MYX4DDR264M16HW 1Gb - 64M x 16 DDR2 SDRAM Advanced information. Subject to change without notice. Features • Tin-lead ball metalurgy Options • VDD = 1.8V ±0.1V, VDDQ = 1.8V ±0.1V Code • Configuration • JEDEC-standard 1.8V I/O (SSTL_18-compatible) 64M x 16 (8M x 16 x 8 banks) • Differential data strobe (DQS, DQS#) option • Package: FBGA (Sn63 Pb37) • 4n-bit prefetch architecture 84-ball FBGA (8mm x 12.5mm) Die Rev :H 84-ball FBGA (8mm x 12.5mm) Die Rev :M • Duplicate output strobe (RDQS) option for x8 • DLL to align DQ and DQS transitions with CK • 8 internal banks for concurrent operation • Programmable CAS latency (CL) 64M16 BG HR NF • Timing - cycle time • Posted CAS additive latency (AL) 2.5ns @ CL = 5 (DDR2-800) • WRITE latency = READ latency - 1 tCK • Selectable burst lengths (BL): 4 or 8 -25E • Self refresh • Adjustable data-output drive strength Standard Low-power • 64ms, 8192-cycle refresh • On-die termination (ODT) None L • Operating temperature • Supports JEDEC clock jitter specification Industrial (-40°C ≤ TC ≤ +95°C; -40°C ≤ TA ≤ +85°C;) Military (-55°C ≤ TC ≤ +125°C) • 8D response time IT XT • Part Marking: Label (L), Dot (D) Table 1: Key Timing Parameters Data Rate (MT/s) Speed Grade -25E tRC CL=3 CL=4 CL=5 CL=6 CL=7 400 533 800 800 n/a (ns) 55 Micron Part No. MT47H64M16HR, Die Rev:H (NOTE: for IT Temp) Micron Part No. MT47H64M16NF, Die Rev:M (NOTE: for XT Temp) March 29, 2016 • Revision 2.6 Micross US (Americas) 407.298.7100 • Micross UK (EMEA & ROW) +44 (0) 1603 788967 • [email protected] • www.micross.com Form #: CSI-D-686 Document 005 MYX4DDR264M16HW • 1Gb - 64M x 16 DDR2 SDRAM Advanced information. Subject to change without notice. 1Gb: x4, x8, x16 DDR2 SDRAM Ball Assignments and Descriptions Figure 7: 84-Ball FBGA – x16 Ball Assignments View) Figure (Top 1: 84-Ball FBGA - x16 Ball Assignments (Top View) A B C D E F G H J K L 1 2 3 V DD NC DQ14 7 8 V SS V SSQ UDQS#/NU V DDQ V SSQ UDM UDQS V SSQ DQ15 V DDQ DQ9 V DDQ V DDQ DQ8 V DDQ DQ12 V SSQ DQ11 DQ10 V SSQ DQ13 V DD NC V SS V SSQ LDQS#/NU V DDQ DQ6 V SSQ LDM LDQS V SSQ DQ7 V DDQ DQ1 V DDQ V DDQ DQ0 V DDQ DQ4 V SSQ DQ3 DQ2 V SSQ DQ5 V DDL V REF V SS V SSDL CK V DD CKE WE# RAS# CK# ODT BA0 BA1 CAS# CS# A10 A1 A2 A0 A3 A5 A6 A4 A7 A9 A11 A8 A12 RFU RFU RFU BA2 4 5 6 9 M N P V SS R V DD V DD V SS March 29, 2016 • Revision 2.6 Micross US (Americas) • 407.298.7100 Micross UK (EMEA & ROW) • +44 (0) 1603 788967 [email protected] www.micross.com Form #: CSI-D-686 Document 005 Packaging Package Dimensions MYX4DDR264M16HW • 1Gb - 64M x 16 DDR2 SDRAM Figure 8: 84-Ball FBGA to Package x 12.5mm) Advanced information. Subject change(8mm without notice. – x16 0.155 Seating plane A 1.8 CTR 0.12 A Nonconductive Figure 2: Package Dimensions 84-Ball FBGA Package (8mm x 12.5mm) – x16; “HR” Die Rev:H overmold 1Gb: x4, x8, x16 DDR2 SDRAM 84X Ø0.45 Dimensions apply Packaging to solder balls post-reflow on Ø0.35 SMD ball pads. Packaging 9 8 7 3 2 1 Package Dimensions A B C D E F G H J K L M N P R Figure 8: 84-Ball FBGA Package (8mm x 12.5mm) – x16 12.5 ±0.1 0.155 11.2 CTR Seating plane A 1.8 CTR Nonconductive overmold Ball A1 ID Ball A1 ID 0.12 A Packaging 0.8 TYP 1Gb: x8, x16 Automotive DDR2 SDRAM Packaging Package Dimensions 84X Ø0.45 Dimensions apply to solder balls post-reflow on Ø0.35 SMD ball pads. 1.1 ±0.1 0.8 TYP Ball A1 ID 9 8 7 Ball A1 ID Figure 7: 84-Ball FBGA Package (8mm x 12.5mm) – x16; "NF" Die Rev :M 0.25 MIN 6.4 CTR 0.155 3 2 1 Exposed gold plated pad 1.0 MAX X 0.7 nominal. 8 ±0.1 A B C D E F G H J K L M N P R Notes: Seating plane 1. All dimensions are in millimeters. 2. Solder ball material: SAC305 (96.5% Sn, 3% Ag, 0.5% Cu) or leaded Eutectic (62% Sn, 36%Pb, 2% Ag). A 0.12 A 1.8 CTR Figure 3: Package Dimensions 84-Ball FBGA Package (8mm x 12.5mm) – x16; “NF” Die Rev:M 12.5 ±0.1 11.2 CTR Packaging 0.8 TYP Nonconductive overmold 84X Ø0.47 PDF: 09005aef821ae8bf 1Gb: x8, x16 Automotive DDR2 SDRAM 1GbDDR2.pdf – Rev. X 10/11 EN Dimensions apply Packaging to solder balls 19 post-reflow on Ø0.42 SMD ball pads. 9 8 7 A B C D E F G H J K L M N P R 1.1 ±0.1 Figure 7: 84-Ball FBGA Package (8mm x 12.5mm) – x16; "NF" Die Rev :M 0.25 MIN 12.5 ±0.1 Exposed gold plated pad 8 ±0.1 1.0 MAX X 0.7 nominal. 11.2 CTR Seating plane 1. All dimensions are in millimeters. 2. Solder ball material: SAC305 (96.5% Sn, 3% Ag, 0.5% Cu) or leaded Eutectic (62% Sn, 36%Pb, 2% Ag). A 0.12 A 1.8 CTR 0.8 TYP Nonconductive 6.4 CTR 0.155 Notes: overmold 84X Ø0.47 Dimensions apply to solder balls post-reflow on Ø0.42 SMD ball pads. 9 8 7 19 DF: 09005aef821ae8bf GbDDR2.pdf – Rev. X 10/11 EN Micron Technology, Inc. reserves the right to change products or specifications without notice. 2007 Micron Technology, Inc. All rights reserved. 6.4 CTR 3 2 1 11.2 CTR March 29, 2016 • Revision 2.6 0.8 TYP 0.8 TYP 0.28 MIN 8 ±0.1 Notes: 1. All dimensions are in millimeters. 2. Solder ball material: Sn63/Pb37 12.5 ±0.1 1.1 ±0.1 0.8 TYP Ball A1 ID Ball A1 ID (covered by SR) A B C D E F G H J K L M N P R Ball A1 ID 3 2 1 Package Dimensions 0.8 TYP Micron Technology, Inc. reserves the right to change products or specifications without notice. 2007 Micron Technology, Inc. All rights reserved. Ball A1 ID (covered by SR) Notes: PDF: 09005aef85a711f4 1gb_ddr2_ait-aat_u88b.pdf – Rev. B 10/14 EN 1. All dimensions are in millimeters. 2. Solder ball material: SAC305 (96.5% Sn, 3% Ag, 0.5% Cu). 17 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2014 Micron Technology, Inc. All rights reserved. Micross US (Americas) • 407.298.7100 Micross UK (EMEA & ROW) • +44 (0) 1603 788967 1.1 ±0.1 [email protected] www.micross.com Form #: CSI-D-686 Document 005