05-08-1878

BGA Package
35-Lead (11.25mm × 6.25mm × 3.42mm)
(Reference LTC DWG # 05-08-1878 Rev A)
A
aaa Z
E
Y
Z
A2
X
SEE NOTES
A
ccc Z
b
B
4
C
D
b1
MOLD
CAP
D
F
E
SUBSTRATE
0.27 – 0.37
// bbb Z
aaa Z
G
H
DETAIL B
5
PACKAGE TOP VIEW
Øb (35 PLACES)
ddd M Z X Y
eee M Z
DETAIL B
PACKAGE SIDE VIEW
2.540
1.270
0.000
0.3175
0.3175
1.270
2.540
4
3
2
1
PACKAGE BOTTOM VIEW
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
2. ALL DIMENSIONS ARE IN MILLIMETERS
3
BALL DESIGNATION PER JESD MS-028 AND JEP95
4
DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
DETAIL A
4.445
3.175
5. PRIMARY DATUM -Z- IS SEATING PLANE
DIMENSIONS
1.905
0.635
0.000
0.635
1.905
3.4925
F
e
2.45 – 2.55
2.8575
7
PIN 1
3
A1
PIN “A1”
CORNER
SEE NOTES
DETAIL A
G
3.175
4.445
SUGGESTED PCB LAYOUT
TOP VIEW
SYMBOL
A
A1
A2
b
b1
D
E
e
F
G
aaa
bbb
ccc
ddd
eee
MIN
3.22
0.50
2.72
0.71
0.60
NOM
3.42
0.60
2.82
0.78
0.63
11.25
6.25
1.27
8.89
5.08
MAX
3.62
0.70
2.92
0.85
0.66
0.15
0.10
0.20
0.30
0.15
TOTAL NUMBER OF BALLS: 35
NOTES
6. SOLDER BALL COMPOSITION IS 96.5% Sn/3.0% Ag/0.5% Cu
7
COMPONENT
PIN “A1”
TRAY PIN 1
BEVEL
!
PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY
LTMXXXXXX
µModule
PACKAGE IN TRAY LOADING ORIENTATION
BGA 35 1212 REV A
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