Data Sheet - AH352A_W

Data Sheet
AH352A_W
Part Number : SPHWHTA3N500
SPHWHTA3N500
Introduction
Part Number : SPHWHTA3N500
Automotive Head Lamp Lighting Source
Features
 Package : Silicone covered ceramic Substrate
 Dimension : 3.5 mm x 3.5 mm
 Luminous Flux : 400lm @700mA
 Color Coordinate Group : Appropriate to ECE
 Chip Configuration : 2 chip array (1X2)
 Viewing Angle: 120˚
 ESD Voltage : up to 8kV acc. to ISO10605-contact
Applications
 Automotive Head Lamp : Low/High Beam
 Fog lamp
 DRL lamp
 MotorCycle Head Lamp
Environmental Compliance
Samsung is compliant to the restrictions of hazardous substances in electronic
equipment, namely, the RoHS, ELV, ISO14001 and REACH directives.
Samsung will not intentionally supplement the restricted materials to the
headlamp LED product : Cd, Pb, Hg, PBBs, PBDEs and Cr6+
2015/09/11/Rev.06
- 1 -
SPHWHTA3N500
Table of Contents

Product Overview
-------------------------
3

Part Number Description
-------------------------
3

Characteristic
4
Chromaticity Coordinates Bin
-------------------------------------------------------------------------------------------------------------------------

Absolute Maximum Rating
-------------------------
6

Typical Characteristic Graph
-------------------------
7

Mechanical Dimension
------------------------- 11

Soldering Information
------------------------- 12

Packing Information
------------------------- 13

Product Labeling Information
------------------------- 15

Reliability Test Condition
------------------------- 16

Precaution
------------------------- 17

Hazardous Substance Analysis
------------------------- 18

Revision History
------------------------- 19

Company Information
------------------------- 19
Typical Characteristic
Luminous Flux Bin
Forward Voltage Bin
2015/09/11/Rev.06
- 2 -
4
4
4
5
SPHWHTA3N500
Product Overview
‧ Luminous Flux
Part
Number
Color of
Emission
SPHWHTA3N500
WHITE
Luminous Flux[lm]
430
Form Factor
1 x 2
‧ Chip Configuration ( chip array circuit)
X : 2.32 mm
Y : 1.09 mm
Part Number Description
The part number designation is explained as follows:
SP H WH T A3 N 5 0 0 AB CD EF
AB C DE F GH I J K L MN OP QR
Where:
AB
C
DE
F
GH
I
J
K
L
MN
OP
QR
-
designates
designates
designates
designates
designates
designates
designates
designates
designates
designates
designates
designates
company name and package (SP for Samsung Package)
package details (H for high power package)
color (WH for white)
version of product (T for initial version)
type of package (A3 for Automotive 3535 type)
lens configuration (N for no lens type)
maximum power (5 for 4.5~5.5W)
special internal code (0 for default)
CRI (0 for default)
forward voltage
CIE coordination
luminous flux
2015/09/11/Rev.06
- 3 -
SPHWHTA3N500
Characteristics
‧ Typical Characteristics
[TS = 25 ℃][1]
Parameter
Symbol
Value
Unit
Luminous Flux (IF = 700 mA)
lm
400
lm
Forward Voltage (IF = 700 mA)
VF
6.2
V
Reverse Voltage (IF = 10 mA)
VR
0.9
V
Viewing Angle
φ
120
Deg.
Reverse Current
IR
not designed for
reverse operation
mA
Thermal Resistance
Rth_J-S max.
4.0
K/W
(Junction to solder point)
Rth_J-S typ.
3.0
K/W
A
2.53
mm2
Radiant Surface
‧ Luminous Flux Bin[2]
Symbol
ΦV
Condition
IF = 700 mA


[TS = 25 ℃][1]
Bin Code
Min.
Typ
Max.
X4
350
-
400
X5
400
-
450
X6
450
-
500
X7
500
-
X8
550
-
550
600
 Forward Voltage Bin[2]
Symbol
Condition
VF
IF = 700 mA
Unit
lm
[TS = 25 ℃][1]
Bin Code
Min.
Typ.
Max.
V1
6.0
-
7.0
V2
7.0
-
8.0
Unit
V
* Notes
[1] The measurement condition means that temperature dependence is excluded by applying pulse
current for under 25 ms.
[2] Luminous flux measuring equipment : CAS140CT
ΦV and VF tolerances are ±10% and ±0.1 V, respectively.
2015/09/11/Rev.06
- 4 -
SPHWHTA3N500
‧ Color Bin Definition[3]
Symbol
Condition
Bin
Code
[TS = 25 ℃]
Cx
Cy
R0
0.3329 0.3214 0.3236 0.3326 0.3560 0.3406 0.3122 0.3273
S0
0.3214 0.3127 0.3168 0.3236 0.3406 0.3290 0.3010 0.3122
Cx, Cy IF = 700 mA
‧ Color Bin Definition
ECE White
R0
S0
* Notes
[3] Luminous flux measuring equipment : CAS140CT
Chromaticity coordinates : Cx, Cy according to CIE 1931. Cx and Cy tolerances are ±0.01,
respectively.
2015/09/11/Rev.06
- 5 -
SPHWHTA3N500
Absolute Maximum Ratings
Parameter
Symbol
Value
Unit
Operating temperature range
TOPR
-40 ~ +125
℃
Storage temperature range
TSTG
-40 ~ +125
℃
Junction temperature
TJ_Max
+150
℃
IF
1000
mA
IF
100
mA
mA
1500 mA for ≤ 10 ms
mA
VR
0.9
V
-
±8 KV HBM
Maximum Forward current[4]
(TS : 25 ℃)[5]
Minimum Forward current[4]
(TS : 25 ℃)[5]
Maximum Transient Peaked current
[6]
: 25 ℃)[5]
Reverse voltage
(TS
(TS
: 25 ℃)[5]
ESD Sensitivity[7]
* Notes
[4] Unpredictable performance may be resulted by driving the product at below Min. IF or above Max.
IF. But there will be no damage to the product.
[5] The measurement condition means that temperature dependence is excluded by applying pulse
current for under 25 ms.
[6] Duty 1/10 pulse with 10 ms.
[7] It is included the device to protect the product from ESD.
2015/09/11/Rev.06
- 6 -
SPHWHTA3N500
Typical Characteristics Graph
 Typical Spectrum : IF = 700 mA, TS = 25 °C[8]
 Typical Color vs Angle :
IF = 700 mA, TS = 25 °C[8]
* Notes
[8] The measurement condition means that temperature dependence is excluded by applying pulse
current for under 25 ms.
2015/09/11/Rev.06
- 7 -
SPHWHTA3N500
 Relative Luminous Flux & Forward Voltage vs Forward Current
[TS = 25 °C][9]
 Chromaticity Coordinate Shift vs Forward Current[9]
[IF = 700 mA, TS = 25 °C]
2015/09/11/Rev.06
- 8 -
SPHWHTA3N500
‧ Relative Luminous Flux & Forward Voltage vs Temperature[9]
 Color Shift vs Temperature[9] [IF = 700 mA]




* Notes
[9] The measurement condition means that temperature dependence is excluded by applying pulse
current for under 25 ms.
2015/09/11/Rev.06
- 9 -
SPHWHTA3N500
‧ Typical Radiant Pattern



‧ Max. Permissible Forward Current[10]
* Notes
[10] The measurement condition means that temperature dependence is excluded by applying pulse
current for under 25 ms.
2015/09/11/Rev.06
- 10 -
SPHWHTA3N500
 Mechanical Dimension[11]
[Top View]
Unit[mm]
[Side View]
[Bottom View]
[Front View]
‧ Electric Schematic Diagram
‧ Pick and Place
It is recommended to use a pick & place nozzle with inside diameter at 3.0 mm.
LED suction pressure : 570 ~ 590mmHg
‧ Material Information
LED Package = Silicone resin covered White GaN LED on AlN ceramic substrate
Electrode PAD = Au Plated PAD
This LED has built-in ESD protection device(s) connected in parallel to LED Chip(s).
* Notes
[11] Tolerance unless otherwise specified is ± 0.1 mm.
2015/09/11/Rev.06
- 11 -
SPHWHTA3N500
Soldering Conditions
‧ Pad Configuration & Solder Pad Layout
Unit[mm]
Solder resist
Solder paste stencil
Bare copper pattern
Recommended Solder Pad Layout
 Reflow Soldering Condition (Pb Free)
Reflow Frequency : 2 times max.
 Manual Soldering Condition
Not more than 5 seconds @MAX300℃, under soldering iron.(one time only)
2015/09/11/Rev.06
- 12 -
SPHWHTA3N500
Packing Information
‧ Tape and Reel[12]
Unit[mm]
* Note
[12] Unit : mm, LED taping quantity : 1,000EA / Reel.
 Reel
#Y4VR[7
SPHWHT3N500 V1S0X4
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
SLAW94001 / 1001 / 1,000 pcs
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
[Unit : mm]
A
180.0
B
-3.0
2015/09/11/Rev.06
60.0
C
+1.0
13.0
W1
±0.3
- 13 -
13.0
±0.5
W2
15.4
±1.0
SPHWHTA3N500
 Packing Process
Dimension of Transportation Box in mm
Width
Length
Height
Remark
225
250
190
7 inch type
2015/09/11/Rev.06
- 14 -
SPHWHTA3N500
Product Labeling Information
A B C DE F
SPHWHTA3N500
V1S0X4
Bin Code
V1S0X4
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
Part No.
SLAW94001 / 1001 / 1,000 pcs
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
Lot No.
1. Bin Code
AB
: Forward Voltage(VF) Bin
CD
: Chromaticity Coordinate Bin
EF
: Luminous Flux Bin
2. Lot No.
①②③④⑤⑥⑦⑧⑨ / 1ⓐⓑⓒ / 1,000 PCS
①
: Production Site (S:SAMSUNG KOREA, G:TIANJIN CHINA)
②
: L (LED)
③
: Product State (A:Normality, B:Bulk, C:First Production, R:Reproduction, S:Sample)
④
: Year (X:2013, Y:2014, Z:2015...)
⑤
: Month (1 ~ 9, A, B)
⑥
: Day (1 ~ 9, A, B ~ V)
⑦⑧⑨
: SAMSUNG ELECTRONICS Product number (1 ~ 999)
ⓐⓑⓒ
: Reel Number (1 ~ 999)
2015/09/11/Rev.06
- 15 -
SPHWHTA3N500
Reliability Test Conditions
For detailed Information please contact
your SAMSUNG Sales partner
2015/09/11/Rev.06
- 16 -
SPHWHTA3N500
Precaution
1) Absolute maximum ratings are set to prevent LED products from breaking due to extreme stress
(temperature, current, voltage, etc.). Usage conditions must never go above the ratings, nor any of
two of the factors reach the rating level simultaneously.
2) Please avoid touch or pressure on resin molded part in the products. To handle the products
directly, it is recommended to use non metallic tweezers.
3) Device should not be used in any type of fluid such as water, oil, organic solvent, etc. When
washing is required, IPA is recommended to use.
4) LEDs must be stored in a clean environment. If the LEDs are to be stored for 3 months or more
after being shipped from SAMSUNG ELECTRONICS, they should be packed by a sealed container
with nitrogen gas injected.
5) After bag is opened, device subjected to soldering, solder reflow, or other high temperature
processes must be :
a. Mounted within 672hours(LEVEL 2a) at an assembly line with a condition of no more than
30℃/60% RH,
b. Stored at < 10% RH.
6) Repack unused products with anti-moisture packing, fold to close any opening and then store in
a dry place.
7) Devices require baking before mounting, if humidity card reading is >60 % at 23±5 ℃.
8) Devices must be baked for 1 hour at 65±5 ℃, if baking is required.
9) The LEDs are sensitive to the static electricity and surge. It is recommended to use a wrist
band or anti-electrostatic glove when handling the LEDs. If voltage exceeding the absolute
maximum rating is applied to LEDs, it may cause damage or even destruction to LED devices.
Damaged LEDs may show some unusual characteristics such as increase in leak current, lowered
turn-on voltage, or abnormal lighting of LEDs at low current.
10) Prepare a ESD protective area by placing conductive mattress(106Ω ) and ionizer to remove any
static electricity.
11) VOCs (volatile organic compounds) may be occurred by adhesives, flux, hardener or organic
additives which is used in luminaires (fixture) and LED silicone bags are permeable to it. It may
lead a discoloration when LED expose to heat or light. This phenomenon can give a significant
loss of light emitted(output) from the luminaires (fixtures). In order to prevent these problems, we
recommend you to know the physical properties for the materials used in luminaires, It requires to
select carefully.
2015/09/11/Rev.06
- 17 -
SPHWHTA3N500
Hazardous Substance Analysis Report
2015/09/11/Rev.06
- 18 -
SPHWHTA3N500
Revision History
Date
Revision History
Author
Drawn
Approved
2012.12.18 Rev.00 Initial Edition - Preliminary
S.Y. GO
S.B. KWAK
2013.02.20 Rev.01 Precaution, Company information
S.Y. GO
S.B. KWAK
2013.06.21 Rev.02 Forward Voltage Bin
S.Y. GO
S.B. KWAK
2013.10.07 Rev.03 Dimension, Pick and Place
S.Y. GO
S.B. KWAK
2013.10.30 Rev.04 Packing Process
S.Y. GO
S.B. KWAK
2014.11.05 Rev.05 Cover Modification
S.Y. GO
S.B. KWAK
2015.09.11 Rev.06 Revise of Luminous Flux bin
S.Y. GO
S.B. KWAK
Company Information
US Samsung Semiconductor Inc.,
3655 N. First Street, San Jose CA 95134, USA
TEL. +1-408-544-4000
Europe
Samsung Electronics Germany GmbH, Samsung House,
Am Kronberger Hang 6, Schwalbach/Ts,Germany
TEL. +49-6196-66-0
Japan
Copyright @1995-2012
All rights reserved
Samsung Electronics
San #24, Nongseo-Dong, Giheung-Gu,
Yongin-City, Gyeongii-Do 446-711 Korea
http://www.samsung.com/sec/business/led
Sales Contact : [email protected]
2015/09/11/Rev.06
Samsung Japan Corporation SLED Team 10F, Shinagawa
Grand Central Tower 2-16-4, Kounan, Minato-ku, Tokyo
108-8240, Japan
TEL. +81-3-6369-6327
China (Tianjin Office in China)
Tianjin Samsung LED Co., LTD.
Weisi (6th) Rd., Micro-Electronics Industrial Park, Xiqing
District, Tianjin 300385, China
TEL. +86-755-8608-5550
- 19 -
Similar pages