PANASONIC FK3506010L

Doc No. TT4-EA-12624
Revision. 3
Product Standards
MOS FET
FK3506010L
FK3506010L
Silicon N-channel MOS FET
Unit : mm
For switching
FK330601 in SMini3 type package
2.0
0.3
0.13
3
 Features
1.25
2.1
 Low drive voltage : 2.5 V drive
 Halogen-free / RoHS compliant
(EU RoHS / UL-94 V-0 / MSL:Level 1 compliant)
1
 Marking Symbol : CV
2
0.9
 Packaging
Embossed type (Thermo-compression sealing) : 3 000 pcs / reel (standard)
(0.65)(0.65)
1.3
1. Gate
2. Source
3. Drain
 Absolute Maximum Ratings Ta = 25C
Parameter
Symbol
Drain-source voltage
Gate-source voltage
Drain current
Pulse drain current
Total power dissipation
Channel temperature
Operating ambient temperature
Storage temperature
VDS
VGS
ID
IDp
PD
Tch
Topr
Tstg
Rating
Unit
60
12
100
200
150
150
-40 to +85
-55 to +150
V
V
mA
mA
mW
C
C
C
Panasonic
JEITA
Code
SMini3-F2-B
SC-85
―
Internal Connection
(D)
3
1
(G)
2
(S)
Pin Name
1. Gate
2. Source
3. Drain
Page 1 of 5
Established : 2010-06-07
Revised
: 2013-07-08
Doc No. TT4-EA-12624
Revision. 3
Product Standards
MOS FET
FK3506010L
 Electrical Characteristics Ta = 25C  3C
Parameter
Symbol
Forward transfer admittance
Input capacitance
Output capacitance
Reverse transfer capacitance
*1
Turn-off time
*1
Note)
Min
VDSS
IDSS
IGSS
VTH
Drain-source ON resistance
Turn-on time
Conditions
ID = 1 mA, VGS = 0
VDS = 60 V, VGS = 0
VGS = 10 V, VDS = 0
ID = 1.0 A, VDS = 3.0 V
ID = 10 mA, VGS = 2.5 V
RDS(on)
ID = 10 mA, VGS = 4.0 V
|Yfs|
ID = 10 mA, VDS = 3.0 V
Ciss
Coss
VDS = 3 V, VGS = 0, f = 1 MHz
Crss
VDD = 3 V, VGS = 0 to 3 V,
ton
ID = 10 mA
VDD = 3 V, VGS = 3 to 0 V,
toff
ID = 10 mA
Drain-source breakdown voltage
Drain-source cutoff current
Gate-source cutoff current
Gate threshold voltage
Typ
Max
60
0.9
20
1.2
8
6
60
12
7
3
1.0
10
1.5
15
12
Unit
V
A
A
V


mS
pF
pF
pF
100
ns
100
ns
1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 Measuring methods for transistors.
2. *1 Turn-on and Turn-off test circuit
VDD=3V
ID=10mA
RL=300Ω
90%
V GS
D
10%
10%
Vin
VGS=0~3V
Vout
G
V out
50Ω
S
90%
ton
toff
Page 2 of 5
Established : 2010-06-07
Revised
: 2013-07-08
Doc No. TT4-EA-12624
Revision. 3
Product Standards
MOS FET
FK3506010L
ID - VDS
ID - VGS
0.1
0.1
0.08
Drain current ID (A)
Drain Current ID (A)
4.0 V
0.08
2.5 V
0.06
0.04
0.02
Ta= 85 ℃
0.06
25 ℃
0.04
0.02
VGS = 2.0 V
0
-40 ℃
0
0
0.5
1
1.5
0
VDS - VGS
1
1.5
2
2.5
3
RDS(on) - ID
100
Drain-source On-state Resistance
RDS(on) ()
0.3
Drain-source Voltage VDS (V)
0.5
Gate-source voltage VGS (V)
Drain-source Voltage VDS (V)
0.2
5 mA
ID = 20 mA
0.1
10 mA
0
2
3
4
5
Gate-source voltage VGS (V)
2.5 V
10
VGS = 4.0 V
1
1
10
100
Drain Current ID (mA)
Capacitance - VDS
Capacitance C (pF)
100
Ciss
10
Coss
1
Crss
0.1
0.1
1
10
100
Drain-source Voltage VDS (V)
Page 3 of 5
Established : 2010-06-07
Revised
: 2013-07-08
Doc No. TT4-EA-12624
Revision. 3
Product Standards
MOS FET
FK3506010L
Vth - Ta
RDS(on) - Ta
12
Drain-source On-resistance
RDS(on) (mΩ)
Gate-source Threshold Voltage (V)
2.5
2
1.5
1
0.5
0
10
VGS = 2.5 V
8
6
4.0 V
4
2
0
-50
0
50
100
150
-50
0
Temperature (℃)
100
150
PD - Ta
0.2
Total Power Dissipation PD (W)
50
Temperature (℃)
0.15
0.1
0.05
0
0
50
100
150
Temperature Ta (C)
Rth - tsw
Safe Operating Area
10
Drain Current ID (A)
Thermal resistance Rth (C/W)
1000
100
1
IDp = 0.2 A
0.1
1 ms
10 ms
100 ms
0.01
0.001
Operation in this area
is limited by RDS(on)
1s
Ta = 25 C,
Glass epoxy board (25.4  25.4  t0.8mm)
coated with copper foil,
DC
2
which has more than 300mm .
10
0.1
1
10
Pulse Width tsw (s)
100
1000
0.0001
0.01
0.1
1
10
100
Drain-source Voltage VDS (V)
Page 4 of 5
Established : 2010-06-07
Revised
: 2013-07-08
Doc No. TT4-EA-12624
Revision. 3
Product Standards
MOS FET
FK3506010L
SMini3-F2-B
Unit : mm
2.0±0.2
+0.05
0.13-0.02
+0.05
0.30-0.02
(5°)
2
(0.65) (0.65)
1.3±0.1
0.425±0.050
1
2.1±0.1
1.25±0.10
3
(0.49)
0.9±0.1
0 to 0.1
(0.89)
(5°)
 Land Pattern (Reference) (Unit : mm)
1.9
0.8
0.9
1.3
Page 5 of 5
Established : 2010-06-07
Revised
: 2013-07-08
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semiconductors described in this book
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Standards in advance to make sure that the latest specifications satisfy your requirements.
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defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
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