Comparing Spansion S34ML01G200 with Macronix MX30LF1G18AC

APPLICATION NOTE
Comparing Spansion® S34ML01G200 with Macronix MX30LF1G18AC
1. Introduction
This application note is a guide for migrating to the Macronix MX30LF1G18AC from the
Spansion® S34ML01G200 1Gb, 3V, NAND flash memory.
The document does not provide detailed information on the individual devices, but highlights the
major similarities and differences between them. The comparison covers the general features,
performance, command codes and other differences.
The information in this document is based on datasheets listed in Section 10. Newer versions of
the datasheets may override the contents of this document.
2. Features
Both flash device families have similar features and functions as shown in Table 2-1.
Table 2-1: Feature Comparison
Feature
Macronix MX30LF1G18AC
Vcc Voltage Range
2.7V ~ 3.6V
Bus Width
x8
Operating Temperature
-40°C ~ 85°C
Interface
ONFI 1.0 Standard
Block Size
128KB+4KB
Page Size
2KB+64B
ECC Requirement
4b/528B
OTP Size
30 pages
Guarantee Good Blocks
Block 0
at Shipping
Unique ID
ONFI standard
ID Code
C2h/F1h/80h/95h/02h
ONFI Signature
4Fh/4Eh/46h/49h
Data Retention
10 Years
Packages
P/N: AN0381
48-TSOP (12x20mm)
63-VFBGA (9x11mm)
1
Spansion S34ML01G200
2.7V ~ 3.6V
x8
-40°C ~ 85°C
ONFI 1.0 Standard
128KB+4KB
2KB+64B
4b/528B
64 pages
Block 0, 1
ONFI standard
01h/F1h/80h/1Dh
4Fh/4Eh/46h/49h
10 Years
48-TSOP (12x20mm)
63-VFBGA (9x11mm)
67-BGA(8x6.5mm)
Ver. 1, May 20, 2015
APPLICATION NOTE
Comparing Spansion® S34ML01G200 with Macronix MX30LF1G18AC
3. Performance
Table 3-1 and Table 3-2 show MX30LF1G18AC and S34ML01G200 Read/Write performance.
Table 3-1: Read Performance (Read Latency and Sequential Read)
Read function
Macronix MX30LF1G18AC
Spansion S34ML01G200
Read Latency time (tR)
25us (max.)
25us (max.)
Sequential Read time (tRC)
20ns (min.)
25ns (min.)
Table 3-2: Write Performance (Program and Erase)
Write Function
Macronix MX30LF1G18AC
Page Program time (tPROG)
300us (typ.)/600us (max.)
Block Erase time (tERASE)
1ms (typ.)/3.5ms (max.)
NOP
4 (max.)
Write/Erase Cycles*1 (Endurance)
100,000
Spansion S34ML01G200
300us (typ.)/700us (max.)
3ms (typ.)/10ms (max.)
4 (max.)
100,000
Note: 100K Endurance cycle with ECC protection.
4. DC Characteristics
Read/Write power requirements (Table 4-1) and I/O voltage limits (Table 4-2) are similar.
Table 4-1: Read / Write Current
DC Characteristic
Macronix MX30LF1G18AC
Sequential Read Current (ICC1) 15mA (typ.) / 30mA (max.)
Program Current (ICC2)
15mA (typ.) / 30mA (max.)
Erase Current (ICC3)
15mA (typ.) / 30mA (max.)
Standby Current – CMOS
10uA (typ.) / 50uA (max.)
Spansion S34ML01G200
15mA (typ.) / 30mA (max.)
15mA (typ.) / 30mA (max.)
15mA (typ.) / 30mA (max.)
10uA (typ.) / 50uA (max.)
Table 4-2: Input / Output Voltage
DC Characteristic
Input Low Voltage (VIL)
Input High Voltage (VIH)
Output Low Voltage (VOL)
Output High Voltage (VOH)
P/N: AN0381
Macronix MX30LF1G18AC
Spansion S34ML01G200
-0.3V (min.) / 0.2VCC (max.)
-0.3V (min.) / 0.2Vcc (max.)
0.8VCC (min.) / VCC+0.3V (max.) 0.8Vcc (min.) / Vcc+0.3V (max.)
0.2V (max.)
0.4V (max.)
VCC-0.2 (min.)
2.4V (min.)
2
Ver. 1, May 20, 2015
APPLICATION NOTE
Comparing Spansion® S34ML01G200 with Macronix MX30LF1G18AC
5. Package Pin/Ball Definition
Package physical dimensions are similar to each other. For detailed information, please refer to
the individual datasheets. Tables 5-1 and 5-2 show differences in pin assignments between the
Macronix and Spansion devices. S34ML01G200 can be compared by the MX30LF1G18AC
without pin conflicts. Only 48-TSOP pin #38 (ball G5 on VFBGA) may need special attention
because the pin is designated “PT” which is chip protected function on the MX30LF1G18AC-TI,
but S34ML01G200 is designated as NC.
Figure 5-1: 48-TSOP (12x20mm) Package and Pin Layout Comparison
NC
NC
NC
NC
NC
NC
R/B#
RE#
CE#
NC
NC
VCC
VSS
NC
NC
CLE
ALE
WE#
WP#
NC
NC
NC
NC
NC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
MX30LF1G18AC
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
VSS*1
NC
NC
NC
IO7
IO6
IO5
IO4
NC
VCC*1
PT
VCC
VSS
NC
VCC*1
NC
IO3
IO2
IO1
IO0
NC
NC
NC
VSS*1
NC
NC
NC
NC
NC
NC
R/B#
RE#
CE#
NC
NC
VCC
VSS
NC
NC
CLE
ALE
WE#
WP#
NC
NC
NC
NC
NC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
S34ML01G200
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
VSS*1
NC
NC
NC
I/O7
I/O6
I/O5
I/O4
NC
VCC*1
NC
VCC
VSS
NC
VCC*1
NC
I/O3
I/O2
I/O1
IO0
NC
NC
NC
VSS*1
Pin38: NC
Pin38: PT
Note:
1. These pins might not be connected internally. However it is recommended to connect
these pins to power(or ground) as designated for ONFI compatibility.
Table 5-1: 48-TSOP Package Pin Definition
Brand
Macronix
Spansion
Part Name
MX30LF1G18AC-TI
S34ML01G200
PT*
NC*
#38
#3
8 pin
1
2
Note
If no connect, both pin
functions are the same
Note:
1. PT pin has internal weak pull low. It enables the protection function if active.
2. NC= Not Connected
P/N: AN0381
3
Ver. 1, May 20, 2015
APPLICATION NOTE
Comparing Spansion® S34ML01G200 with Macronix MX30LF1G18AC
Figure 5-2: 63-VFBGA (9x11mm) Package and Pin Layout Comparison
MX30LF1G18AC
1
2
A
NC
NC
B
NC
3
4
5
6
7
S34ML01G200
8
9
10
NC
NC
NC
NC
1
2
A
NC
NC
B
NC
3
4
5
6
7
8
C
WP#
ALE
VSS
CE#
WE#
R/B#
C
WP#
ALE
VSS
CE#
WE#
R/B#
D
VCC
*1
RE#
CLE
NC
NC
NC
D
VCC
*1
RE#
CLE
NC
NC
NC
E
NC
NC
NC
NC
NC
NC
E
NC
NC
NC
NC
NC
NC
F
NC
NC
NC
NC
VSS
*1
NC
F
NC
NC
NC
NC
VSS
*1
NC
G
NC
VCC
*1
PT
NC
NC
NC
G
NC
VCC
*1
NC
NC
NC
NC
H
NC
IO0
NC
NC
NC
VCC
H
NC
I/O0
NC
NC
NC
Vcc
J
NC
IO1
NC
VCC
IO5
IO7
J
NC
I/O1
NC
Vcc
I/O5
I/O7
K
VSS
IO2
IO3
IO4
IO6
VSS
K
Vss
I/O2
I/O3
I/O4
I/O6
Vss
9
10
NC
NC
NC
NC
L
NC
NC
NC
NC
L
NC
NC
NC
NC
M
NC
NC
NC
NC
M
NC
NC
NC
NC
G5 : NC
G5: PT
Note:
1. These pins might not be connected internally. However it is recommended to
connect these pins to power(or ground) as designated for ONFI compatibility.
Table 5-2: 63-VFBGA Package Ball Definition
Brand
Macronix
Spansion
Part Name
MX30LF1G18AC-XKI
S34ML01G200
PT*
NC*
#G5
#G
5 ball
1
2
Note
If no connect, both pin
functions are the same
Note:
1. PT pin has internal weak pull low. It enables the protection function if active.
2. NC= Not Connected
P/N: AN0381
4
Ver. 1, May 20, 2015
APPLICATION NOTE
Comparing Spansion® S34ML01G200 with Macronix MX30LF1G18AC
6. Command Set
Basic command sets and status checking methods are similar. Read and Write commands are
identical. Additionally, Macronix supports a Unique ID Read, Set/Get Feature and Block
Protection Status Read function not supported by Spansion® (Table 6-1).
Table 6-1: Command Table
Command
Read Mode
Random Data Input
Random Data Output
Cache Read Begin
Cache Read Sequential
Cache Read End
Read ID
Reset
Page Program
Cache Program
Block Erase
Read Status
Read Parameter Pg.
Unique ID Read
Set Feature
Get Feature
Block Protection Status Read
Macronix
Spansion
MX30LF1G18AC
S34ML01G200
1st Cycle 2nd Cycle 1st Cycle 2nd Cycle
00h
00h
30h
30h
85h
85h
05h
E0h
05h
E0h
00h
31h
00h
31h
31h
31h
3Fh
3Fh
90h
90h
FFh
FFh
80h
10h
80h
10h
80h
15h
80h
15h
60h
D0h
60h
D0h
70h
70h
ECh
ECh
EDh
EDh
EFh
EEh
7Ah
-
6-2 Status Register
When a flash Read, Program, or Erase operation is in progress, either the “Ready/Busy# Pin
Checking” or “Status Output Checking” method may be used to monitor the operation. Both are
standard NAND flash algorithms and can be used for both device families. Table 6-3 shows that
Status Output content provided by the Read Status command (70h) is compatible.
P/N: AN0381
5
Ver. 1, May 20, 2015
APPLICATION NOTE
Comparing Spansion® S34ML01G200 with Macronix MX30LF1G18AC
Table 6-3: Status Output
Status Output
Macronix MX30LF1G18AC
SR[0]
SR[1]
SR[2]
SR[3]
SR[4]
SR[5]
SR[6]
SR[7]
PGM/ERS status: Pass/Fail
Cache Program status: Pass/Fail
Reserved
Reserved
Reserved
PGM/ERS/Read internal controller:
Ready/Busy
PGM/ERS/Read status: Ready/Busy
Write Protect
Spansion S34ML01G200
PGM/ERS status: Pass/Fail
Cache Program status: Pass/Fail
Reserved
Reserved
Reserved
PGM/ERS/Read internal controller:
Ready/Busy
PGM/ERS/Read status: Ready/Busy
Write Protect
7. Read ID Command
The ID codes of the Macronix MX30LF1G18AC and S34ML01G200 differ in the manufacturer ID
and in the last byte (Table 7-1).
Table 7-1: Manufacturer and Device IDs
ID Code
Value
1st Byte
2nd Byte
IO1, IO0
IO3, IO2
3rd
Byte
IO5, IO4
IO6
4th
Byte
5th
Byte
P/N: AN0381
IO7
IO1, IO0
IO2
IO5, IO4
IO6
IO7, IO3
IO1, IO0
IO3, IO2
IO6~IO4
IO7
Macronix MX30LF1G18AC
Spansion S34ML01G200
C2h/F1h/80h/95h/02h
Manufacturer Code
Device Identifier
Number of Die per Chip Enable
Cell Structure
Number of Simultaneously
Programmed Pages
Interleaved Programming
Between Multiple Chips
Cache Program
Page Size (exclude Spare Area)
Spare Area Size(Byte per 512Byte)
Block Size (exclude Spare Area)
Organization
Sequential Read Cycle Time (tRC)
ECC Level Requirement
Number of Plane per CE
Plane Size
Reserved
01h/F1h/80h/1Dh
Manufacturer Code
Device Identifier
Number of Die per Chip Enable
Cell Structure
Number of Simultaneously
Programmed Pages
Interleaved Programming
Between Multiple Chips
Cache Program
Page Size (exclude Spare Area)
Spare Area Size (Byte per 512Byte)
Block Size (exclude Spare Area)
Organization
Serial Access Time (tRC)
-
6
Ver. 1, May 20, 2015
APPLICATION NOTE
Comparing Spansion® S34ML01G200 with Macronix MX30LF1G18AC
8. Power-Up Timing
Macronix and Spansion® power-up sequences are similar, but the timing is slightly different.
Although both devices use 2.7V (VCC min.) as the start point, timing references are different.
Check the system timing to determine if adjustments are needed.
Table 8-1: Power-Up Timing
H/W Timing Characteristic
Vcc (min.) to WE# Low
Vcc (min.) to R/B# High
Vcc (min.) to R/B# Low
Macronix MX30LF1G18AC
1ms (max.)
N/A
10us (max.)
Spansion S34ML01G200
N/A
5ms (max.)
100us (max.)
Vcc(min.)
VCC
WE#
R/B#
Figure 8-1: Power-Up Timing
P/N: AN0381
7
Ver. 1, May 20, 2015
APPLICATION NOTE
Comparing Spansion® S34ML01G200 with Macronix MX30LF1G18AC
9. Summary
Macronix MX30LF1G18AC and Spansion® S34ML01G200 NAND have similar features and pinouts.
More advanced features such as cache access are implemented slightly differently. Because basic
Read, Program, and Erase commands as well as block, page, spare area sizes and ECC
requirements are the same, device migration may require minimal or no firmware modifications.
10. Reference
Table 10-1 shows the datasheet versions used for comparison in this application note.
For the most current, detailed Macronix specification, please refer to the Macronix
Website at http://www.macronix.com
Table 10-1: Datasheet Version
Datasheet
Location
MX30LF1G18AC
S34ML01G200
Website
Website
Date Issue
Revision
Feb. 02, 2015
Apr. 17, 2015
Rev. 1.0
Rev. 11
Note: Macronix data sheet is subject to change without notice.
11. Appendix
Cross Reference Table 11-1 shows basic part number and package information for the Macronix
MX30LF1G18AC and Spansion® S34ML01G200 product families.
Table 11-1: Part Number Cross Reference
Density Macronix Part No.
Spansion Part No.
MX30LF1G18AC-TI
S34ML01G200TFI00
1Gb
MX30LF1G18AC-XKI S34ML01G200BHI00
Package
48-TSOP
63-VFBGA
Dimension
12x20mm
9x11x1.0mm
12. Revision History
Revision
1.0
P/N: AN0381
Description
Initial Release
8
Date
May. 20, 2015
Ver. 1, May 20, 2015
APPLICATION NOTE
Comparing Spansion® S34ML01G200 with Macronix MX30LF1G18AC
Except for customized products which have been expressly identified in the applicable agreement,
Macronix's products are designed, developed, and/or manufactured for ordinary business, industrial,
personal, and/or household applications only, and not for use in any applications which may, directly or
indirectly, cause death, personal injury, or severe property damages. In the event Macronix products are
used in contradicted to their target usage above, the buyer shall take any and all actions to ensure said
Macronix's product qualified for its actual use in accordance with the applicable laws and regulations; and
Macronix as well as it’s suppliers and/or distributors shall be released from any and all liability arisen
therefrom.
Copyright© Macronix International Co., Ltd. 2015. All rights reserved, including the trademarks and
tradename thereof, such as Macronix, MXIC, MXIC Logo, MX Logo, Integrated Solutions Provider, NBit, Nbit,
NBiit, Macronix NBit, eLiteFlash, HybridNVM, HybridFlash, XtraROM, Phines, KH Logo, BE-SONOS, KSMC,
Kingtech, MXSMIO, Macronix vEE, Macronix MAP, Rich Au-dio, Rich Book, Rich TV, and FitCAM. The
names and brands of third party referred thereto (if any) are for identification purposes only.
For the contact and order information, please visit Macronix’s Web site at: http://www.macronix.com
P/N: AN0381
9
Ver. 1, May 20, 2015
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