CSBGA Halogenfree Auwire196_ice65

Device Material Content
5555 NE Moore Ct.
Hillsboro OR 97124
[email protected]
Package:
Total Device Weight
August, 2012
% of Total
Pkg. Wt.
Weight (g)
Die
9.63%
0.0122
Mold
37.68%
0.0477
D/A Tape
Wire
Solder Balls
Substrate
0.47%
1.54%
13.93%
36.75%
196 csBGA
0.127
Grams
with SnAgCu Solder Balls
Halogen Free
MSL: 3
Peak Reflow Temp: 260°C
% of Total
Weight (g)
Pkg. Wt.
Substance
CAS #
Silicon chip
7440-21-3
Notes / Assumptions:
Die size: 189 x 173 mils
33.91%
2.07%
1.70%
0.04293
0.00262
0.00215
Silica
Epoxy Resin
Phenol Resin
60676-86-0
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Mold Compound: KEG1250 LKDS
75 to 95% Fused silica filler (LSC uses 90% in our calculation)
1 to 10% Epoxy resin (LSC uses 5.5% in our calculation)
2 to 7% Phenol resin (LSC uses 4.5% in our calculation)
0.06%
0.06%
0.03%
0.33%
0.00007
0.00007
0.00004
0.00041
Epoxy Resin
Phenol Resin
SiO2 Filler
(Meta)Acrylic Copolymer
25038-59-9
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TAPE FH-900T-25_HR9004
10 to 20% (LSC uses 12% in our calculation)
10 to 20% (LSC uses 12% in our calculation)
1 to 10% (LSC uses 6% in our calculation)
0 to 40% Organic Esters and Resins (LSC uses 20% in our calculation)
1.527%
0.015%
0.00193
0.00002
Gold (Au)
Palladium (Pd)
7440-57-5
7440-05-3
13.72%
0.14%
0.07%
0.01737
0.00018
0.00009
Tin (Sn)
Silver (Ag)
Copper (Cu)
7440-31-5
7440-22-4
7440-50-8
11.31%
8.48%
7.14%
3.40%
1.42%
0.71%
0.07%
4.24%
0.01431
0.01074
0.00904
0.00430
0.00179
0.00089
0.00009
0.00537
BT Resin (1)(3) GHPL-830NX(A)
BT Resin (2) CCL-HL832NX(A-HS)
Copper (1)(4)
Copper (2)(3)
Copper thickness in hole
Nickel plating
Gold plating
Solder mask PSR4000 AUS 308
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7440-50-8
7440-50-8
7440-50-8
7440-02-0
7440-57-5
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0.0006
0.0020
0.7 MIL GPG-3 (2N)
99%
1%
0.0176
Solder ball composition 12 mils Sn98.5 / Ag1.0 / Cu0.5 (SAC105)
GHPL-830NX(A), CCL-HL832NX(A-HS) / AUS 308
0.0465
Notes:
The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible.
Constituent substances and proportions in epoxy materials are before curing.
The information provided above is representative of the package as of the date listed, and is subject to change at any time.
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Rev. A
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