Eon Silicon Solution Inc. Application Note EON EN25F16 vs MXIC MX25L1605D Specification Comparison This Application Note may be revised by subsequent versions or modifications due to changes in technical specifications. 1 ©2005 Eon Silicon Solution Inc. Rev. A, Issue Date: 2010/ 01/11 www.eonssi.com Eon Silicon Solution Inc. 1. INTRODUCTION The application note introduces how to implement a system design from MXIC MX25L1605D Flash to Eon EN25F16 Flash. 2. GENERAL FUNCTION COMPARISON TABLE: 2.1 The following table highlights the major features of these two devices. Features EN25F16 2.7 ~ 3.6 8-pins SOP 150mil 8-pins SOP 200mil 8 contact VDFN 8-pins DIP MX25L1605D 2.7 ~ 3.6 8-pins SOP 150mil 8-pins SOP 200mil 8-land WSON (6mmx5mm) 8-pins DIP 100MHz 86MHz 128 Byte 512 bit Uniform 512 Sectors of 4 K byte 32 Blocks of 64 K byte Mode 0 / Mode 3 Uniform 512 Sectors of 4 K byte 32 Blocks of 64 K byte Mode 0 / Mode 3 Minimum Endurance Cycle 100K 100K Package 8-pins SOP 150mil 8-pins SOP 200mil 8 contact VDFN 8-pins DIP 8-pins SOP 150mil 8-pins SOP 200mil 16-pins SOP 300mil 8-land WSON (6mmx5mm) 8-land USON (4mmx4mm) 8-pins DIP Voltage Range Pin to Pin Compatible (standard SPI mode) SPI frequency (standard mode) Secured Silicon Sector Region Sector Architecture SPI mode This Application Note may be revised by subsequent versions or modifications due to changes in technical specifications. 2 ©2005 Eon Silicon Solution Inc. Rev. A, Issue Date: 2010/ 01/11 www.eonssi.com Eon Silicon Solution Inc. 3. HARDWARE CONSIDERATIONS 3.1 ICC comparison EN25F16 MX25L1605D Read ICC3 Max ( @ 100MHz) 25 Max ( @ 86MHz) 25 Page Program (PP) ICC4 28 20 mA Sector Erase (SE) ICC6 25 20 mA Standby ICC1 20 20 μA Current Unit mA 3.2 Pin Configuration (8-pin package) Pin number Pin1 Pin2 Pin3 Pin4 Pin5 Pin6 Pin7 Pin8 EN25F16 CS# DO WP# VSS DI CLK HOLD# VCC MX25L1605D CS# SO / SIO1 WP# / ACC GND SI / SIO0 SCLK HOLD# VCC Note: 1. Eon EN25F16 Flash can support the general standard SPI mode but don’t support the acceleration (ACC) pin function. 2. For the general standard SPI mode, Eon EN25F16 Flash is the same as MXIC MX25L1605D Flash if customer don’t use the accelerated (ACC) pin function. This Application Note may be revised by subsequent versions or modifications due to changes in technical specifications. 3 ©2005 Eon Silicon Solution Inc. Rev. A, Issue Date: 2010/ 01/11 www.eonssi.com Eon Silicon Solution Inc. 4. SOFTWARE CONSIDERATIONS 4.1 Manufacturer, Memory Type & Device Identification (M7~M0: manufacture ID, D15~ID0: memory type, ID7~ID0: memory density) comparison. For EN25F16 For MX25L1605D This Application Note may be revised by subsequent versions or modifications due to changes in technical specifications. 4 ©2005 Eon Silicon Solution Inc. Rev. A, Issue Date: 2010/ 01/11 www.eonssi.com Eon Silicon Solution Inc. 4.2. Instruction Set Comparison 4.2.1 Different Block Protection Area EN25F16： MX25L1605D： This Application Note may be revised by subsequent versions or modifications due to changes in technical specifications. 5 ©2005 Eon Silicon Solution Inc. Rev. A, Issue Date: 2010/ 01/11 www.eonssi.com Eon Silicon Solution Inc. 4.2.2 Different RDSR bit definition EN25F16： S5 and S6 are reserved. MX25L1605D： Bit 5 is used for BP3 (level of protected block). Bit 6 is used for continuously program mode status. 4.2.3 Security Register Definition EN25F16: No support. MX25L1605D：Support. 4.2.4 2READ (2 x I/O) read commands EN25F16: No support. MX25L1605D：Support. (BBh) This Application Note may be revised by subsequent versions or modifications due to changes in technical specifications. 6 ©2005 Eon Silicon Solution Inc. Rev. A, Issue Date: 2010/ 01/11 www.eonssi.com Eon Silicon Solution Inc. 4.2.5 CP (Continuously Program mdoe) command EN25F16: No support. MX25L1605D：Support. (ADh) 4.2.6 RES (Read electronic ID) command EN25F16: No support. MX25L1605D：Support. (ABh) 4.2.7 REMS2 (Read ID for 2x I/O mode) command EN25F16: No support. MX25L1605D：Support. (EFh) 4.2.8 Enter Secured OTP command EN25F16: Support. (3Ah) MX25L1605D：Support. (B1h) 4.2.9 Exit Secured OTP command EN25F16: Support. (04h) MX25L1605D：Support. (C1h) 4.2.10 Secured OTP Addresses EN25F16: MX25L1605D： This Application Note may be revised by subsequent versions or modifications due to changes in technical specifications. 7 ©2005 Eon Silicon Solution Inc. Rev. A, Issue Date: 2010/ 01/11 www.eonssi.com Eon Silicon Solution Inc. 4.2.11 RDSCUR (Read Security register) command EN25F16: No support. MX25L1605D：Support. (2Bh) 4.2.12 WRSCUR (Write Security register) command EN25F16: No support. MX25L1605D：Support. (2Fh) 4.2.13 ESRY (Enable SO to output RY/BY#) command EN25F16: No support. MX25L1605D：Support. (70h) 4.2.14 DSRY (Disable SO to output RY/BY#) command EN25F16: No support. MX25L1605D：Support. (80h) This Application Note may be revised by subsequent versions or modifications due to changes in technical specifications. 8 ©2005 Eon Silicon Solution Inc. Rev. A, Issue Date: 2010/ 01/11 www.eonssi.com Eon Silicon Solution Inc. 5. PERFORMANCE DIFFERENCES 5.1 ERASE AND PROGRAM PERFORMANCE The erasing and programming performance comparison. EN25F16 Parameter MX25L1605D Unit Typ Max Typ Max Block Erase Time 0.4 2 0.7 2 sec Sector Erase Time 0.09 0.3 0.06 0.3 sec 7 35 14 30 sec 1.3 5 1.4 5 ms Chip (Bulk) Erase Time Page Programming Time 5.2 KEY AC PARAMETER PERFORMANCE EN25F16 MX25L1605D tCH (serial clock high time) Min @ 4ns Min @ 5.5ns tCL (serial clock low time) Min @ 4ns Min @ 5.5ns tCLCH(serial clock rise time) Min @ 0.1V / ns Min @ 0.1V / ns tCLCL(serial clock fall time) Min @ 0.1V / ns Min @ 0.1V / ns Min@ 5ns Min @ 5ns Min @ 100ns Min @ 40ns tDSU(Data in setup time) Min @ 2ns Min @ 2ns tDH(Data in hold time) Min @ 5ns Min @ 5ns Parameter tCHSH(CS# active setup / hold time) tSHSL(CS# high time) This Application Note may be revised by subsequent versions or modifications due to changes in technical specifications. 9 ©2005 Eon Silicon Solution Inc. Rev. A, Issue Date: 2010/ 01/11 www.eonssi.com Eon Silicon Solution Inc. Revisions List Revision No Description Date A 2010/01/11 Initial Release This Application Note may be revised by subsequent versions or modifications due to changes in technical specifications. 10 ©2005 Eon Silicon Solution Inc. Rev. A, Issue Date: 2010/ 01/11 www.eonssi.com