Device Material Content 5555 NE Moore Ct. Hillsboro OR 97124 [email protected] Package: Total Device Weight November, 2009 % of Total Pkg. Wt. Weight (g) Die 1.48% 0.0489 Mold 36.73% 1.212 D/A Epoxy 0.21% 0.60% 0.0197 Solder Balls 19.89% 0.656 Foil 18.87% 22.23% with SnAgCu Solder Balls % of Total Weight (g) Pkg. Wt. MSL: 3 Peak Reflow Temp: 250°C Substance CAS # Silicon chip 7440-21-3 Notes / Assumptions: Die size: 8.11 x 8.34 mm 29.38% 2.94% 2.94% 1.29% 0.18% 0.970 0.0970 0.0970 0.0424 0.0061 Silica (Fused or Amorphous) Epoxy resin Phenol resin Cristalline Silica Carbon Black 60676-86-0 14808-60-7 1333-86-4 0.17% 0.04% 0.0055 0.0014 Silver Organic esters and resins 7440-22-4 - Mold Compound composition: 75 to 95% Silica Fused or Amorphous (LSC uses 80% in our calculation) 1 to 20% Epoxy resin (LSC uses 8% in our calculation) 2 to 20% Phenol resin (LSC uses 8% in our calculation) <5% Cristalline Silica (LSC uses 3.5% in our calculation) <1% Carbon Black (LSC uses 0.5% in our calculation) Mold Compound Density between 1.8 and 2.1 grams/cc Die attach epoxy Density: 4 grams/cc 60 to 100% Silver (LSC uses 80% in our calculation) 0 to 40% Organic Esters and Resins (LSC uses 20% in our calculation) Gold (Au) 7440-57-5 0.8 to 1.0 mil diameter; 1 wire per solder ball Qualified Solder ball compositions: Sn95.5/Ag4/Cu0.5 Sn96.5/Ag3/Cu0.5 LSC uses: Sn96/Ag3.5/Cu0.5 for calculations 0.0069 Wire Substrate 672 fpBGA 3.30 Grams 19.09% 0.70% 0.10% 0.630 0.0230 0.0033 Tin (Sn) Silver (Ag) Copper (Cu) 7440-31-5 7440-22-4 7440-50-8 12.83% 6.04% 0.424 0.1993 Glass fiber BT Resins 65997-17-3 - Copper (Cu) 7440-50-8 0.623 0.734 60 to 75% glass fiber (LSC uses 68% in our calculation) Notes: The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible. Constituent substances and proportions in epoxy materials are before curing. The information provided above is representative of the package as of the date listed, and is subject to change at any time. www.latticesemi.com Rev. B4