100tqfp10mmHF Cuwire

Device Material Content
5555 NE Moore Ct.
Hillsboro OR 97124
[email protected]
Package: 100 TQFP (1.0 mm) with matte Sn Plating
Total Device Weight 0.50
Grams
August, 2012
% of Total
Pkg. Wt.
Weight (g)
Die
0.26%
0.0013
Mold
71.77%
0.3558
D/A Tape
0.01%
% of Total
Pkg. Wt.
Weight (g)
Halogen Free
MSL: 3
Peak Reflow Temp: 260°C
Substance
CAS #
Silicon chip
7440-21-3
Notes / Assumptions:
Die size: 58 x 55 mil
2.33%
2.15%
3.23%
0.14%
62.47%
1.44%
0.01156
0.01068
0.01601
0.00071
0.30976
0.00712
Epoxy Resin-1
Epoxy Resin-2
Phenol Resin
Carbon black
Silica Fused
Other (trade secret)
Trade Secret
Trade Secret
Trade Secret
1333-86-4
60676-86-0
-
Mold Compound: CEL 9240HF
0.5 to 6% (LSC uses 3.25% in our calculation)
1 to 5% (LSC uses 3% in our calculation)
3 to 6% (LSC uses 4.5% in our calculation)
0.20%
82 to 94% (LSC uses 87.05% in our calculation)
<2% (LSC uses 2% in our calculation)
0.0017%
0.0017%
0.0003%
0.0078%
0.000008
0.000008
0.000001
0.000039
Epoxy Resin
Phenol Resin
SiO2 Filler
(Meta)Acrylic Copolymer
Trade Secret
Trade Secret
Trade Secret
Trade Secret
TAPE: FH-900T-25_HR9004
10-20%; LSC uses 15% in our calculation
10-20%; LSC uses 15% in our calculation
1-10%; LSC uses 7.25% in our calculation
65-75%; LSC uses 67.25% in our calculation
0.00006
Wire
0.15%
0.00074
Copper (Cu)
7440-50-8
0.7 MIL COPPER WIRE
Lead Plating
1.20%
0.0059
Tin (Sn)
7440-31-5
Plating is 100% Matte Sn
Leadframe
26.61%
0.1319
Copper (Cu)
Nickel (Ni)
Silicon (Si)
Magnesium (Mg)
7440-50-8
7440-02-0
7440-21-3
7439-95-4
C7025
25.52%
0.850%
0.190%
0.050%
0.12653
0.00421
0.00094
0.00025
2.2 to 4.2% Ni
0.25 to 1.2% Si
0.05 to 0.30% Mg
Notes:
The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible.
Constituent substances and proportions in epoxy materials are before curing.
The information provided above is representative of the package as of the date listed, and is subject to change at any time.
www.latticesemi.com
Rev. A
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