Freescale Semiconductor Technical Data Document Number: MMA25312B Rev. 2, 9/2014 Heterojunction Bipolar Transistor Technology (InGaP HBT) MMA25312BT1 High Efficiency/Linearity Amplifier The MMA25312B is a 2--stage high efficiency InGaP HBT driver amplifier designed for use in 2400 MHz ISM applications, WLAN (802.11g), WiMAX (802.16e) and wireless broadband mesh networks. It is suitable for applications with frequencies from 2300 to 2700 MHz using simple external matching components with a 3 to 5 V supply. 2300--2700 MHz, 26 dB 31 dBm InGaP HBT LINEAR AMPLIFIER Typical Performance: VCC1 = VCC2 = VBIAS = 5 Vdc, ICQ = 150 mA Frequency Pout (dBm) Gps (dB) EVM (%) Test Signal 2450 MHz 20.5 27.4 3.0 WLAN (802.11g) 2350 MHz 23.0 27.2 3.0 WiMAX (802.16e) QFN 3 3 Features Frequency: 2300--2700 MHz P1dB: 31 dBm @ 2500 MHz Power Gain: 26 dB @ 2500 MHz Third Order Output Intercept Point: 40 dBm @ 2500 MHz Active Bias Control (On--chip) Single 3 to 5 V Supply Single--ended Power Detector Cost--effective 12--pin, 3 mm QFN Surface Mount Plastic Package In Tape and Reel. T1 Suffix = 1,000 Units, 12 mm Tape Width, 7--inch Reel. Table 1. Typical CW Performance (1) Table 2. Maximum Ratings Rating Characteristic Symbol 2300 MHz 2500 MHz 2700 MHz Unit Small--Signal Gain (S21) Gp 26 26 24.5 dB Input Return Loss (S11) IRL --14 --12 --12 dB Output Return Loss (S22) ORL --11 --13 --15 dB Power Output @ 1dB Compression P1dB 30 31 29.8 dBm Symbol Value Unit Supply Voltage VCC 6 V Supply Current ICC 550 mA RF Input Power Pin 30 dBm Storage Temperature Range Tstg --65 to +150 C Junction Temperature TJ 175 C 1. VCC1 = VCC2 = VBIAS = 5 Vdc, TA = 25C, 50 ohm system, CW Application Circuit Table 3. Thermal Characteristics Characteristic Thermal Resistance, Junction to Case Case Temperature 91C, VCC1 = VCC2 = VBIAS = 5 Vdc Symbol Value (2) Unit RJC 92 C/W 2. Refer to AN1955, Thermal Measurement Methodology of RF Power Amplifiers. Go to http://www.freescale.com/rf. Select Documentation/Application Notes -- AN1955. Freescale Semiconductor, Inc., 2012--2014. All rights reserved. RF Device Data Freescale Semiconductor, Inc. MMA25312BT1 1 Table 4. Electrical Characteristics (VCC1 = VCC2 = VBIAS = 5 Vdc, 2500 MHz, TA = 25C, 50 ohm system, in Freescale CW Application Circuit) Characteristic Symbol Min Typ Max Unit Small--Signal Gain (S21) Gp 24.5 26 — dB Input Return Loss (S11) IRL — --12 — dB Output Return Loss (S22) ORL — --13 — dB Power Output @ 1dB Compression P1dB — 31 — dBm Third Order Output Intercept Point, Two--Tone CW OIP3 — 40 — dBm Noise Figure NF — 3.8 — dB Supply Current ICQ 110 124 138 mA Supply Voltage VCC — 5 — V Table 5. ESD Protection Characteristics Test Methodology Class Human Body Model (per JESD 22--A114) 2 Machine Model (per EIA/JESD 22--A115) A Charge Device Model (per JESD 22--C101) IV Table 6. Moisture Sensitivity Level Test Methodology Per JESD22--A113, IPC/JEDEC J--STD--020 VBA2 VBA1 VCC1 Rating Package Peak Temperature Unit 1 260 C VCC1 VBA2 VCC1 VCC1 RFout BIAS CIRCUIT RFout VBIAS VCC2 12 11 10 VBA1 1 9 RFout VBIAS 2 8 RFout RFin 3 7 VCC2 4 5 6 N.C. N.C. PDET RFin PDET Figure 1. Functional Block Diagram Figure 2. Pin Connections MMA25312BT1 2 RF Device Data Freescale Semiconductor, Inc. VBIAS VCC1 L2 C1 R2 R1 12 1 Z2 11 C2 C7 10 9 BIAS CIRCUIT C5 Z1 8 2 RF OUTPUT C13 C11 RF INPUT 7 3 C8 DETECTOR 4 5 VCC2 L3 C14 6 PDET C9 Z1 Z2 0.140 x 0.030 Microstrip 0.073 x 0.030 Microstrip Figure 3. MMA25312BT1 Test Circuit Schematic — 2500 MHz, 5 Volt Operation Table 7. MMA25312BT1 Test Circuit Component Designations and Values — 2500 MHz, 5 Volt Operation Part Description C1, C2 1 F Chip Capacitors C3, C4, C6, C10, C12, C15 Components Not Placed C5, C9 C7 Part Number Manufacturer GRM155R61A105KE15 Murata 100 pF Chip Capacitors GRM1555C1H101JA01 Murata 8.2 pF Chip Capacitor 04023J8R2BBS AVX C8, C13 22 pF Chip Capacitors 04023J22R0BBS AVX C11 1.5 pF Chip Capacitor 04023J1R5BBS AVX C14 4.7 F Chip Capacitor GRM188R60J475KE19D Murata L2 1.2 nH Chip Inductor LL1608-FH1N2S TOKO L3 22 nH Chip Inductor LL1608-FH22N0S TOKO R1 330 , 1/16 W Chip Resistor RC0402JR-07330RL Yageo R2 1210 , 1/16 W Chip Resistor RC0402JR-071K21L Yageo R3 Component Not Placed PCB 0.014, r = 3.7 FR408 Isola Note: Component numbers C3, C4, C6, C10, C12, C15 and R3 are labeled on board but not placed. Note: Component L1 intentionally omitted. MMA25312BT1 RF Device Data Freescale Semiconductor, Inc. 3 VCC1 VBIAS(1) C2 C1 R3* C3* L2 R1 RFIN C6* C4* R2 RFOUT C7 C5 C12* C11 C13 C8 C10* C9 C14 L3 C15* QFN 3x3--12N Rev. 0 VCC2 VDECT (1) VBIAS [Board] supplies VBA1, VBA2 and VBIAS [Device]. Note: Component numbers C3*, C4*, C6*, C10*, C12*, C15* and R3* are labeled on board but not placed. Figure 4. MMA25312BT1 Test Circuit Component Layout — 2500 MHz, 5 Volt Operation Table 7. MMA25312BT1 Test Circuit Component Designations and Values — 2500 MHz, 5 Volt Operation Part Description C1, C2 1 F Chip Capacitors C3, C4, C6, C10, C12, C15 Components Not Placed C5, C9 C7 Part Number Manufacturer GRM155R61A105KE15 Murata 100 pF Chip Capacitors GRM1555C1H101JA01 Murata 8.2 pF Chip Capacitor 04023J8R2BBS AVX C8, C13 22 pF Chip Capacitors 04023J22R0BBS AVX C11 1.5 pF Chip Capacitor 04023J1R5BBS AVX C14 4.7 F Chip Capacitor GRM188R60J475KE19D Murata L2 1.2 nH Chip Inductor LL1608-FH1N2S TOKO L3 22 nH Chip Inductor LL1608-FH22N0S TOKO R1 330 , 1/16 W Chip Resistor RC0402JR-07330RL Yageo R2 1210 , 1/16 W Chip Resistor RC0402JR-071K21L Yageo R3 Component Not Placed FR408 Isola PCB 0.014, r = 3.7 Note: Component L1 intentionally omitted. (Component Designations and Values table repeated for reference.) MMA25312BT1 4 RF Device Data Freescale Semiconductor, Inc. 3.00 0.70 0.30 2.00 3.40 0.50 1.6 1.6 solder pad with thermal via structure. All dimensions in mm. Figure 5. PCB Pad Layout for QFN 3 3 MA04 WLYW Figure 6. Product Marking MMA25312BT1 RF Device Data Freescale Semiconductor, Inc. 5 PACKAGE DIMENSIONS MMA25312BT1 6 RF Device Data Freescale Semiconductor, Inc. MMA25312BT1 RF Device Data Freescale Semiconductor, Inc. 7 MMA25312BT1 8 RF Device Data Freescale Semiconductor, Inc. PRODUCT DOCUMENTATION, SOFTWARE AND TOOLS Refer to the following resources to aid your design process. Application Notes AN1955: Thermal Measurement Methodology of RF Power Amplifiers AN3100: General Purpose Amplifier and MMIC Biasing Software .s2p File Development Tools Printed Circuit Boards For Software and Tools, do a Part Number search at http://www.freescale.com, and select the “Part Number” link. Go to Software & Tools on the part’s Product Summary page to download the respective tool. FAILURE ANALYSIS At this time, because of the physical characteristics of the part, failure analysis is limited to electrical signature analysis. In cases where Freescale is contractually obligated to perform failure analysis (FA) services, full FA may be performed by third party vendors with moderate success. For updates contact your local Freescale Sales Office. REVISION HISTORY The following table summarizes revisions to this document. Revision Date Description 0 Sept. 2012 Initial Release of Data Sheet 1 Mar. 2013 Added typical performance bullet and frequency table for WLAN (802.11g) and WiMAX (802.16e), p. 1 Table 7, Test Circuit Component Designations and Values -- 2500 MHz, 5 Volt Operation: updated R1 description from 430 , 1/16 Chip Resistor to 330 , 1/16 W Chip Resistor and R1 part number from RC0402JR--07430RL to RC0402JR--07330RL. Updated R2 description from 1.6 k, 1/16 W Chip Resistor to 1210 , 1/16 W Chip Resistor and R2 part number from RC0402JR--071K60L to RC0402JR--071K21L to reflect WiMAX, WLAN circuit performance, pp. 3, 4 Removed Fig. 5, Test Circuit Schematic -- 2500 MHz, 3.3 Volt Operation, Table 8, Test Circuit Component Designations and Values -- 2500 MHz, 3.3 Volt Operation and Fig. 6, Test Circuit Component Layout -2500 MHz, 3.3 Volt Operation, pp. 5, 6 2 Sept. 2014 Table 2, Maximum Ratings: updated Junction Temperature from 150C to 175C to reflect recent test results of the device, p. 1 Added Failure Analysis information, p. 9 MMA25312BT1 RF Device Data Freescale Semiconductor, Inc. 9 How to Reach Us: Home Page: freescale.com Web Support: freescale.com/support Information in this document is provided solely to enable system and software implementers to use Freescale products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits based on the information in this document. Freescale reserves the right to make changes without further notice to any products herein. Freescale makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including “typicals,” must be validated for each customer application by customer’s technical experts. Freescale does not convey any license under its patent rights nor the rights of others. Freescale sells products pursuant to standard terms and conditions of sale, which can be found at the following address: freescale.com/SalesTermsandConditions. Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. All other product or service names are the property of their respective owners. E 2012--2014 Freescale Semiconductor, Inc. MMA25312BT1 Document Number: MMA25312B Rev. 2, 9/2014 10 RF Device Data Freescale Semiconductor, Inc.