05-08-1851

BGA Package
32-Lead (15mm × 11.25mm × 3.42mm)
(Reference LTC DWG # 05-08-1851 Rev D)
A
8
A2
aaa Z
SEE NOTES
DETAIL A
Z
7
7
6
5
4
3
2
1
PIN 1
A
PIN “A1”
CORNER
A1
4
b
B
ccc Z
C
D
E
b1
MOLD
CAP
F
D
F
SUBSTRATE
G
0.27 – 0.37
// bbb Z
2.45 – 2.55
H
DETAIL B
J
K
e
L
Øb (32 PLACES)
ddd M Z X Y
eee M Z
X
Y
aaa Z
E
3
PACKAGE BOTTOM VIEW
DIMENSIONS
6.350
0.630 ±0.025 Ø 32x
5.080
0.000
5.080
6.350
SUGGESTED PCB LAYOUT
TOP VIEW
2. ALL DIMENSIONS ARE IN MILLIMETERS
DETAIL A
4.445
3.175
1.905
0.000
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
0.635
0.635
1.905
3.175
4.445
SEE NOTES
G
DETAIL B
PACKAGE SIDE VIEW
PACKAGE TOP VIEW
e
b
SYMBOL
A
A1
A2
b
b1
D
E
e
F
G
aaa
bbb
ccc
ddd
eee
MIN
3.22
0.50
2.72
0.60
0.60
NOM
3.42
0.60
2.82
0.75
0.63
15.0
11.25
1.27
12.70
8.89
MAX
3.62
0.70
2.92
0.90
0.66
0.15
0.10
0.20
0.30
0.15
TOTAL NUMBER OF BALLS: 32
3
BALL DESIGNATION PER JESD MS-028 AND JEP95
4
DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
NOTES
5. PRIMARY DATUM -Z- IS SEATING PLANE
6. SOLDER BALL COMPOSITION IS 96.5% Sn/3.0% Ag/0.5% Cu
7
COMPONENT
PIN “A1”
TRAY PIN 1
BEVEL
!
PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY
LTMXXXXXX
µModule
PACKAGE IN TRAY LOADING ORIENTATION
BGA 32 1112 REV D
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