TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3031 Series SP3031 Series 0.8pF 10kV Unidirectional Discrete TVS RoHS Pb GREEN Description The SP3031 includes low capacitance rail to rail diodes with an additional Zener diode to provide protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes above the maximum level specified in the IEC61000-4-2 international standard without performance degradation. The low loading capacitance makes it ideal for protecting high speed data lines. Pinout Features 1 • ESD protection of ±10kV contact discharge, ±15kV air discharge, (IEC61000-4-2) • Low capacitance of 0.8pF @ VR=0V • EFT, IEC61000-4-4, 40A (5/50ns) • 0402 small footprint available • L ow leakage current of 1μA at 5V • L ightning protection, IEC61000-4-5, 5A (tp=8/20µs) 2 Applications Functional Block Diagram 1 • USB 2.0, Ethernet • Smart Phones • MHL/MIPI/MDDI • External Storage • HDMI, Display Port, eSATA • Ultrabooks, Notebooks • Tablets, eReaders • Set Top Boxes, Game Consoles USB2.0 Application Example 2 USB2.0 Port USB Controller VBUS D+ Additional Information DSP1003 IC Datasheet Resources Samples SP3031 (x2) *Package is shown as transparent Life Support Note: Not Intended for Use in Life Support or Life Saving Applications Signal GND The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/26/15 TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3031 Series Symbol IPP Parameter Parameter Value Units Peak Current (tp=8/20μs) 5.0 A Storage Temperature Range °C Maximum Junction Temperature °C Maximum Lead Temperature (Soldering 20-40s) TOP Operating Temperature TSTOR Storage Temperature –40 to 125 –55 to 150 Rating Units –55 to 150 °C 150 °C 260 °C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (TOP=25ºC) Parameter Symbol Reverse Standoff Voltage Test Conditions Min 6.0 Typ Max VRWM 5.0 Reverse Breakdown Voltage VBR 1R=1mA Reverse Leakage Current ILEAK VR=5V with 1pin at GND Clamp Voltage1 VC Dynamic Resistance Diode Capacitance1 1 µA 6.9 V IPP=2A, tp=8/20µs, Fwd 7.5 V (VC2-VC1)/(IPP2-IPP1) VESD V V IPP=1A, tp=8/20µs, Fwd RDYN ESD Withstand Voltage1 Units 0.6 IEC61000-4-2 (Contact) ±10 IEC61000-4-2 (Air) ±15 CI/O-I/O Ω kV kV Reverse Bias=0V 0.8 pF Note: 1. Parameter is guaranteed by design and/or device characterization. Capacitance vs. Reverse Voltage 0 1.2 -5 1.0 Capacitance (pF) Attenuation (dB) Insertion Loss (S21) I/O to GND -10 -15 -20 -25 0.8 0.6 0.4 0.2 -30 0.0 -35 10 100 Frequency (MHz) 0.0 1000 1.0 2.0 3.0 DC Bias (V) Pulse Waveform Transmission Line Pulsing(TLP) Plot 110% 100% TLP Current (A) 90% Percent of IPP 80% 70% 60% 50% 40% 30% 20% 10% 0% 0.0 5.0 10.0 15.0 Time (μs) © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/26/15 20.0 25.0 30.0 TLP Voltage (V) 4.0 5.0 SP3031 Thermal Information Absolute Maximum Ratings TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3031 Series Product Characteristics Ordering Information Lead Plating Pre-Plated Frame or Matte Tin Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Substitute Material Silicon Body Material Molded Epoxy Flammability UL 94 V-0 Part Number Package Marking Min. Order Qty. SP3031-01ETG SOD882 •f 12000 Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13. Soldering Parameters Pre Heat Pb – Free assembly - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C Part Numbering System tP TP Temperature Reflow Condition TL TS(max) tL Ramp-do Ramp-down Preheat TS(min) 25 tS time to peak temperature SOD882 G= Green f T= Tape & Reel Series Number of Channels Time Part Marking System SP 3031 – 01 E T G TVS Diode Arrays (SPA® Diodes) Critical Zone TL to TP Ramp-up Pin 1 Indicator Product ID Package E: SOD882 © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/26/15 TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3031 Series Package Dimensions — SOD882 Symbol 0.325 0.325 0.650 Package SOD882 JEDEC MO-236 Millimeters Inches Min Typ Max Min Typ Max A 0.90 1.00 1.10 0.035 0.039 0.043 B 0.50 0.60 0.70 0.020 0.024 0.028 C 0.40 0.50 0.60 0.016 0.020 0.024 0.45 D 0.018 0.650 E 0.20 0.25 0.35 0.008 0.010 0.012 0.975 F 0.45 0.50 0.55 0.018 0.020 0.022 Recommanded Soldering Pad Layout Embossed Carrier Tape & Reel Specification — SOD882 D evice Orientation in Tape Pin 1 Location Notes : 1. All dimensions are in millimeters © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/26/15 Symbol Millimeters A0 0.70±0.045 B0 1.10±0.045 K0 0.65±0.045 F 3.50±0.05 P1 2.00±0.10 W 8.00 + 0.30 -0.10