4 and 8-Channel ESD Protection Arrays in CSP

CM1220
4 and 8-Channel ESD
Protection Arrays in CSP
Description
The CM1220 ESD protection arrays are available in four and eight
channel configurations. Each ESD channel features a nominal
capacitance of 14 pF making the devices ideal for protecting high
speed I/O ports and LCD and camera data lines without significantly
affecting signal integrity. The CM1220 integrates avalanche−type
ESD diodes on every channel, providing a very high level of
protection for sensitive electronic components that may be subjected
to electrostatic discharge (ESD). These diodes safely dissipate ESD
strikes of ±15 kV, exceeding the maximum requirement of the
IEC61000−4−2 international standard. Using the MIL−STD−883
(Method 3015) specification for Human Body Model (HBM) ESD, the
CM1220 protect against contact discharges at greater than ±30 kV.
These devices are particularly well−suited for portable electronics
(e.g. wireless handsets, PDAs, notebook computers) because of their
small package and easy−to−use pin assignments. In particular, the
CM1220 is ideal for protecting high speed I/O ports and data and
control lines for the LCD display and camera interface in mobile
handsets.
The CM1220 incorporates ON Semiconductor’s OptiGuardt
coating for improved reliability at assembly in a space−saving,
low−profile Chip Scale Package.
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WLCSP5
CP SUFFIX
CASE 567AY
WLCSP10
CP SUFFIX
CASE 567BL
A1
B2
A3
ESD_4
ESD_3
ESD_2
ESD_1
BLOCK DIAGRAM
C3
C1
GND
A1
A3
A5
A7
C1
C3
C5
ESD_8
ESD_7
ESD_6
ESD_5
ESD_4
ESD_3
ESD_2
ESD_1
CM1220−04
C7
Features
• Four and Eight Channels of ESD Protection
• OptiGuardtCoated for Improved Reliability
• ±15 kV ESD Protection on each Channel (IEC 61000−4−2 Level 4,
•
•
•
•
•
contact discharge)
±30 kV ESD Protection on each Channel (HBM)
Chip Scale Package (CSP) Features Extremely Low Lead Inductance
for Optimum ESD Protection
5 bump, 0.960 mm X 1.330 mm CSP Footprint for CM1220−04
10 bump, 1.960 mm X 1.330 mm CSP Footprint for CM1220−08
These Devices are Pb−Free and are RoHS Compliant
Applications
• LCD and Camera Data Lines in Mobile Handsets
• I/O Port Protection for Mobile Handsets, Notebook Computers,
•
•
•
•
PDAs, etc.
Keypads and Buttons
Wireless Handsets
Handheld PCs/PDAs
LCD and Camera Modules
B1, B2
GND
CM1220−08
MARKING DIAGRAM
L208
J
CM1220−04
5−Bump CSP Package
J
L208
CM1220−08
10−Bump CSP Package
= CM1220−04CP
= CM1220−08CP
ORDERING INFORMATION
Package
Shipping†
CM1220−04CP
CSP−5
(Pb−Free)
3500/Tape & Reel
CM1220−08CP
CSP−10
(Pb−Free)
3500/Tape & Reel
Device
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2011
February, 2011 − Rev. 3
1
Publication Order Number:
CM1220/D
CM1220
PACKAGE / PINOUT DIAGRAMS
Top View
(Bumps Down View)
Orientation
Marking
Bottom View
(Bumps Up View)
1 2 3
+
A
J
B
C1
B2
Orientation
Marking
C
CM1220−04
5−bump CSP Package
with OptiGuard
Orientation
Marking
1 2 3
A
A1
A1
A3
C3
C5
5 6 7
+
C1
L208
B
C3
Orientation
Marking
C
B2
A1
A1
C7
B6
A3
A5
A7
CM1220−08
10−bump CSP Package
with OptiGuard
Table 1. PIN DESCRIPTIONS
CM1220−08
CM1220−04
Pins
Name
Pins
Name
A1
ESD1
A1
ESD1
A3
ESD2
A3
ESD2
A5
ESD3
−
A7
ESD4
B2
GND
CM1220−08
CM1220−04
Pins
Name
Pins
Name
ESD Channel
C1
ESD5
C1
ESD3
ESD Channel
ESD Channel
C3
ESD6
C3
ESD4
ESD Channel
−
ESD Channel
C5
ESD7
−
−
ESD Channel
−
−
ESD Channel
C7
ESD8
−
−
ESD Channel
B2
GND
Device Ground
B6
GND
−
−
Device Ground
Description
Description
SPECIFICATIONS
Table 2. ABSOLUTE MAXIMUM RATINGS
Parameter
Storage Temperature Range
Rating
Units
−65 to +150
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
Table 3. STANDARD OPERATING CONDITIONS
Parameter
Operating Temperature Range
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2
Rating
Units
−40 to +85
°C
CM1220
Table 4. ELECTRICAL OPERATING CHARACTERISTICS (Note 1)
Symbol
Parameter
Conditions
Min
Typ
Max
Units
11
14
17
pF
0.1
1
mA
6.8
−0.8
9.0
−0.4
CDIODE
Diode (Channel) Capacitance
At 2.5 VDC Reverse Bias,
1 MHz, 30 mVAC
VDIODE
Diode Standoff Voltage
IDIODE = 10 mA
6.0
ILEAK
Diode Leakage Current
VIN = +3.3 V
(reverse bias voltage)
VSIG
Signal Clamp Voltage
Positive Clamp
Negative Clamp
IDIODE = 10 mA
VESD
In−system ESD Withstand Voltage
a) Human Body Model, MIL−STD−883, Method 3015
b) Contact Discharge per IEC 61000−4−2
(Note 2)
RDYN
Dynamic Resistance
Positive
Negative
5.6
−1.5
PERFORMANCE INFORMATION
Capacitance (Normalized)
Diode Characteristics (nominal conditions unless specified otherwise)
DC Voltage
Figure 1. Insertion Loss vs. Frequency (0 V Bias)
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3
V
kV
±30
±15
2.3
0.9
1. TA = 25 °C unless otherwise specified.
2. ESD applied to input and output pins with respect to GND, one at a time. Unused pins are left open.
V
W
CM1220
APPLICATION INFORMATION
Table 5. PRINTED CIRCUIT BOARD RECOMMENDATIONS
Parameter
Value
Pad Size on PCB
0.240 mm
Pad Shape
Round
Pad Definition
Non−Solder Mask defined pads
Solder Mask Opening
0.290 mm Round
Solder Stencil Thickness
0.125 − 0.150 mm
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
0.300 mm Round
Solder Flux Ratio
50/50 by volume
Solder Paste Type
No Clean
Pad Protective Finish
OSP (Entek Cu Plus 106A)
Tolerance − Edge To Corner Ball
±50 mm
Solder Ball Side Coplanarity
±20 mm
Maximum Dwell Time Above Liquidous (183°C)
60 seconds
Maximum Soldering Temperature for Lead−free Devices using a Lead−free Solder Paste
Non−Solder Mask Defined Pad
0.240 mm DIA.
Solder Stencil Opening
0.300 mm DIA.
Solder Mask Opening
0.290 mm DIA.
Figure 2. Recommended Non−Solder Mask Defined Pad Illustration
Figure 3. Lead−free (SnAgCu) Solder Ball Reflow Profile
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4
260°C
CM1220
PACKAGE DIMENSIONS
WLCSP5, 0.96x1.33
CASE 567AY−01
ISSUE O
D
2X
A
ÈÈ
PIN A1
REFERENCE
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
B
E
DIM
A
A1
A2
b
D
E
eD
eE
0.05 C
2X
0.05 C
TOP VIEW
A2
OptiGuard Option
0.05 C
ÉÉÉ
A
RECOMMENDED
SOLDERING FOOTPRINT*
0.05 C
NOTE 3
A1
SIDE VIEW
C
SEATING
PLANE
A1
eD/2
5X
0.05 C A B
0.03 C
PACKAGE
OUTLINE
0.87
eD
b
MILLIMETERS
MIN
MAX
0.56
0.72
0.21
0.27
0.40 REF
0.29
0.35
0.96 BSC
1.33 BSC
0.50 BSC
0.435 BSC
eE
C
0.44
B
0.25
0.50
A
5X
0.25
DIMENSIONS: MILLIMETERS
1 2 3
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
BOTTOM VIEW
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5
CM1220
PACKAGE DIMENSIONS
WLCSP10, 1.96x1.33
CASE 567BL−01
ISSUE O
PIN A1
REFERENCE
2X
ÈÈ
D
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
B
E
DIM
A
A1
A2
b
D
E
eD
eE
0.05 C
2X
0.05 C
TOP VIEW
ÉÉÉÉÉÉ
OptiGuard Option
0.05 C
A2
RECOMMENDED
SOLDERING FOOTPRINT*
A
0.05 C
NOTE 3
A1
SIDE VIEW
MILLIMETERS
MIN
MAX
0.72
0.56
0.21
0.27
0.40 REF
0.29
0.35
1.96 BSC
1.33 BSC
0.50 BSC
0.435 BSC
C
0.25
SEATING
PLANE
A1
0.25
PACKAGE
OUTLINE
eD
10X
0.05 C A B
0.03 C
0.87
eD/2
b
eE
C
0.44
B
0.50
PITCH
A
1 2 3
4 5 6
10X
0.25
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
BOTTOM VIEW
OptiGuardt is a trademark of Semiconductor Components Industries, LLC.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
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For additional information, please contact your local
Sales Representative
CM1220/D
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