Device Material Content 5555 NE Moore Ct. Hillsboro OR 97124 (503) 268-8000 Package: Total Device Weight January, 2006 % of Total Pkg. Wt. Weight (g) Die 4.28% 0.221 Mold 39.30% 2.028 D/A Epoxy 0.60% 680 fpBGA 5.16 Grams with SnAgCu Solder Balls % of Total Weight (g) Pkg. Wt. Substance CAS # Notes / Assumptions: Silicon 7440-21-3 Die size: 17.25 x 17.72 mm 35.37% 1.96% 1.96% 1.825 0.101 0.101 Silica (Fused or Amorphous) Epoxy resin Phenol resin 0.48% 0.12% 0.025 0.006 Silver (Ag) Organic esters and resins 0.031 Wire 0.39% 0.020 Solder Balls 13.10% 0.676 Gold (Au) 12.64% 0.39% 0.07% Substrate 19.85% 1.024 Foil 22.49% 1.160 0.652 0.020 0.003 Tin (Sn) Silver (Ag) Copper (Cu) Copper (Cu) The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible. www.latticesemi.com 7440-57-5 1.00 mil diameter; 1 wire per solder ball Qualified Solder ball compositions: 7440-31-5 Sn95.5/Ag4/Cu0.5 7440-22-4 Sn96.5/Ag3/Cu0.5 7440-50-8 LSC uses: Sn96/Ag3.5/Cu0.5 for calculations 129915-35-1 BT Resin Notes: The information provided above is representative of the package as of the date listed, and is subject to change at any time. Mold Compound composition: 60676-86-0 84 to 92% Silica filler (LSC uses 90% in our calculation) 129915-35-1 5 to 9% Epoxy resin (LSC uses 5% in our calculation) 26834-02-6 4 to 8% Phenolic resin (LSC uses 5% in our calculation) Mold Compound Density between 1.8 and 2.1 grams/cc Die attach epoxy Density: 4 grams/cc 7440-22-4 60 to 100% Silver (LSC uses 80% in our calculation) 0 to 30% Organic Esters and Resins (LSC uses 20% in our calculation) - 7440-50-8