AOSMD AO4455

AOS Semiconductor
Product Reliability Report
AO4455,
rev A
Plastic Encapsulated Device
ALPHA & OMEGA Semiconductor, Inc
www.aosmd.com
This AOS product reliability report summarizes the qualification result for AO4455.
Accelerated environmental tests are performed on a specific sample size, and then followed
by electrical test at end point. Review of final electrical test result confirms that AO4455
passes AOS quality and reliability requirements. The released product will be categorized by
the process family and be monitored on a quarterly basis for continuously improving the
product quality.
Table of Contents:
I.
II.
III.
IV.
Product Description
Package and Die information
Environmental Stress Test Summary and Result
Reliability Evaluation
I. Product Description:
The AO4455 uses advanced trench technology to provide excellent RDS(ON), and ultra-low low
gate charge with a 25V gate rating. This device is suitable for use as a load switch or in PWM
applications.
-RoHS Compliant
-Halogen Free
Detailed information refers to datasheet.
II. Die / Package Information:
AO4455
Standard sub-micron
30V P-Channel MOSFET
Package Type
SO8
Lead Frame
Cu
Die Attach
Ag epoxy
Bonding
Cu wire
Mold Material
Epoxy resin with silica filler
MSL (moisture sensitive level) Level 1 based on J-STD-020
Note * based on information provided by assembler and mold compound supplier
Process
III. Result of Reliability Stress for AO4455
Test Item
Test Condition
Time
Point
MSL
Precondition
168hr 85°c
/85%RH +3 cycle
[email protected]°c
-
HTGB
Temp = 150 c,
Vgs=100% of
Vgsmax
168hrs
500 hrs
1000 hrs
Lot
Attribution
Total
Sample
size
Number
of
Failures
33 lots
5489pcs
0
JESD22A113
693pcs
0
JESD22A108
0
JESD22A108
1100pcs
0
JESD22A110
6 lot
3 lot
(Note A*)
Standard
77pcs / lot
Temp = 150 c,
Vds=80% of
Vdsmax
168hrs
500 hrs
1000 hrs
HAST
130c, 85%RH,
33.3 psi, Vgs =
100% of Vgs max
96 hrs
20 lots
Pressure Pot
121c, 29.7psi,
RH=100%
96 hrs
(Note A*)
24lots
55 pcs / lot
1848pcs
0
JESD22A102
Temperature
Cycle
-65c to 150c,
air to air
250 / 500
cycles
(Note A*)
33 lots
77 pcs / lot
2541pcs
0
JESD22A104
(Note A*)
77 pcs / lot
HTRB
693pcs
6 lot
3 lot
(Note A*)
77pcs / lot
Note A: The reliability data presents total of available generic data up to the published date.
IV. Reliability Evaluation
FIT rate (per billion): 3.82
MTTF = 29919 years
The presentation of FIT rate for the individual product reliability is restricted by the actual
burn-in sample size of the selected product (AO4455). Failure Rate Determination is based
on JEDEC Standard JESD 85. FIT means one failure per billion hours.
2
9
Failure Rate = Chi x 10 / [2 (N) (H) (Af)]
9
= 1.83 x 10 / [2 x (12x77x500 +6x77x1000) x 259] = 3.82
9
8
MTTF = 10 / FIT = 2.62 x 10 hrs = 29919 years
Chi²= Chi Squared Distribution, determined by the number of failures and confidence interval
N = Total Number of units from HTRB and HTGB tests
H = Duration of HTRB/HTGB testing
Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C)
Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)]
Acceleration Factor ratio list:
Af
55 deg C
70 deg C
85 deg C
100 deg C
115 deg C
130 deg C
150 deg C
259
87
32
13
5.64
2.59
1
Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16
Tj u = The use junction temperature in degree (Kelvin), K = C+273.16
-5
K = Boltzmann’s constant, 8.617164 X 10 eV / K