Device Material Content 5555 NE Moore Ct. Hillsboro OR 97124 [email protected] Package: Total Device Weight August, 2012 % of Total Pkg. Wt. Weight (g) Die 4.95% 0.0013 Mold 62.85% 0.0165 D/A Tape Wire Solder Balls Substrate 0.15% 1.05% 2.66% 28.25% 0.03 81 ucBGA Grams % of Total Pkg. Wt. Weight (g) Halogen Free with SnAgCu Solder Balls MSL: 3 Peak Reflow Temp: 260°C Substance CAS # Silicon chip 7440-21-3 Notes / Assumptions: Die size: 59 x 59 mil 56.57% 3.46% 2.83% 0.0148 0.0009 0.0007 Silica Epoxy Resin Phenol Resin 60676-86-0 Trade secret Trade secret Mold Compound: KEG1250 LKDS 75 to 95% Fused silica filler (LSC uses 90% in our calculation) 1 to 10% Epoxy resin (LSC uses 5.5% in our calculation) 2 to 7% Phenol resin (LSC uses 4.5% in our calculation) 0.03% 0.03% 0.01% 0.17% 0.000008 0.000008 0.000004 0.000044 Epoxy Resin Phenol Resin SiO2 Filler (Meta)Acrylic Copolymer Trade secret Trade secret Trade secret Trade secret TAPE FH-900T-25_HR9004 10 to 20% (LSC uses 12% in our calculation) 10 to 20% (LSC uses 12% in our calculation) 1 to 10% (LSC uses 6% in our calculation) 65 to 75% (LSC uses 70% in our calculation) 1.022% 0.028% 0.00027 0.00001 Copper (Cu) Palladium (Pd) 7440-50-8 7440-05-3 2.62% 0.03% 0.01% 0.00069 0.00001 0.000003 Tin (Sn) Silver (Ag) Copper (Cu) 7440-31-5 7440-22-4 7440-50-8 12.91% 3.23% 8.07% 1.34% 0.05% 2.69% 0.00338 0.00085 0.00211 0.00035 0.00001 0.00070 BT Resin CCL-HL832NX Copper (Cu) Soldermask AUS 308 Nickel Plating Gold Plating Copper thickness in hole Trade secret 7440-50-8 Trade secret 7440-02-0 7440-57-5 7440-50-8 0.00006 0.0003 0.7 MIL Pd COATED Cu 97.30% 2.70% 0.00070 0.00740 10 mils Sn98.5 / Ag1.0 / Cu0.5 (SAC105) CCL-HL832NX(A-HS) / AUS 308 45.71% 11.43% 28.57% 4.76% 0.19% 9.52% Notes: The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible. Constituent substances and proportions in epoxy materials are before curing. The information provided above is representative of the package as of the date listed, and is subject to change at any time. www.latticesemi.com Rev. A