Data Sheet

NX5P2553
Precision adjustable current-limited power switch
Rev. 1 — 6 July 2015
Product data sheet
1. General description
The NX5P2553 is a precision adjustable current-limited power switch. The device
includes undervoltage lockout, overtemperature, and reverse bias protection circuits
designed to isolate the switch terminals when a fault condition occurs. It also has an
overcurrent protection circuit to limit the output current. The device features two power
switch terminals, one input (VIN), and one output (VOUT). It also consists of a current limit
input (ILIM) for defining the overcurrent limit, an open-drain fault output (FAULT) to
indicate when a fault condition has occurred, and an enable input (EN) to control the state
of the switch.
The overcurrent limit threshold can be programmed between 85 mA and 1.8 A using an
external resistor between the ILIM and GND pins. The device has built-in soft-start. This
feature controls the output rise time by minimizing current surges when the switch is
enabled.
Designed for operation from 2.5 V to 5.5 V, it is used in power domain isolation
applications to protect from out of range operation. The enable input includes integrated
logic level translation making the device compatible with lower voltage processors and
controllers.
2. Features and benefits













Wide supply voltage range from 2.5 V to 5.5 V
ISW maximum 1.5 A continuous current
6 % current-limit accuracy at 1.8 A (typical)
Meets USB current-limiting requirements
Adjustable current limit from 85 mA to 1800 mA (typical)
Constant current mode in overcurrent situation
Overtemperature protection
Very low ON resistance: 95 m (typical) for TSOP6 package
Fast short-circuit switch-off response (2.0 s typical)
ILIM short detection
Reverse input-output voltage protection
Built-in soft-start
ESD protection:
 HBM ANSI/ESDA/JEDEC JS-001-2012 Class 2 exceeds 2000 V
 CDM JESD22-C101D exceeds 500 V
 IEC61000-4-2 contact discharge exceeds 8 kV for VOUT (with external
capacitance)
 Specified from 40 C to +85 C ambient temperature
NX5P2553
NXP Semiconductors
Precision adjustable current-limited power switch
3. Applications
 USB port/hubs
 Digital TV and set-top boxes
 VoIP phones
4. Ordering information
Table 1.
Ordering information
Type number
Package
Temperature range Name
Description
Version
NX5P2553GV
40 C to +85 C
TSOP6
plastic surface-mounted package (TSOP6); 6 leads
SOT457
NX5P2553GU
40 C to +85 C
HXSON6
plastic, thermal enhanced extremely thin small outline
package; no leads; 6 terminals; body 1.6  1.6  0.5 mm
SOT1189-1
NX5P2553GU6 40 C to +85 C
HXSON6
plastic, thermal enhanced extremely thin small outline
package; no leads; 6 terminals; body 2.0  2.0  0.5 mm
SOT1348-1
5. Marking
Table 2.
Marking codes
Type number
Marking code[1]
NX5P2553GV
x53
NX5P2553GU
x53
NX5P2553GU6
x53
[1]
The pin 1 indicator is on the lower left corner of the device, below the marking code.
6. Functional diagram
reverse
voltage
comparator
CS
VIN
VOUT
current
sense
4-ms
DEGLITCH
CHARGE
PUMP
EN
DRIVER
CURRENT
LIMIT
FAULT
UVLO
GND
ILIM
THERMAL
SENSE
8-ms DEGLITCH
aaa-007801
Fig 1.
Logic diagram
NX5P2553
Product data sheet
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Rev. 1 — 6 July 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
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NX5P2553
NXP Semiconductors
Precision adjustable current-limited power switch
7. Pinning information
7.1 Pinning
NX5P2553
NX5P2553
VIN
1
6
VOUT
GND
2
5
ILIM
EN
3
4
FAULT
VOUT
1
6
VIN
ILIM
2
5
GND
FAULT
3
4
EN
(1)
aaa-011069
Transparent top view
aaa-011068
(1) This pad is not a supply pin. The substrate is attached to
the pad using conductive die attach material. It is used
for heat sink purpose. The solder land should be
connected to GND.
Fig 2.
Pin configuration SOT457 (TSOP6)
Fig 3.
Pin configuration SOT1189-1 and SOT1348-1
(HXSON6)
7.2 Pin description
Table 3.
Pin description
Symbol
Pin
TSOP6
HXSON6
VOUT
6
1
output voltage
ILIM
5
2
current limiter I/O
FAULT
4
3
fault condition indicator (open-drain; active LOW)
EN
3
4
enable input (active HIGH)
GND
2
5
ground (0 V)
VIN
1
6
input voltage[1]
[1]
Description
Connect a decoupling capacitance with a minimum value of 0.1 F as close as possible to the input VIN.
8. Functional description
Table 4.
Function table[1]
Input EN
Switch
L
switch OFF
H
switch ON
[1]
H = HIGH voltage level; L = LOW voltage level.
NX5P2553
Product data sheet
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Rev. 1 — 6 July 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
3 of 24
NX5P2553
NXP Semiconductors
Precision adjustable current-limited power switch
8.1 EN input
When EN is set to LOW, the N-channel MOSFET is disabled and the device enters a
low-power mode. In low-power mode, all protection circuits are disabled and the FAULT
output is set to high-impedance state. When EN is set to HIGH, all protection circuits are
enabled. If no fault conditions exist, the N-channel MOSFET is enabled.
8.2 UnderVoltage LockOut (UVLO)
The UVLO circuit is active until VIN > 2.35 V. It disables the N-channel MOSFET and
switches the device back to low-power mode. It occurs irrespective of the logic level on
the EN pin. Once VIN > 2.35 V, the EN pin controls the N-channel MOSFET state. The
UVLO circuit remains active in low-power mode.
8.3 ILIM
The OverCurrent Protection (OCP) circuit trigger value Iocp is set using an external
resistor connected to the ILIM pin as shown in Figure 8. If EN is set to HIGH and the ILIM
pin is grounded, the N-channel MOSFET is disabled and the FAULT output is set to LOW.
8.4 OverCurrent Protection (OCP)
Three possible overcurrent conditions can occur. They are:
• Overcurrent at start-up, ISW > Iocp when enabling the N-channel MOSFET
• Overcurrent when enabled, ISW > Iocp when the N-channel MOSFET is enabled
• Short-circuit when enabled, ISW > 4  Iocp (typical)
8.4.1 Overcurrent at start-up
If the device senses a short or overcurrent while enabling the N-channel MOSFET, OCP is
triggered. It limits the output current to Iocp and after the deglitch time sets the FAULT
output to LOW, as shown in Figure 22. Increased power dissipation combined with the
OTP may lead to temperature cycling.
8.4.2 Overcurrent when enabled
When enabled, if the device senses ISW > Iocp, the OCP is triggered. It limits the output
current to Iocp and after the deglitch time sets the FAULT output to LOW. Limiting the
output current reduces VO(VOUT), as shown in Figure 20 and Figure 21. Increased power
dissipation combined with the OTP may lead to temperature cycling.
8.4.3 Short-circuit when enabled
When enabled, if the device senses ISW > 4  Iocp, a short-circuit is detected. The device
disables the N-channel MOSFET immediately. It then enables the N-channel MOSFET,
output current is limited to Iocp and after the deglitch time, the FAULT output is set to LOW
as shown in Figure 16 to Figure 19. Increased power dissipation combined with the OTP
may lead to temperature cycling.
8.5 Reverse-Voltage Protection (RVP)
If VOUT exceeds VIN by 140 mV for the deglitch time, RVP protects the device by
disabling the N-channel MOSFET. When the reverse voltage condition is removed for the
deglitch time, the N-channel MOSFET is enabled as shown in Figure 14 and Figure 15.
NX5P2553
Product data sheet
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Rev. 1 — 6 July 2015
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NX5P2553
NXP Semiconductors
Precision adjustable current-limited power switch
8.6 FAULT output
The FAULT pin is an open-drain output that requires an external pull-up resistor. If any of
the protection circuits are activated, FAULT is set to LOW to indicate that a fault has
occurred. It returns to the high-impedance state automatically once the fault condition is
removed.
8.7 OverTemperature Protection (OTP)
If the device temperature exceeds 155 C when EN is set HIGH and the device is not in
current limit, OTP triggers. It disables the N-channel MOSFET and sets the FAULT pin to
LOW. Any transition on the EN pin has no effect. Once the device temperature decreases
below 125 C, the device returns to the defined state.
If the device temperature exceeds 130 C when EN is set HIGH and the device is in
current limit, OTP triggers. It disables the N-channel MOSFET and sets the FAULT pin to
LOW. Any transition on the EN pin has no effect. Once the device temperature decreases
below 118 C, the device returns to the defined state.
9. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
input voltage
VI
output voltage
VO
VSW
switch voltage
IIK
input clamping current
Conditions
Min
Max
Unit
inputs EN and ILIM
[1]
0.35
+6.5
V
input VIN
[2]
0.35
+6.5
V
output FAULT
[1]
0.35
VI(VIN)
V
output VOUT
[2]
0.35
+6.5
V
[2]
6.5
+6.5
V
input EN; VI(EN) < 0.35 V
50
-
mA
input ILIM; VI(ILIM) < 0.35 V
50
-
mA
Isource
source current
input ILIM
-
1
mA
IOK
output clamping current
VO < 0 V
50
-
mA
ISK
switch clamping current
input VIN; VI(VIN) < 0.35 V
50
-
mA
50
-
mA
-
1900
mA
40
+150
C
output VOUT; VO(VOUT) < 0.35 V
ISW
switch current
Tj(max)
maximum junction
temperature
Tstg
storage temperature
total power dissipation
Ptot
VSW > 0.35 V
[3]
65
+150
C
NX5P2553GV
[4]
-
300
mW
NX5P2553GU
[4]
-
315
mW
NX5P2553GU6
[4]
-
340
mW
[1]
If the input current rating is observed, the minimum input voltage rating may be exceeded.
[2]
If the switch clamping current rating is observed, the minimum and maximum switch voltage ratings may be exceeded.
[3]
Internally limited.
[4]
The (absolute) maximum power dissipation depends on the junction temperature Tj. Higher power dissipation is allowed with lower
ambient temperatures. The conditions to determine the specified values are Tamb = 85 C and the use of a two layer PCB.
NX5P2553
Product data sheet
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Rev. 1 — 6 July 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
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NX5P2553
NXP Semiconductors
Precision adjustable current-limited power switch
10. Recommended operating conditions
Table 6.
Operating conditions
Symbol Parameter
input voltage
VI
switch current
ISW
IO(sink)
output sink current
Conditions
Min
Max
Unit
input VIN
2.5
5.5
V
input EN
0
5.5
V
Tj = 40 C to +125 C
0
1.2
A
Tj = 40 C to +105 C
0
1.5
A
10
-
mA
15
232
k
0.1
-
F
40
+85
C
ISW < 1.2 A
40
+125
C
ISW < 1.5 A
40
+105
C
output FAULT
[1]
RILIM
current limit resistance
input ILIM
VIN and VOUT to GND
Cdec
decoupling capacitance
Tamb
ambient temperature
Tj
junction temperature
[1]
Current-limit threshold resistor range from ILIM to GND.
11. Thermal characteristics
Table 7.
Symbol
Rth(j-a)
[1]
Thermal characteristics
Parameter
Conditions
thermal resistance from junction to
ambient
Typ
Unit
NX5P2553GV
[1]
133
K/W
NX5P2553GU
[1]
105
K/W
NX5P2553GU6
[1]
93
K/W
Rth(j-a) is dependent upon board layout. To minimize Rth(j-a), ensure that all pins have a solid connection to larger copper layer areas. In
multi-layer PCBs, the second layer should be used to create a large heat spreader area below the device. Avoid using solder-stop
varnish under the device.
12. Static characteristics
Table 8.
Static characteristics
At recommended operating conditions; VI(VIN) = VI(EN) and RFAULT = 10 k unless otherwise specified; voltages are
referenced to GND (ground = 0 V); see Figure 4, Figure 5, Figure 6, and Figure 11.
Symbol
Parameter
Conditions
Min
Typ[1]
Max
Unit
VIH
HIGH-level input voltage
EN input; VI(VIN) = 2.5 V to 5.5 V
1.3
-
-
V
VIL
LOW-level input voltage
EN input; VI(VIN) = 2.5 V to 5.5 V
-
-
0.56
V
ILI
input leakage current
EN input; VI(VIN) = 2.5 V to 5.5 V;
VI(EN) = 0 V or 5.5 V
-
-
0.5
A
IVIN
supply current
VOUT open; VI(VIN) = 5.5 V
EN = GND (low-power mode)
-
0.3
1
A
EN = VI(VIN); Rext = 20 k
-
160
225
A
IOFF
power-off leakage current
NX5P2553
Product data sheet
EN = VI(VIN); Rext = 210 k
-
135
200
A
VOUT; Tj = 25 C; VI(VIN) = 0 V;
VO(VOUT) = 5.5 V
-
0.1
1
A
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NX5P2553
NXP Semiconductors
Precision adjustable current-limited power switch
Table 8.
Static characteristics …continued
At recommended operating conditions; VI(VIN) = VI(EN) and RFAULT = 10 k unless otherwise specified; voltages are
referenced to GND (ground = 0 V); see Figure 4, Figure 5, Figure 6, and Figure 11.
Min
Typ[1]
Max
Unit
OFF-state leakage current VOUT; Tj = 25 C; VI(VIN) = 5.5 V;
VO(VOUT) = 0 V to 5.5 V
-
0.1
1
A
Vtrip
trip level voltage
RVP; VI(VIN) = 2.5 V to 5.5 V
80
140
195
mV
VUVLO
undervoltage lockout
voltage
VIN input
-
2.35
2.45
V
Vhys(UVLO)
undervoltage lockout
hysteresis voltage
-
25
-
mV
VOL
LOW-level output voltage
FAULT; VI(VIN) = 2.5 V to 5.5 V;
IO = 1 mA
-
-
180
mV
IOZ
OFF-state output current
FAULT; VI(VIN) = 5.5 V;
VO(FAULT) = 5.5 V
-
-
1
A
Symbol
Parameter
IS(OFF)
[1]
Conditions
Typical values are measured at Tj = 25 C.
12.1 Graphs
aaa-011070
480
IVIN
(nA)
aaa-011072
200
IVIN
(μA)
412
(3)
(2)
160
(1)
344
120
(2)
276
80
(1)
208
40
140
-40
-15
10
35
60
0
-50
85
-10
30
70
Tj (°C)
110
150
Tj (°C)
VI(EN) = VI(VIN); RILIM = 20 k.
VI(EN) = GND; RILIM = 20 k.
(1) VI(VIN) = 2.5 V
(1) VI(VIN) = 2.5 V
(2) VI(VIN) = 5.5 V
(2) VI(VIN) = 5.0 V
(3) VI(VIN) = 5.5 V
Fig 4.
Typical supply current versus junction
temperature when VI(EN) = GND
NX5P2553
Product data sheet
Fig 5.
Typical supply current versus junction
temperature when VI(EN) = VI(VIN)
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Rev. 1 — 6 July 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
7 of 24
NX5P2553
NXP Semiconductors
Precision adjustable current-limited power switch
aaa-011073
2.4
VUVLO
(V)
2.36
(1)
2.32
(2)
2.28
2.24
2.2
-50
-10
30
70
110
150
Tj (°C)
RILIM = 20 k.
(1) Rising edge
(2) Falling edge
Fig 6.
Typical undervoltage lockout voltage versus junction temperature
12.2 ON resistance
Table 9.
ON resistance
VI(VIN) = VI(EN) and RFAULT = 10 k unless otherwise specified; voltages are referenced to GND (ground = 0 V); see Figure 7
and Figure 11.
Symbol
Parameter
Conditions
RON
ON resistance
VI(VIN) = 2.5 V to 5.5 V
NX5P2553
Product data sheet
Min
Typ
Max
Unit
NX5P2553GU; Tj = 25 C
-
100
115
m
NX5P2553GU; Tj = 40 C to +105 C
-
-
140
m
NX5P2553GU; Tj = 40 C to +125 C
-
-
150
m
NX5P2553GU6; Tj = 25 C
-
115
125
m
NX5P2553GU6; Tj = 40 C to +105 C
-
-
150
m
NX5P2553GU6; Tj = 40 C to +125 C
-
-
160
m
NX5P2553GV; Tj = 25 C
-
95
100
m
NX5P2553GV; Tj = 40 C to +125 C
-
-
135
m
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Rev. 1 — 6 July 2015
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NX5P2553
NXP Semiconductors
Precision adjustable current-limited power switch
12.3 ON resistance graph
aaa-011074
160
(3)
RON
(mΩ)
(2)
(1)
120
80
40
0
-50
-10
30
70
110
150
Tj (°C)
RILIM = 20 k.
(1) NX5P2553GV
(2) NX5P2553GU
(3) NX5P2553GU6
Fig 7.
Typical ON resistance versus junction temperature
12.4 Current limit
Table 10. Characteristics
VI(VIN) = VI(EN) and RFAULT = 10 k unless otherwise specified; voltages are referenced to GND (ground = 0 V); see Figure 8,
Figure 11, Figure 23 and Figure 24.
Symbol
Parameter
Conditions
Iocp
overcurrent
protection current
VI(VIN) = 2.5 V to 5.5 V
[1]
Min
Typ[1]
Max
Unit
RILIM = 15 k; Tj = 40 C to +105 C
1650
1780
1900
mA
RILIM = 20 k; Tj = 25 C
1230
1320
1430
mA
RILIM = 20 k; Tj = 40 C to +125 C
1215
1320
1450
mA
RILIM = 49.9 k; Tj = 25 C
480
530
560
mA
RILIM = 49.9 k; Tj = 40 C to +125 C
465
530
575
mA
RILIM = 210 k; Tj = 40 C to +125 C
95
140
180
mA
ILIM shorted to VIN; Tj = 40 C to +125 C
50
85
115
mA
Typical values are measured at Tj = 25 C.
NX5P2553
Product data sheet
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Rev. 1 — 6 July 2015
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NX5P2553
NXP Semiconductors
Precision adjustable current-limited power switch
12.5 Current limit graph
aaa-011075
1800
Iocp
(mA)
1500
1200
900
600
300
0
15
60
105
150
195
240
RILIM (kΩ)
Fig 8.
Typical overcurrent protection current versus external resistor value RILIM
12.6 Thermal shutdown
Table 11. Thermal shutdown
VI(VIN) = VI(EN) and RFAULT = 10 k unless otherwise specified; voltages are referenced to GND (ground = 0 V); see Figure 11.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Tth(ots)
overtemperature shutdown
threshold temperature
in normal mode
155
-
-
C
in current limit mode
130
-
-
C
Tth(ots)hys
overtemperature shutdown
threshold temperature hysteresis
in normal mode
-
30
-
C
in current limit mode
-
12
-
C
13. Dynamic characteristics
Table 12. Characteristics
At recommended operating conditions; VI(VIN) = VI(EN) and RFAULT = 10 k unless otherwise specified; voltages are referenced
to GND (ground = 0 V); see Figure 9, Figure 10, Figure 11, Figure 12, Figure 13, Figure 14, Figure 15, Figure 16, and
Figure 22.
Symbol
Parameter
Conditions
Min
Typ[1]
Max
Unit
tTLH
LOW to HIGH output transition
time
VOUT; VI(VIN) = 5.5 V
-
1.2
1.5
ms
VOUT; VI(VIN) = 2.5 V
-
0.5
1.0
ms
HIGH to LOW output transition
time
VOUT; VI(VIN) = 5.5 V
0.2
-
0.5
ms
VOUT; VI(VIN) = 2.5 V
0.2
-
0.5
ms
ten
enable time
EN to VOUT;
VI(VIN) = 5.5 V
[2]
-
-
3
ms
tdis
disable time
EN to VOUT;
VI(VIN) = 5.5 V
[3]
-
-
3
ms
tTHL
NX5P2553
Product data sheet
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Rev. 1 — 6 July 2015
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NX5P2553
NXP Semiconductors
Precision adjustable current-limited power switch
Table 12. Characteristics …continued
At recommended operating conditions; VI(VIN) = VI(EN) and RFAULT = 10 k unless otherwise specified; voltages are referenced
to GND (ground = 0 V); see Figure 9, Figure 10, Figure 11, Figure 12, Figure 13, Figure 14, Figure 15, Figure 16, and
Figure 22.
Symbol
Parameter
Conditions
Min
Typ[1]
Max
Unit
toff
turn-off time
short-circuit;
VI(VIN) = 5 V
-
2
-
s
RVP; VI(VIN) = 5 V
3
5
7
ms
FAULT; OCP;
VI(VIN) = 5 V
5
8.7
12
ms
FAULT; RVP;
VI(VIN) = 5 V
2
4.4
6
ms
deglitch time
tdegl
[1]
Typical values are measured at Tj = 25 C.
[2]
ten is the same as tPZH.
[3]
tdis is the same as tPHZ.
13.1 Waveform and test circuits
VI
EN input
VM
GND
tPZH
tPHZ
VOH
VX
VOUT output
VY
GND
tTLH
tTHL
aaa-011076
Measurement points are given in Table 13.
Logic level: VOH is the typical output voltage that occurs with the output load.
Fig 9.
Table 13.
Switching times and rise and fall times
Measurement points
Supply voltage
EN input
Output
VI(VIN)
VM
VX
VY
2.5 V
0.5  VI(EN)
0.9  VOH
0.1  VOH
5.5 V
0.5  VI(EN)
0.9  VOH
0.1  VOH
NX5P2553
Product data sheet
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Rev. 1 — 6 July 2015
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11 of 24
NX5P2553
NXP Semiconductors
Precision adjustable current-limited power switch
EN
VOUT
VI
G
VIN
VEXT
CL
RL
aaa-011077
Test data is given in Table 14.
Definitions test circuit:
RL = Load resistance.
CL = Load capacitance including jig and probe capacitance.
VEXT = External voltage for measuring switching times.
Fig 10. Test circuit for measuring switching times
Table 14.
Test data
Supply voltage
EN input
Load
VEXT
VI(EN)
CL
RL
2.5 V
0 V to VI(VIN)
1 F
100 
5.5 V
0 V to VI(VIN)
1 F
100 
VIN
VIN
10 kΩ
FAULT signal
control signal
VOUT
VOUT
150 μF
ILIM
10 μF
FAULT
EN
RILIM
GND
aaa-007803
Fig 11. Typical characteristics reference schematic
NX5P2553
Product data sheet
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NXP Semiconductors
Precision adjustable current-limited power switch
aaa-011079
5
(1)
VO(VOUT)
VI(EN)
(V) 4
1.4
IVIN
(A)
1.2
aaa-011080
5
VO(VOUT)
VI(EN)
(V)
4
(1)
1
(2)
3
0.8
0.6
2
1.4
IVIN
(A)
1.2
1
3
0.8
0.6
2
(2)
(3)
0.4
1
0.4
1
(3)
0.2
0
0
1
1
2
3
0.2
0
4
0
1
1
2
3
4
t (ms)
t (ms)
VI(VIN) = 5 V; RL = 5 ; RILIM = 20 k.
VI(VIN) = 5 V; RL = 5 ; RILIM = 20 k.
(1) VO(VOUT)
(1) VO(VOUT)
(2) IVIN
(2) IVIN
(3) VI(EN)
(3) VI(EN)
Fig 12. Typical enable time
Fig 13. Typical disable time
aaa-011859
VI(VIN), 6
VO(VOUT)
VO(FAULT)
(V) 5
RVP detected
(1)
(2)
4
(4)
3
2
1.5
IVIN
(A)
1
aaa-011882
VI(VIN), 6
VO(VOUT)
VO(FAULT)
(V) 5
0.5
4
0
3
-0.5
2
RVP released
(1)
(2)
1.5
IVIN
(A)
1
0.5
(4)
0
-0.5
(3)
1
(3)
0
0
5
10
-1
1
-1.5
0
15
-1
-1.5
0
t (ms)
VI(VIN) = 5 V; RILIM = 20 k; RL = 5 .
(2) VI(VIN)
(2) VI(VIN)
(3) VO(FAULT)
(3) VO(FAULT)
(4) IVIN
(4) IVIN
Product data sheet
15
20
VI(VIN) = 5 V; RILIM = 20 k; RL = 10 .
(1) VO(VOUT)
NX5P2553
10
t (ms)
(1) VO(VOUT)
Fig 14. Reverse-voltage protection response
5
Fig 15. Reverse-voltage protection recovery
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NX5P2553
NXP Semiconductors
Precision adjustable current-limited power switch
aaa-011081
(2)
5
VO(VOUT)
VO(FAULT) (1)
(V)
4
1.6
IVIN
(A)
1.4
(3)
1.2
aaa-011082
(2)
5
VO(VOUT)
VO(FAULT)
(V)
4
(1)
1.2
1
(3)
1
(3)
3
1.6
IVIN
(A)
1.4
3
0.8
0.6
2
0.8
0.6
2
0.4
1
0.4
1
short-circuit applied
short-circuit removed
0.2
0.2
(1)
0
0
1
5
10
15
0
20
0
1
50
100
t (ms)
t (ms)
VI(VIN) = 5 V; RILIM = 20 k; RL = 5 .
VI(VIN) = 5 V; RILIM = 20 k; RL = 5 .
(1) VO(VOUT)
(1) VO(VOUT)
(2) VO(FAULT)
(2) VO(FAULT)
(3) IVIN
(3) IVIN
Fig 16. Full load to short-circuit response
Fig 17. Short-circuit to full load response
aaa-011083
(1)
5
aaa-011084
3
IVIN
(A)
(2)
VO(VOUT)
VO(FAULT)
(V)
4
2.5
(1)
IVIN
(A)
VO(VOUT)
VO(FAULT)
(V)
4
2.5
(2)
(1)
2
3
3
5
2
3
1.5
1.5
(3)
(3)
2
1
1
short-circuit applied
2
0.5
1
0
0
1
short-circuit
removed
(1)
(1) (2)
0
0
5
0.5
10
15
20
0
0
10
20
30
t (ms)
VI(VIN) = 5 V; RILIM = 20 k.
60
VI(VIN) = 5 V; RILIM = 20 k.
(1) VO(VOUT)
(2) VO(FAULT)
(2) VO(FAULT)
(3) IVIN
(3) IVIN
Fig 18. No-load to short-circuit response
Product data sheet
50
t (ms)
(1) VO(VOUT)
NX5P2553
40
Fig 19. Short-circuit to no-load response
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NX5P2553
NXP Semiconductors
Precision adjustable current-limited power switch
aaa-011085
5
VO(VOUT)
VO(FAULT)
(V)
4
aaa-011086
1.6
IVIN
(A)
1.4
(2)
5
VO(VOUT)
VO(FAULT)
(V)
4
(3)
1.2
1.6
IVIN
(A)
1.4
(3)
1.2
1
1
3
3
0.8
0.8
0.6
2
(1)
0.6
2
load removed
(1)
0.4
0.4
1
1
load applied
0.2
0.2
(2)
0
0
0
50
0
100
0
0
5
10
15
20
25
t (ms)
30
t (ms)
VI(VIN) = 5 V; RILIM = 20 k; RL = 1 .
VI(VIN) = 5 V; RILIM = 20 k; RL = 1 .
(1) VO(VOUT)
(1) VO(VOUT)
(2) VO(FAULT)
(2) VO(FAULT)
(3) IVIN
(3) IVIN
Fig 20. 1  load to no-load response
Fig 21. No-load to 1  load response
aaa-011087
5
3
IVIN
(A)
(2)
VO(VOUT)
VO(FAULT)
(V)
4
2.5
2
3
1.5
(3)
2
1
1
0.5
(1)
0
0
1
5
10
15
20
t (ms)
VI(VIN) = 5 V; RILIM = 20 k.
(1) VO(VOUT)
(2) VO(FAULT)
(3) IVIN
Fig 22. Device enabled into short-circuit
NX5P2553
Product data sheet
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Rev. 1 — 6 July 2015
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NX5P2553
NXP Semiconductors
Precision adjustable current-limited power switch
aaa-011216
1400
Iocp
(mA)
(3)
Iocp
(mA)
(1)
(2)
(3)
1120
aaa-011217
160
(2)
(1)
120
840
80
560
40
280
0
0
0
100
VOUT-VIN (mV)
200
0
100
200
VOUT-VIN (mV)
VI(VIN) = 5.5 V; RILIM = 20 k.
VI(VIN) = 5.5 V; RILIM = 200 k.
(1) Tamb = 40 C
(1) Tamb = 40 C
(2) Tamb = +25 C
(2) Tamb = +25 C
(3) Tamb = +125 C
(3) Tamb = +125 C
Fig 23. Switch current versus switch voltage
Fig 24. Switch current versus switch voltage
14. Application information
14.1 Application diagram
5V
USB input
100 kΩ
VIN
0.1 μF
VOUT
EN
control signal
USB
port
120 μF
ILIM
10 μF
FAULT
FAULT signal
USB data
RILIM
20 kΩ
GND
aaa-007802
For the IEC61000-4-2 contact discharge test, the 10 F input capacitance is not needed.
Fig 25. Application diagram
14.2 Best practices
In order to avoid product damage, the device should always operate within the boundaries
given in Section 9. However, in applications with high switching currents, these limits
might be violated during transients even when the static values are well within the limiting
values. The device includes soft-start which limits in-rush current when enabling the
N-channel MOSFET. This feature does not limit current transients due to load change
when the N-channel MOSFET is already enabled.
The following aspects can be taken as guideline:
NX5P2553
Product data sheet
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NX5P2553
NXP Semiconductors
Precision adjustable current-limited power switch
• Widen the circuit board traces between:
– Power supply and VIN input
– VOUT output and load connection (USB plug)
– Load GND (USB plug) and power supply GND as much as possible. Define a
Kelvin point in the GND line, close to the product and have the device GND
connected to it.
• Use combination of larger and smaller value capacitors with low ESR at the VIN input
and the VOUT output. Ensure that wires to the VIN input, VOUT output and the Kelvin
point are short. Wires behave like coils. Transient currents (e.g. as a result of a short)
may lead to high positive or negative inductance voltages. The carefully routed
high-current path and the short wired capacitors at the VIN input and the VOUT output
keeps these voltages away from the product.
• Load transients affect the supply of the application. Load transients result from the
switch enable and disable process as well as load jumps (application of or removal of
load). The supply might react to load transients with voltage jumps that exceed the
Limiting values. If such voltage jumps are larger, the capacitors at the VIN input and
the VOUT output might not be able to filter them. A strong 6 V Zener diode between
VIN and GND might be considered. Improving the design of the supply is a better
solution.
NX5P2553
Product data sheet
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NX5P2553
NXP Semiconductors
Precision adjustable current-limited power switch
15. Package outline
Plastic surface-mounted package (TSOP6); 6 leads
D
SOT457
E
B
y
A
HE
6
5
X
v M A
4
Q
pin 1
index
A
A1
c
1
2
3
Lp
bp
e
w M B
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
bp
c
D
E
e
HE
Lp
Q
v
w
y
mm
1.1
0.9
0.1
0.013
0.40
0.25
0.26
0.10
3.1
2.7
1.7
1.3
0.95
3.0
2.5
0.6
0.2
0.33
0.23
0.2
0.2
0.1
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
SOT457
JEITA
SC-74
EUROPEAN
PROJECTION
ISSUE DATE
05-11-07
06-03-16
Fig 26. Package outline SOT457 (TSOP6)
NX5P2553
Product data sheet
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Rev. 1 — 6 July 2015
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NX5P2553
NXP Semiconductors
Precision adjustable current-limited power switch
HXSON6: plastic, thermal enhanced extremely thin small outline package; no leads;
6 terminals; body 1.6 x 1.6 x 0.5 mm
SOT1189-1
X
A
B
D
E
A
A1
A3
terminal 1
index area
detail X
e1
terminal 1
index area
e
1
3
C
C A B
C
v
w
b
y1 C
y
L
k
Eh
6
4
Dh
0
1
scale
Dimensions
Unit(1)
mm
max
nom
min
2 mm
A
A1
0.5
0.05
A3
b
0.30
0.127 0.25
0.20
0.00
D
Dh
E
Eh
1.7
1.6
1.5
1.3
1.2
1.1
1.7
1.6
1.5
0.6
0.5
0.4
e
e1
0.5
k
L
v
0.1
0.2
0.35
0.30
0.25
1
w
y
y1
0.05 0.05 0.05
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
References
Outline
version
IEC
JEDEC
JEITA
SOT1189-1
---
---
---
sot1189-1_po
European
projection
Issue date
10-08-02
10-10-11
Fig 27. Package outline SOT1189-1 (HXSON6)
NX5P2553
Product data sheet
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19 of 24
NX5P2553
NXP Semiconductors
Precision adjustable current-limited power switch
HXSON6: plastic, thermal enhanced extremely thin small outline package; no leads;
6 terminals; body 2.0 x 2.0 x 0.5 mm
SOT1348-1
X
D
B
A
A
A1
A3
E
detail X
terminal 1
index area
e1
e
terminal 1
index area
C
b
1
C A B
C
v
w
3
y1 C
y
k
Eh
L
6
4
Dh
0
2 mm
scale
Dimensions (mm are the original dimensions)
Unit
mm
max
nom
min
A
A1
0.5
0.05
A3
b
0.35
0.127 0.30
0.00
0.25
D(1)
Dh
E(1)
Eh
e
e1
2.1
2.0
1.9
1.7
1.6
1.5
2.1
2.0
1.9
1.1
1.0
0.9
0.65
1.3
k
L
v
0.1
0.2
0.30
0.25
0.20
w
y
y1
0.05 0.05 0.05
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
References
Outline
version
IEC
JEDEC
JEITA
SOT1348-1
---
---
---
sot1348-1_po
European
projection
Issue date
13-09-04
15-05-08
Fig 28. Package outline SOT1348-1 (HXSON6)
NX5P2553
Product data sheet
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NXP Semiconductors
Precision adjustable current-limited power switch
16. Abbreviations
Table 15.
Abbreviations
Acronym
Description
CDM
Charged Device Model
ESD
ElectroStatic Discharge
ESR
Equivalent Series Resistance
HBM
Human Body Model
MOSFET
Metal-Oxide Semiconductor Field-Effect Transistor
OCP
OverCurrent Protection
OTP
OverTemperature Protection
PCB
Printed-Circuit Board
RVP
Reverse-Voltage Protection
USB
Universal Serial Bus
UVLO
UnderVoltage LockOut
VoIP
Voice over Internet Protocol
17. Revision history
Table 16.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
NX5P2553 v.1
20150706
Product data sheet
-
-
NX5P2553
Product data sheet
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NXP Semiconductors
Precision adjustable current-limited power switch
18. Legal information
18.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
18.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
18.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
NX5P2553
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
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NXP Semiconductors
Precision adjustable current-limited power switch
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
18.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
19. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
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Precision adjustable current-limited power switch
20. Contents
1
2
3
4
5
6
7
7.1
7.2
8
8.1
8.2
8.3
8.4
8.4.1
8.4.2
8.4.3
8.5
8.6
8.7
9
10
11
12
12.1
12.2
12.3
12.4
12.5
12.6
13
13.1
14
14.1
14.2
15
16
17
18
18.1
18.2
18.3
18.4
19
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
Functional description . . . . . . . . . . . . . . . . . . . 3
EN input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
UnderVoltage LockOut (UVLO) . . . . . . . . . . . . 4
ILIM. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
OverCurrent Protection (OCP) . . . . . . . . . . . . . 4
Overcurrent at start-up . . . . . . . . . . . . . . . . . . . 4
Overcurrent when enabled . . . . . . . . . . . . . . . . 4
Short-circuit when enabled . . . . . . . . . . . . . . . . 4
Reverse-Voltage Protection (RVP) . . . . . . . . . . 4
FAULT output . . . . . . . . . . . . . . . . . . . . . . . . . . 5
OverTemperature Protection (OTP) . . . . . . . . . 5
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5
Recommended operating conditions. . . . . . . . 6
Thermal characteristics . . . . . . . . . . . . . . . . . . 6
Static characteristics. . . . . . . . . . . . . . . . . . . . . 6
Graphs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
ON resistance . . . . . . . . . . . . . . . . . . . . . . . . . . 8
ON resistance graph. . . . . . . . . . . . . . . . . . . . . 9
Current limit . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Current limit graph . . . . . . . . . . . . . . . . . . . . . 10
Thermal shutdown . . . . . . . . . . . . . . . . . . . . . 10
Dynamic characteristics . . . . . . . . . . . . . . . . . 10
Waveform and test circuits . . . . . . . . . . . . . . . 11
Application information. . . . . . . . . . . . . . . . . . 16
Application diagram . . . . . . . . . . . . . . . . . . . . 16
Best practices . . . . . . . . . . . . . . . . . . . . . . . . . 16
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 18
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 21
Legal information. . . . . . . . . . . . . . . . . . . . . . . 22
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 22
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Contact information. . . . . . . . . . . . . . . . . . . . . 23
20
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2015.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 6 July 2015
Document identifier: NX5P2553
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