifier current at T A=25 OC for 500hrs. MIL-STD-750D METHOD-1027 T A = 25 OC, I F = I O On state: power on for 5 min. off state: power off for 5 min. on and off for 500 cycles. MIL-STD-750D METHOD-1036 5. Intermittent Operation Life 6. Pressure Cooker JESD22-A102 15P SIG at T A=121 OC for 4 hrs. 7. Temperature Cycling -55 OC to +125 OC dwelled for 30 min. and transferred for 5min. total 10 cycles. 8. Thermal Shock 0 OC for 5 min. rise to 100 OC for 5 min. total 10 cycles. MIL-STD-750D METHOD-1056 9. Forward Surge Peak Forward Current t p = 1s MIL-STD-750D METHOD-4066-2 MIL-STD-750D METHOD-1051 at T A=85 OC, RH=85% for 1000hrs. MIL-STD-750D METHOD-1021 10. Humidity at 175 OC for 1000 hrs. MIL-STD-750D METHOD-1031 11. High Temperature Storage Life http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 7 Document ID Issued Date DS-221903 2008/02/10 Revised Date - Revision A Page. 7