Formosa MS Chip Zener Diode ZGFM206V8B THRU ZGFM20200B List List................................................................................................. 1 Package outline............................................................................... 2 Features.......................................................................................... 2 Mechanical data............................................................................... 2 Maximum ratings ............................................................................. 2 Electrical characteristics................................................................... 3 Rating and characteristic curves........................................................ 4~5 Pinning information........................................................................... 6 Suggested solder pad layout............................................................. 6 Packing information.......................................................................... 7 Reel packing.................................................................................... 8 Suggested thermal profiles for soldering processes............................. 8 High reliability test capabilities........................................................... 9 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 1 DS-121729 Issued Date 2009/02/10 Revised Date 2010/04/12 Revision B Page. 9 Formosa MS Chip Zener Diode ZGFM206V8B THRU ZGFM20200B 2.0W Surface Mount Zener Diodes - 6.8V-200V Package outline Features SMB • Batch process design, excellent power dissipation offers • • • • • • • 0.213(5.4) 0.197(5.0) better reverse leakage current and thermal resistance. Glass passivated chip junction. Standard zener voltage tolerance ±5%. Low inductance. Low profile package. Built-in strain relief. Lead-free parts meet environmental standards of MIL-STD-19500 /228 Suffix "-H" indicates Halogen-free part, ex.ZGFM206V8B-H. 0.016(0.4) Typ. 0.142(3.6) 0.126(3.2) 0.075(1.9) 0.067(1.7) Mechanical data • Epoxy:UL94-V0 rated flame retardant • Case : Molded plastic, DO-214AA / SMB • Terminals : Solder plated, solderable per 0.032(0.8) Typ. 0.032 (0.8) Typ. Dimensions in inches and (millimeters) MIL-STD-750, Method 2026 • Polarity : Indicated by cathode band • Mounting Position : Any • Weight : Approximated 0.09 gram Maximum ratings (at T =25 C unless otherwise noted) o A PARAMETER CONDITIONS Symbol MIN. TYP. MAX. UNIT Forward voltage I F = 200 mA VF 1.20 V Power Dissipation T L = 75 °C PD 2.0 W Operating temperature Storage temperature http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 TJ -55 +150 o C T STG -65 +175 o C Document ID Page 2 DS-121729 Issued Date 2009/02/10 Revised Date 2010/04/12 Revision B Page. 9 Formosa MS Chip Zener Diode ZGFM206V8B THRU ZGFM20200B Electrical characteristics (at T =25 C unless otherwise noted) o A Part No. Marking code Zener voltage Test current Zener impedance V Z @ I ZT (Volts) I ZT Z ZT @ I ZT Z ZK @ I ZK Leakage current I ZK IR VR Min. Nom. Max. mA (Ω)Max (Ω)Max mA (uA)Max Volts ZGFM206V8B 2Z6V8 6.46 6.8 7.14 73.5 2.0 700 1.00 5.0 4.0 ZGFM207V5B 2Z7V5 7.13 7.5 7.88 66.5 2.0 700 0.50 5.0 5.0 ZGFM208V2B 2Z8V2 7.79 8.2 8.61 61 2.0 700 0.50 5.0 6.0 ZGFM208V7B 2Z8V7 8.27 8.7 9.14 58 2.0 700 0.50 4.0 6.6 ZGFM209V1B 2Z9V1 8.65 9.1 9.56 55 3.0 700 0.50 3.0 7.0 ZGFM2010B 2Z10 9.50 10 10.50 50 4.0 700 0.50 3.0 7.6 ZGFM2011B 2Z11 10.45 11 11.55 45.5 4.0 700 0.25 1.0 8.4 ZGFM2012B 2Z12 11.40 12 12.60 41.5 4.5 700 0.25 1.0 9.1 ZGFM2013B 2Z13 12.35 13 13.65 38.5 5.0 700 0.25 0.5 9.9 ZGFM2015B 2Z15 14.25 15 15.75 33.4 7.0 700 0.25 0.5 11.4 ZGFM2016B 2Z16 15.20 16 16.80 31.2 8.0 700 0.25 0.5 12.2 ZGFM2018B 2Z18 17.10 18 18.90 27.8 10.0 750 0.25 0.5 13.7 ZGFM2020B 2Z20 19.00 20 21.00 25.0 11.0 750 0.25 0.5 15.2 ZGFM2022B 2Z22 20.90 22 23.10 22.8 12.0 750 0.25 0.5 16.7 ZGFM2024B 2Z24 22.80 24 25.20 20.8 13.0 750 0.25 0.5 18.2 20.6 ZGFM2027B 2Z27 25.65 27 28.35 18.5 18.0 750 0.25 0.5 ZGFM2030B 2Z30 28.50 30 31.50 16.6 20.0 1000 0.25 0.5 22.8 ZGFM2033B 2Z33 31.35 33 34.65 15.1 23.0 1000 0.25 0.5 25.4 ZGFM2036B 2Z36 34.20 36 37.80 13.9 25.0 1000 0.25 0.5 27.4 ZGFM2039B 2Z39 37.05 39 40.95 12.8 30.0 1500 0.25 0.5 29.7 32.7 ZGFM2043B 2Z43 40.85 43 45.15 11.6 35.0 1500 0.25 0.5 ZGFM2047B 2Z47 44.65 47 49.35 10.6 40.0 1500 0.25 0.5 35.8 ZGFM2051B 2Z51 48.45 51 53.55 9.8 48.0 1500 0.25 0.5 38.8 ZGFM2056B 2Z56 53.20 56 58.80 9.0 55.0 2000 0.25 0.5 42.6 ZGFM2062B 2Z62 58.90 62 65.10 8.1 60.0 2000 0.25 0.5 47.1 ZGFM2068B 2Z68 64.60 68 71.40 7.4 75.0 2000 0.25 0.5 51.7 ZGFM2075B 2Z75 71.25 75 78.75 6.7 90.0 2000 0.25 0.5 56.0 ZGFM2082B 2Z82 77.90 82 86.10 6.1 100 3000 0.25 0.5 62.2 ZGFM2091B 2Z91 86.45 91 95.55 5.5 125 3000 0.25 0.5 69.2 ZGFM20100B 2Z100 95.00 100 105.0 5.0 175 3000 0.25 0.5 76.0 ZGFM20110B 2Z110 104.50 110 115.5 4.5 250 4000 0.25 0.5 83.6 ZGFM20120B 2Z120 114.00 120 126.0 4.2 325 4500 0.25 0.5 91.2 ZGFM20130B 2Z130 123.50 130 136.5 3.8 400 5000 0.25 0.5 98.8 ZGFM20150B 2Z150 142.50 150 157.5 3.3 575 6000 0.25 0.5 114.0 ZGFM20160B 2Z160 152.00 160 168.0 3.1 650 6500 0.25 0.5 121.6 ZGFM20180B 2Z180 171.00 180 189.0 2.8 725 7000 0.25 0.5 136.8 ZGFM20200B 2Z200 190.00 200 210.0 2.5 900 8000 0.25 0.5 152.0 Note : 5% tolerance of Zener voltage for suffix "B" ex: ZGFM206V8B is 6.8V 5% http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 3 DS-121729 Issued Date 2009/02/10 Revised Date 2010/04/12 Revision B Page. 9 Rating and characteristic curves (ZGFM206V8B THRU ZGFM20200B) JL ( t,D )TRANSIENT THERMAL RESISTANCE JUNCTION-TO-LEAD ( J / W ) FIG.1 Typical Thermal Response L 30 20 D=0.5 10 7 0.2 PPK 5 0.1 t1 3 0.05 t2 1 NOTE BELOW 0.1 SECOND, THERMAL RESPONSE CURVE IS APPLICABLE TO ANY LEAD LENGTH(L) 0.02 0.7 0.5 SINGLE PULSE TJL=JL(t)PPK REPETITIVE LULSES TJL=JL(t,D)PPK D=0 0.01 0.3 0.0001 DUTY CYCLE, D=t1 t2 0.0002 0.0005 0.001 0.002 0.005 0.01 0.02 0.05 0.1 0.2 Fig. 2 Maximum Surge Power 0.5 1 2 5 10 Fig. 3 Maximum Surge Power IR, REVERSE LEADAGE, (uAdc) @VR AS SPECIFIED IN ELEC. CHAR. TABLE 500 150 RECTANGULAR NONREPETITIVE WAVEFORM TJ=25 PRIOR TO INITIAL PULSE 100 50 30 20 10 0.1 0.05 0.03 0.02 0.01 0.005 0.003 0.002 0.001 0.0005 0.0003 0.0002 0.0001 1 2 5 10 20 50 100 200 500 1K NOMINAL VZ, (V) 10 20 30 50 70 100 P.W. PULSE WIDTH, (ms) FIG.4 Units To 200 Volts Fig 5. Units To 12 Volts 200 8 100 VZ, TEMPERATURE COEFFICIENT (mV/°C)@IZT VZ, TEMPERATURE COEFFICIENT, ( mV/°C )@IZT PPK, PEAK SURGE POWER, ( W ) 250 RANGE 50 40 30 20 6 4 2 0 -2 -4 10 0 20 40 60 80 100 120 140 160 180 200 VZ, ZENER VOLTAGE@IZT, (V) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 3 4 6 8 10 12 VZ, ZENER VOLTAGE@IZT, (V) Document ID Page 4 DS-121729 Issued Date 2009/02/10 Revised Date 2010/04/12 Revision B Page. 9 Rating and characteristic curves (ZGFM206V8B THRU ZGFM20200B) FIG.6 VZ = 3.9 Thru 10 Volts FIG.7 VZ = 12 Thru 82 Volts 100 100 50 30 20 IZ, ZENER CURRENT ( mA ) IZ, ZENER CURRENT ( mA ) 50 10 5 3 2 1 0.5 0.3 30 20 10 5 3 2 1 0.5 0.3 0.2 0.2 0.1 0.1 0 1 2 3 4 5 6 7 8 9 0 10 10 20 30 40 VZ, ZENER VOLTAGE, (V) 50 60 70 80 90 100 VZ, ZENER VOLTAGE, (V) Fig. 8 VZ = 100 Thru 200 Volts Fig. 9 Typical Thermal Resistance 100 30 20 10 5 3 2 1 0.5 0.3 0.2 0.1 100 120 140 160 180 200 JL, JUNCTION-LEAD THERMAL RESISTANCE ( J / W ) IZ, ZENER CURRENT ( mA ) 50 80 PRIMARY PATH OF CONDUCTION IS THROUGH THE CATHODE LEAD 70 60 50 40 30 20 10 0 0 1/8 1/4 3/8 1/2 5/8 3/4 7/8 Revised Date Revision 1 VZ, ZENER VOLTAGE, (V) NOMINAL VZ, (V) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 5 DS-121729 Issued Date 2009/02/10 2010/04/12 B Page. 9 Formosa MS Chip Zener Diode ZGFM206V8B THRU ZGFM20200B Pinning information Pin Pin1 Pin2 Simplified outline cathode anode 1 Symbol 2 1 2 Suggested solder pad layout C A B Dimensions in inches and (millimeters) PACKAGE A B C SMB 0.142 (3.60) 0.059 (1.50) 0.118 (3.00) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 6 DS-121729 Issued Date 2009/02/10 Revised Date 2010/04/12 Revision B Page. 9 Formosa MS Chip Zener Diode ZGFM206V8B THRU ZGFM20200B Packing information P0 P1 d E F B A W P D2 D1 T C W1 D unit:mm Item Symbol Tolerance SMB Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 13" Reel inner diameter 7" Reel outside diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width Reel width A B C d D D1 D D1 D2 E F P P0 P1 T W W1 0.1 0.1 0.1 0.1 2.0 min 2.0 min 0.5 0.1 0.1 0.1 0.1 0.1 0.1 0.3 1.0 3.81 5.74 2.24 1.50 330.00 50.00 178.00 62.00 13.00 1.75 5.50 8.00 4.00 2.00 0.23 12.00 18.00 Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 7 DS-121729 Issued Date 2009/02/10 Revised Date 2010/04/12 Revision B Page. 9 Formosa MS Chip Zener Diode ZGFM206V8B THRU ZGFM20200B Reel packing PACKAGE SMB REEL SIZE 13" REEL (pcs) COMPONENT SPACING (m/m) BOX (pcs) INNER BOX (m/m) REEL DIA, (m/m) 4,000 8.0 8,000 337*337*37 330 CARTON SIZE (m/m) 350*330*360 CARTON (pcs) APPROX. GROSS WEIGHT (kg) 16.9 64,000 Suggested thermal profiles for soldering processes 1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%±25% 2.Reflow soldering of surface-mount devices Critical Zone TL to TP Tp TP Ramp-up TL TL Tsmax Temperature Tsmin tS Preheat Ramp-down 25 t25o C to Peak Time 3.Reflow soldering Profile Feature Soldering Condition Average ramp-up rate(T L to T P ) o <3 C /sec Preheat -Temperature Min(Tsmin) -Temperature Max(Tsmax) -Time(min to max)(t s ) 150 oC 200 oC 60~120sec Tsmax to T L -Ramp-upRate <3 oC/sec Time maintained above: -Temperature(T L ) -Time(t L ) 217 oC 60~260sec 255 oC-0/+5 oC Peak Temperature(T P ) Time within 5 oC of actual Peak Temperature(t P ) 10~30sec Ramp-down Rate <6 oC/sec Time 25 oC to Peak Temperature <6minutes http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 8 DS-121729 Issued Date 2009/02/10 Revised Date 2010/04/12 Revision B Page. 9 Formosa MS Chip Zener Diode ZGFM206V8B THRU ZGFM20200B High reliability test capabilities Item Test Conditions Reference O 1. Solder Resistance at 260 ± 5 C for 10 ± 2sec. immerse body into solder 1/16"±1/32" MIL-STD-750D METHOD-2031 2. Solderability at 245±5 OC for 5 sec. MIL-STD-202F METHOD-208 3. High Temperature Reverse Bias V R=80% rate at T J=150 OC for 168 hrs. MIL-STD-750D METHOD-1038 4. Pressure Cooker 15P SIG at T A=121 OC for 4 hrs. JESD22-A102 5. Temperature Cycling -55 OC to +125 OC dwelled for 30 min. and transferred for 5min. total 10 cycles. MIL-STD-750D METHOD-1051 0 OC for 5 min. rise to 100 OC for 5 min. total 10 cycles. MIL-STD-750D METHOD-1056 at T A=85 OC, RH=85% for 1000hrs. MIL-STD-750D METHOD-1021 at 175 OC for 1000 hrs. MIL-STD-750D METHOD-1031 6. Thermal Shock 7. Humidity 8. High Temperature Storage Life http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 9 DS-121729 Issued Date 2009/02/10 Revised Date 2010/04/12 Revision B Page. 9