Data Sheet AH352A_W Part Number : SPHWHTA3N500 SPHWHTA3N500 Introduction Part Number : SPHWHTA3N500 Automotive Head Lamp Lighting Source Features Package : Silicone covered ceramic Substrate Dimension : 3.5 mm x 3.5 mm Luminous Flux : 400lm @700mA Color Coordinate Group : Appropriate to ECE Chip Configuration : 2 chip array (1X2) Viewing Angle: 120˚ ESD Voltage : up to 8kV acc. to ISO10605-contact Applications Automotive Head Lamp : Low/High Beam Fog lamp DRL lamp MotorCycle Head Lamp Environmental Compliance Samsung is compliant to the restrictions of hazardous substances in electronic equipment, namely, the RoHS, ELV, ISO14001 and REACH directives. Samsung will not intentionally supplement the restricted materials to the headlamp LED product : Cd, Pb, Hg, PBBs, PBDEs and Cr6+ 2015/09/11/Rev.06 - 1 - SPHWHTA3N500 Table of Contents Product Overview ------------------------- 3 Part Number Description ------------------------- 3 Characteristic 4 Chromaticity Coordinates Bin ------------------------------------------------------------------------------------------------------------------------- Absolute Maximum Rating ------------------------- 6 Typical Characteristic Graph ------------------------- 7 Mechanical Dimension ------------------------- 11 Soldering Information ------------------------- 12 Packing Information ------------------------- 13 Product Labeling Information ------------------------- 15 Reliability Test Condition ------------------------- 16 Precaution ------------------------- 17 Hazardous Substance Analysis ------------------------- 18 Revision History ------------------------- 19 Company Information ------------------------- 19 Typical Characteristic Luminous Flux Bin Forward Voltage Bin 2015/09/11/Rev.06 - 2 - 4 4 4 5 SPHWHTA3N500 Product Overview ‧ Luminous Flux Part Number Color of Emission SPHWHTA3N500 WHITE Luminous Flux[lm] 430 Form Factor 1 x 2 ‧ Chip Configuration ( chip array circuit) X : 2.32 mm Y : 1.09 mm Part Number Description The part number designation is explained as follows: SP H WH T A3 N 5 0 0 AB CD EF AB C DE F GH I J K L MN OP QR Where: AB C DE F GH I J K L MN OP QR - designates designates designates designates designates designates designates designates designates designates designates designates company name and package (SP for Samsung Package) package details (H for high power package) color (WH for white) version of product (T for initial version) type of package (A3 for Automotive 3535 type) lens configuration (N for no lens type) maximum power (5 for 4.5~5.5W) special internal code (0 for default) CRI (0 for default) forward voltage CIE coordination luminous flux 2015/09/11/Rev.06 - 3 - SPHWHTA3N500 Characteristics ‧ Typical Characteristics [TS = 25 ℃][1] Parameter Symbol Value Unit Luminous Flux (IF = 700 mA) lm 400 lm Forward Voltage (IF = 700 mA) VF 6.2 V Reverse Voltage (IF = 10 mA) VR 0.9 V Viewing Angle φ 120 Deg. Reverse Current IR not designed for reverse operation mA Thermal Resistance Rth_J-S max. 4.0 K/W (Junction to solder point) Rth_J-S typ. 3.0 K/W A 2.53 mm2 Radiant Surface ‧ Luminous Flux Bin[2] Symbol ΦV Condition IF = 700 mA [TS = 25 ℃][1] Bin Code Min. Typ Max. X4 350 - 400 X5 400 - 450 X6 450 - 500 X7 500 - X8 550 - 550 600 Forward Voltage Bin[2] Symbol Condition VF IF = 700 mA Unit lm [TS = 25 ℃][1] Bin Code Min. Typ. Max. V1 6.0 - 7.0 V2 7.0 - 8.0 Unit V * Notes [1] The measurement condition means that temperature dependence is excluded by applying pulse current for under 25 ms. [2] Luminous flux measuring equipment : CAS140CT ΦV and VF tolerances are ±10% and ±0.1 V, respectively. 2015/09/11/Rev.06 - 4 - SPHWHTA3N500 ‧ Color Bin Definition[3] Symbol Condition Bin Code [TS = 25 ℃] Cx Cy R0 0.3329 0.3214 0.3236 0.3326 0.3560 0.3406 0.3122 0.3273 S0 0.3214 0.3127 0.3168 0.3236 0.3406 0.3290 0.3010 0.3122 Cx, Cy IF = 700 mA ‧ Color Bin Definition ECE White R0 S0 * Notes [3] Luminous flux measuring equipment : CAS140CT Chromaticity coordinates : Cx, Cy according to CIE 1931. Cx and Cy tolerances are ±0.01, respectively. 2015/09/11/Rev.06 - 5 - SPHWHTA3N500 Absolute Maximum Ratings Parameter Symbol Value Unit Operating temperature range TOPR -40 ~ +125 ℃ Storage temperature range TSTG -40 ~ +125 ℃ Junction temperature TJ_Max +150 ℃ IF 1000 mA IF 100 mA mA 1500 mA for ≤ 10 ms mA VR 0.9 V - ±8 KV HBM Maximum Forward current[4] (TS : 25 ℃)[5] Minimum Forward current[4] (TS : 25 ℃)[5] Maximum Transient Peaked current [6] : 25 ℃)[5] Reverse voltage (TS (TS : 25 ℃)[5] ESD Sensitivity[7] * Notes [4] Unpredictable performance may be resulted by driving the product at below Min. IF or above Max. IF. But there will be no damage to the product. [5] The measurement condition means that temperature dependence is excluded by applying pulse current for under 25 ms. [6] Duty 1/10 pulse with 10 ms. [7] It is included the device to protect the product from ESD. 2015/09/11/Rev.06 - 6 - SPHWHTA3N500 Typical Characteristics Graph Typical Spectrum : IF = 700 mA, TS = 25 °C[8] Typical Color vs Angle : IF = 700 mA, TS = 25 °C[8] * Notes [8] The measurement condition means that temperature dependence is excluded by applying pulse current for under 25 ms. 2015/09/11/Rev.06 - 7 - SPHWHTA3N500 Relative Luminous Flux & Forward Voltage vs Forward Current [TS = 25 °C][9] Chromaticity Coordinate Shift vs Forward Current[9] [IF = 700 mA, TS = 25 °C] 2015/09/11/Rev.06 - 8 - SPHWHTA3N500 ‧ Relative Luminous Flux & Forward Voltage vs Temperature[9] Color Shift vs Temperature[9] [IF = 700 mA] * Notes [9] The measurement condition means that temperature dependence is excluded by applying pulse current for under 25 ms. 2015/09/11/Rev.06 - 9 - SPHWHTA3N500 ‧ Typical Radiant Pattern ‧ Max. Permissible Forward Current[10] * Notes [10] The measurement condition means that temperature dependence is excluded by applying pulse current for under 25 ms. 2015/09/11/Rev.06 - 10 - SPHWHTA3N500 Mechanical Dimension[11] [Top View] Unit[mm] [Side View] [Bottom View] [Front View] ‧ Electric Schematic Diagram ‧ Pick and Place It is recommended to use a pick & place nozzle with inside diameter at 3.0 mm. LED suction pressure : 570 ~ 590mmHg ‧ Material Information LED Package = Silicone resin covered White GaN LED on AlN ceramic substrate Electrode PAD = Au Plated PAD This LED has built-in ESD protection device(s) connected in parallel to LED Chip(s). * Notes [11] Tolerance unless otherwise specified is ± 0.1 mm. 2015/09/11/Rev.06 - 11 - SPHWHTA3N500 Soldering Conditions ‧ Pad Configuration & Solder Pad Layout Unit[mm] Solder resist Solder paste stencil Bare copper pattern Recommended Solder Pad Layout Reflow Soldering Condition (Pb Free) Reflow Frequency : 2 times max. Manual Soldering Condition Not more than 5 seconds @MAX300℃, under soldering iron.(one time only) 2015/09/11/Rev.06 - 12 - SPHWHTA3N500 Packing Information ‧ Tape and Reel[12] Unit[mm] * Note [12] Unit : mm, LED taping quantity : 1,000EA / Reel. Reel #Y4VR[7 SPHWHT3N500 V1S0X4 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII SLAW94001 / 1001 / 1,000 pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII [Unit : mm] A 180.0 B -3.0 2015/09/11/Rev.06 60.0 C +1.0 13.0 W1 ±0.3 - 13 - 13.0 ±0.5 W2 15.4 ±1.0 SPHWHTA3N500 Packing Process Dimension of Transportation Box in mm Width Length Height Remark 225 250 190 7 inch type 2015/09/11/Rev.06 - 14 - SPHWHTA3N500 Product Labeling Information A B C DE F SPHWHTA3N500 V1S0X4 Bin Code V1S0X4 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII Part No. SLAW94001 / 1001 / 1,000 pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII Lot No. 1. Bin Code AB : Forward Voltage(VF) Bin CD : Chromaticity Coordinate Bin EF : Luminous Flux Bin 2. Lot No. ①②③④⑤⑥⑦⑧⑨ / 1ⓐⓑⓒ / 1,000 PCS ① : Production Site (S:SAMSUNG KOREA, G:TIANJIN CHINA) ② : L (LED) ③ : Product State (A:Normality, B:Bulk, C:First Production, R:Reproduction, S:Sample) ④ : Year (X:2013, Y:2014, Z:2015...) ⑤ : Month (1 ~ 9, A, B) ⑥ : Day (1 ~ 9, A, B ~ V) ⑦⑧⑨ : SAMSUNG ELECTRONICS Product number (1 ~ 999) ⓐⓑⓒ : Reel Number (1 ~ 999) 2015/09/11/Rev.06 - 15 - SPHWHTA3N500 Reliability Test Conditions For detailed Information please contact your SAMSUNG Sales partner 2015/09/11/Rev.06 - 16 - SPHWHTA3N500 Precaution 1) Absolute maximum ratings are set to prevent LED products from breaking due to extreme stress (temperature, current, voltage, etc.). Usage conditions must never go above the ratings, nor any of two of the factors reach the rating level simultaneously. 2) Please avoid touch or pressure on resin molded part in the products. To handle the products directly, it is recommended to use non metallic tweezers. 3) Device should not be used in any type of fluid such as water, oil, organic solvent, etc. When washing is required, IPA is recommended to use. 4) LEDs must be stored in a clean environment. If the LEDs are to be stored for 3 months or more after being shipped from SAMSUNG ELECTRONICS, they should be packed by a sealed container with nitrogen gas injected. 5) After bag is opened, device subjected to soldering, solder reflow, or other high temperature processes must be : a. Mounted within 672hours(LEVEL 2a) at an assembly line with a condition of no more than 30℃/60% RH, b. Stored at < 10% RH. 6) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. 7) Devices require baking before mounting, if humidity card reading is >60 % at 23±5 ℃. 8) Devices must be baked for 1 hour at 65±5 ℃, if baking is required. 9) The LEDs are sensitive to the static electricity and surge. It is recommended to use a wrist band or anti-electrostatic glove when handling the LEDs. If voltage exceeding the absolute maximum rating is applied to LEDs, it may cause damage or even destruction to LED devices. Damaged LEDs may show some unusual characteristics such as increase in leak current, lowered turn-on voltage, or abnormal lighting of LEDs at low current. 10) Prepare a ESD protective area by placing conductive mattress(106Ω ) and ionizer to remove any static electricity. 11) VOCs (volatile organic compounds) may be occurred by adhesives, flux, hardener or organic additives which is used in luminaires (fixture) and LED silicone bags are permeable to it. It may lead a discoloration when LED expose to heat or light. This phenomenon can give a significant loss of light emitted(output) from the luminaires (fixtures). In order to prevent these problems, we recommend you to know the physical properties for the materials used in luminaires, It requires to select carefully. 2015/09/11/Rev.06 - 17 - SPHWHTA3N500 Hazardous Substance Analysis Report 2015/09/11/Rev.06 - 18 - SPHWHTA3N500 Revision History Date Revision History Author Drawn Approved 2012.12.18 Rev.00 Initial Edition - Preliminary S.Y. GO S.B. KWAK 2013.02.20 Rev.01 Precaution, Company information S.Y. GO S.B. KWAK 2013.06.21 Rev.02 Forward Voltage Bin S.Y. GO S.B. KWAK 2013.10.07 Rev.03 Dimension, Pick and Place S.Y. GO S.B. KWAK 2013.10.30 Rev.04 Packing Process S.Y. GO S.B. KWAK 2014.11.05 Rev.05 Cover Modification S.Y. GO S.B. KWAK 2015.09.11 Rev.06 Revise of Luminous Flux bin S.Y. GO S.B. KWAK Company Information US Samsung Semiconductor Inc., 3655 N. First Street, San Jose CA 95134, USA TEL. +1-408-544-4000 Europe Samsung Electronics Germany GmbH, Samsung House, Am Kronberger Hang 6, Schwalbach/Ts,Germany TEL. +49-6196-66-0 Japan Copyright @1995-2012 All rights reserved Samsung Electronics San #24, Nongseo-Dong, Giheung-Gu, Yongin-City, Gyeongii-Do 446-711 Korea http://www.samsung.com/sec/business/led Sales Contact : [email protected] 2015/09/11/Rev.06 Samsung Japan Corporation SLED Team 10F, Shinagawa Grand Central Tower 2-16-4, Kounan, Minato-ku, Tokyo 108-8240, Japan TEL. +81-3-6369-6327 China (Tianjin Office in China) Tianjin Samsung LED Co., LTD. Weisi (6th) Rd., Micro-Electronics Industrial Park, Xiqing District, Tianjin 300385, China TEL. +86-755-8608-5550 - 19 -