Device Material Content 5555 NE Moore Ct. Hillsboro OR 97124 [email protected] Package: Total Device Weight August, 2012 % of Total Pkg. Wt. Weight (g) Die 9.63% 0.0122 Mold 37.68% 0.0477 D/A Tape Wire Solder Balls Substrate 0.47% 1.54% 13.93% 36.75% 196 csBGA 0.127 Grams with SnAgCu Solder Balls Halogen Free MSL: 3 Peak Reflow Temp: 260°C % of Total Weight (g) Pkg. Wt. Substance CAS # Silicon chip 7440-21-3 Notes / Assumptions: Die size: 189 x 173 mils 33.91% 2.07% 1.70% 0.04293 0.00262 0.00215 Silica Epoxy Resin Phenol Resin 60676-86-0 Trade secret Trade secret Mold Compound: KEG1250 LKDS 75 to 95% Fused silica filler (LSC uses 90% in our calculation) 1 to 10% Epoxy resin (LSC uses 5.5% in our calculation) 2 to 7% Phenol resin (LSC uses 4.5% in our calculation) 0.06% 0.06% 0.03% 0.33% 0.00007 0.00007 0.00004 0.00041 Epoxy Resin Phenol Resin SiO2 Filler (Meta)Acrylic Copolymer 25038-59-9 Trade secret Trade secret Trade secret TAPE FH-900T-25_HR9004 10 to 20% (LSC uses 12% in our calculation) 10 to 20% (LSC uses 12% in our calculation) 1 to 10% (LSC uses 6% in our calculation) 0 to 40% Organic Esters and Resins (LSC uses 20% in our calculation) 1.527% 0.015% 0.00193 0.00002 Gold (Au) Palladium (Pd) 7440-57-5 7440-05-3 13.72% 0.14% 0.07% 0.01737 0.00018 0.00009 Tin (Sn) Silver (Ag) Copper (Cu) 7440-31-5 7440-22-4 7440-50-8 11.31% 8.48% 7.14% 3.40% 1.42% 0.71% 0.07% 4.24% 0.01431 0.01074 0.00904 0.00430 0.00179 0.00089 0.00009 0.00537 BT Resin (1)(3) GHPL-830NX(A) BT Resin (2) CCL-HL832NX(A-HS) Copper (1)(4) Copper (2)(3) Copper thickness in hole Nickel plating Gold plating Solder mask PSR4000 AUS 308 Trade secret Trade secret 7440-50-8 7440-50-8 7440-50-8 7440-02-0 7440-57-5 Trade secret 0.0006 0.0020 0.7 MIL GPG-3 (2N) 99% 1% 0.0176 Solder ball composition 12 mils Sn98.5 / Ag1.0 / Cu0.5 (SAC105) GHPL-830NX(A), CCL-HL832NX(A-HS) / AUS 308 0.0465 Notes: The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible. Constituent substances and proportions in epoxy materials are before curing. The information provided above is representative of the package as of the date listed, and is subject to change at any time. www.latticesemi.com Rev. A