FPBGA Pbfree Auwire388

Device Material Content
5555 NE Moore Ct.
Hillsboro OR 97124
Package:
[email protected]
Total Device Weight
November, 2009
% of Total
Pkg. Wt.
Weight (g)
Die
1.82%
0.0389
Mold
27.64%
0.591
D/A Epoxy
0.26%
0.53%
0.0114
Solder Balls
17.60%
0.377
Foil
22.52%
29.64%
with SnAgCu Solder Balls
MSL: 3
Peak Reflow Temp: 250°C
% of Total
Weight (g)
Pkg. Wt.
Substance
CAS #
Silicon chip
7440-21-3
Notes / Assumptions:
Die size: 7.8 x 6.9 mm
24.32%
1.66%
1.66%
0.520
0.0355
0.0355
Silica (Fused or Amorphous)
Epoxy resin
Phenol resin
60676-86-0
-
0.20%
0.05%
0.0044
0.0011
Silver
Organic esters and resins
7440-22-4
-
Mold Compound composition:
75 to 95% Silica Fused (LSC uses 88% in our calculation)
1 to 10% Epoxy resin (LSC uses 6% in our calculation)
2 to 7% Phenol resin (LSC uses 6% in our calculation)
Mold Compound Density between 1.8 and 2.1 grams/cc
Die attach epoxy Density: 4 grams/cc
70 to 90% Silver (LSC uses 80% in our calculation)
7 to 30% Organic Esters and Resins (LSC uses 20% in our calculation)
Gold (Au)
7440-57-5
0.8 to 1.0 mil diameter; 1 wire per solder ball
Qualified Solder ball compositions:
Sn95.5/Ag4/Cu0.5
Sn96.5/Ag3/Cu0.5
LSC uses: Sn96/Ag3.5/Cu0.5 for calculations
0.0055
Wire
Substrate
388 fpBGA
2.14
Grams
16.89%
0.62%
0.09%
0.362
0.0132
0.0019
Tin (Sn)
Silver (Ag)
Copper (Cu)
7440-31-5
7440-22-4
7440-50-8
15.32%
7.21%
0.328
0.154
Glass fiber
BT Resins
65997-17-3
-
Copper (Cu)
7440-50-8
0.482
0.634
60 to 75% glass fiber (LSC uses 68% in our calculation)
Notes:
The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible.
Constituent substances and proportions in epoxy materials are before curing.
The information provided above is representative of the package as of the date listed, and is subject to change at any time.
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Rev. B4