WILLAS
FM120-M+
FFM301L
THRU
3.0A SUFRACE MOUNT FAST RECOVERY RECTIFIERS-50-1000V
THRU
FM1200-M+
FFM307L
Pb Free Product
1.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIERS -20V- 200V
S M C - LPACKAGE
PACKAGE
SOD-123+
MCC
Features
Features
• Batch
process
design, excellent power dissipation offers
omponents
better
reverse
leakage current
and thermal resistance.
• Low
profile
surface
20736
Marilla
Chatsworth
mounted
application
in Street
order offers
to
• Batch
process
design, excellent power
dissipation
Micro
Commercial
Components
Package outline
ES2A-L
Package
outline
THRU SOD-123H
ES2J-L SMC-L
TM
optimize
board
space.current better
reverse
leakage
and thermal resistance.
!"#
Low
power
loss,
efficiency.
•
• Low profile surfacehigh
mounted
application in order to
$
% voltage
!"#
low forward
drop.
• High current
optimize
boardcapability,
space.
surgecapability.
capability.
• High
current
• High
forfor
overvoltage
protection.
• Guardring
• Fast
switching
high efficiency.
• Lead
Compliant(Note 1) ("P" Suffix designates
surge
Free
high-speed
Finish/RoHS
See
switching.
• Ultra
High
current
capability.
• RoHS
Compliant.
ordering
information)
• Silicon
epitaxial
planar
chip, metalrating
silicon junction.
Glass
passivated
UL
94chip
• • Epoxy
meets
V-0junction.
flammability
parts meet
standards of
• Lead-free
• • Moisture
Sensitivity
Levelenvironmental
1
MIL-STD-19500
• Pb-Free
package is/228
available
x RoHS
Super
fast
switching
speed
under
35ns
product
forpacking
packing
code
suffix
"G"
• RoHSproduct
for
code
suffix
"G"
x Marking
: Cathode
band
and type
number
(No '-L' Suffix)
Halogen
freeproduct
product
forpacking
packing
code
suffix "H"
"H"
Halogen
free
for
code
suffix
0.146(3.7)
0.130(3.3)
0.012(0.3) Typ.
0.272(6.9)
0.248(6.3)
Features
0.012(0.3) Typ.
2 Amp Super Fast
Recovery Rectifier
50 to 600 Volts
0.071(1.8)
0.056(1.4)
0.189(4.8)
0.165(4.2)
Mechanical
data
Maximum
Ratings
Mechanical data
0.040(1.0)
DO-214AC
0.024(0.6)
Epoxy
:
UL94-V0
rated
flame
retardant
•
• Operating Temperature: -65к to +175к
flame
retardant
(SMA)
(LEAD FRAME) 0.098(2.5)
• • Epoxy:UL94-V0
Storage
-65к
to
+175к
Molded rated
plastic,
SOD-123H
• Case : Temperature:
0.031(0.8) Typ.
0.031(0.8) Typ.
,
0.075(1.9)
H
• Case
: Molded
plastic,
DO-214AB
/ SMC/per MIL-STD-750
• Terminals
:Plated
terminals,
solderable
Maximum DC
Maximum
MCC
•Part
Terminals : Solder
plated,
per
2026solderable
0.048(1.2) Typ.
0.048 (1.2) Typ.
Maximum
Blocking
Recurrent
Number Method
MIL-STD-750,
Method
2026
RMS
Voltage
Voltage
Peak Reverse
Dimensions in inches and (millimeters)
• Polarity : Indicated
by cathode
band
J
Voltage
• Polarity
: Indicated
cathode band
Positionby: Any
• Mounting
ES2A-L
50V
35V
50V
Dimensions in inches and (millimeters)
• Mounting
: Any 0.011 gram
• Weight :Position
Approximated
ES2B-L
100V
70V
100V
ES2D-L: Approximated
200V 0.19 gram 140V
200V
• Weight
ES2G-L MAXIMUM
400VRATINGS 280V
400V CHARACTERISTICS
AND ELECTRICAL
A
C
ES2J-L
600V
420V
600V
Ratings at 25℃ ambient temperature unless otherwise specified.
Maximum
ratings
and
Electrical
Characteristics (AT
T A =25 oC unless otherwise noted)
E
Electrical
Characteristics
@
25°C
Unless
Otherwise
Specified
D
Single phase half wave, 60Hz, resistive of inductive load.
B
F
Average Forward
IF(AV)
2.0A
TL= 110к CONDITIONS
TYP. MAX. UNIT
PARAMETER
Symbol MIN.
For capacitive load,
derate current
by 20%
Current
G
3.0
I
A
Forward
rectified
current
See
Fig.2
O
Peak Forward Surge
50A
8.3ms, half
sine FM130-MH FM140-MH FM150-MH
FM160-MH
FM180-MH FM1100-MH FM1150-MH FM1200-MH UNIT
DIMENSIONS
SYMBOL
FM120-MH
RATINGS IFSM
Current
INCHES
MM
8.3ms single half12sine-wave
on
Marking
Code
13 superimposed
14
15
16
18 NOTE 10
115 A 120
100
Forward surge current
DIM
MIN
MAX
MIN I FSM MAX
Maximum
rate load
(JEDEC
methode)
A
.079
.096
2.00
2.44
20
30
40
50
60
80
100
150
200
Maximum Recurrent Peak Reverse Voltage
Volts
VRRM
B
.050
.064
1.27
1.63
Instantaneous
O
C
.002
.008
.05
.20
V
=
V
T
=
25
C
Volts
5.0105
14
21 D 28 --35
56
70
140
R
RRM
J
Maximum
RMSVoltage
Voltage
VRMS
Forward
.02
---42
.51
I R 1.52
μA
Reverse current
o
E
.030
.060
.76
O C
VF
.95V
ES2A-L-ES2D-L
= 2.0A;T125
J=25
Volts
FM
300150
V R = IV
C 30 F 40.065
Maximum
DC Blocking Voltage
.091
1.65
2.32
50
60
80
100
200
VRRM
DC T J = 20
G
.189
.220
4.80
5.59
ES2G-L
1.25V
C
pF
Diode
junction
capacitance
f=1MHz
and
applied
4V
DC
reverse
voltage
60
H
.157
.181
4.00
4.60
J
Amps
Maximum AverageES2J-L
Forward Rectified Current 1.70V
IO
1.0 2.92
J
.090
.115
2.25
O
Storage
temperature
= 2.0A;TJ=150oC
+175
-65
T STG
ES2J-L
.975V(Typ) IFM
C
SUGGESTED SOLDER
Peak Forward Surge Current 8.3 ms single half1.25V(Max)
sine-wave
IFSM
Amps
PAD LAYOUT 30
Maximum
DC load (JEDEC method)
superimposed
on rated
Operating
0.090”
*5
*4
Reverse Current AtV RRM*1 IR V RMS*2 5µAV R*3 TA = V
25к
t rr
temperature
℃/W
40
Typical SYMBOLS
Thermal Resistance (Note 2)
RΘJA F
Rated DC Blocking (V)
1mA
100к (ns)
(V) TA =(V)
(V)
T J, ( OC)
PF
120
Typical
Junction Capacitance (Note 1)
CJ
Voltage
*1 Repetitive peak reverse voltage
35
50
50
FFM301/
-55
to
+125
-55
to
+150
Operating
Temperature
Range
TJ
℃
Maximum
Reverse
Trr
35ns
IF=0.5A,
IR=1.0A,
0.085”
*2 to
RMS
Recovery
TimeRange
FFM302/
70
100 ITSTG
100
- 65
+175voltage
rr=0.25A
Storage
Temperature
℃
150
Typical
Junction 200
CJ140
15pF
FFM303/
200 Measured at
*3
Continuous
reverse
voltage
Capacitance
1.0MHz, VR=4.0V
FM140-MH
FM150-MH FM160-MH0.070”
FM180-MH FM1100-MH FM1150-MH FM1200-MH UNIT
1.30FM120-MH FM130-MH
-55
to +150
400 SYMBOL
400
280
FFM304/CHARACTERISTICS
Notes: 1. High Temperature Solder Exemption Applied, see EU Directive Annex Notes 7.
forward voltage@I
Volts
0.9 F=3.0A
Maximum Forward Voltage at 1.0A DC
0.92
VF
0.50
0.70 *4 Maximum0.85
250
600
600
420
FFM305/
0.5
Maximum Average Reverse Current at @T A=25℃
*5 Maximum Reverse recovery time, note 1 mAmps
IR
560
800
800
FFM306/
500
10
@T A=125℃
Rated DC Blocking Voltage
FFM307/
1000
1000
700
NOTES: Note 1. Reverse recovery time test condition, I F =0.5A, I R =1.0A, I RR =0.25A
1- Measured at 1 MHZ and applied reverse voltage of 4.0 VDC.
Reel packing
www.mccsemi.com
2- Thermal Resistance From Junction to Ambient
Revision: D
PACKAGE
SMC/
2012-06
2012-1
REEL SIZE
13"
REEL
(pcs)
3,000
COMPONENT
SPACING
(m/m)
8.0
1 of 3
BOX
(pcs)
6,000
INNER
BOX
(m/m)
337*337*37
REEL
DIA,
(m/m)
330
CARTON
SIZE
(m/m)
2012/05/25
CARTON
(pcs)
350*330*360
48,000
APPROX.
GROSS WEIGHT
(kg)
17.2
WILLAS ELECTRONIC CORP.
WILLAS ELECTRONIC CORP.
WILLAS
FM120-M+
FFM301L
THRU
3.0A SUFRACE MOUNT FAST RECOVERY RECTIFIERS-50-1000V
THRU
FM1200-M+
FFM307L
Pb Free Product
1.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIERS -20V- 200V
S M C - LPACKAGE
PACKAGE
SOD-123+
Package outline
Features
• Batch process design, excellent power dissipation offers
better reverse leakage current and thermal resistance.
SOD-123H
• Low profile surface mounted application in order to
Rating and characteristic curves
MIL-STD-19500 /228
INSTANTANEOUS FORWARD CURRENT,(A)
• RoHS product for packing code suffix "G"
Halogen
free product for packing code suffix "H"
10
Mechanical data
0.146(3.7)
0.130(3.3)
0.012(0.3) Typ.
FIG.2-TYPICAL FORWARD CURRENT DERATING CURVE
0.071(1.8)
0.056(1.4)
AVERAGE FORWARD CURRENT,(A)
optimize board space.
• Low power loss, high efficiency.
• High current capability, low forward voltage drop.
capability. FORWARD
• High surge
FIG.1-TYPICAL
• Guardring for overvoltage protection.
switching.
• Ultra high-speedCHARACTERISTICS
• Silicon epitaxial planar chip, metal silicon junction.
parts meet environmental standards of
• Lead-free
50
3.6
3.0
2.4
1.8
0.040(1.0)
0.024(0.6)
P.C.B. Mounted on
0.32" x 0.32" (8 mm x 8 mm)
Copper Pad Areas
• Epoxy
1.2
3.0 : UL94-V0 rated flame retardant
• Case : Molded plastic, SOD-123H
0.6
,
1.0
• Terminals
:Plated terminals, solderable per MIL-STD-750
0
0.031(0.8) Typ.
Method 2026
0
20
40
TJ=25 C
• Polarity : Indicated by cathodePulse
band
Width 300us
1% Duty Cycle
• Mounting Position : Any
0.1
• Weight : Approximated 0.011 gram
0.031(0.8) Typ.
60
80
100
120
140
160
180
200
in inches and
LEADDimensions
TEMPERATURE
(°C)(millimeters)
FIG.4-MAXIMUM NON-REPETITIVE FORWARD
SURGE CURRENT
PEAK FORWAARD SURGE CURRENT,(A)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25℃ ambient temperature unless otherwise specified.
.01
.6 wave,
.8 60Hz,
1.0 resistive
1.2 1.4of inductive
1.6 1.8 load.
2.0
Single phase half
VOLTAGE,(V)
For capacitive load, derateFORWARD
current by
20%
100
80
8.3ms Single Half
TJ=25 C
FM140-MH FM150-MH FM160-MH FM180-MH FM1100-MH FM1150-MH FM1200-MH UNIT
SYMBOL FM120-MH FM130-MH
RATINGS
60
FIG.3- TEST
CIRCUIT DIAGRAM AND REVERSE
Sine Wave
Marking Code
12
13
14
15
16
18
10
115
120
JEDEC method
RECOVERY TIME CHARACTERISTICS
20
30
40
50
60
80
100
150
200
Maximum Recurrent Peak Reverse Voltage
Volts
VRRM
40
50W
10W
NONINDUCTIVE
NONINDUCTIVE
Maximum RMS
Voltage
Maximum DC Blocking Voltage
VRMS
14
VDC
20
IO ( )
PULSE
Current 8.3 ms single half sine-wave GENERATOR
(NOTE
IFSM 2)
Maximum Average
Forward Rectified Current
(+)
Peak
25Vdc
Forward(approx.)
Surge
( )
D.U.T.
superimposed on rated load
(JEDEC method)
1W
NON-
INDUCTIVE
Typical Thermal Resistance
(Note 2)
OSCILLISCOPE
(NOTE 1)
Operating
28
35
42
56
70
105
140
Volts
30
20
40
50
60
80
100
150
200
Volts
RΘJA
NOTES: 1. Rise Time=
7ns max., Input Impedance= 1 megohm.22pF. TJ
Temperature
Range
1.0
10
30
0
1
5
(+)
CJ
Typical Junction Capacitance (Note 1)
21
Amps
50
Amps
100
NUMBER OF CYCLES AT 60Hz
40
120
FIG.5-TYPICAL JUNCTION CAPACITANCE
-55 to +150
℃/W
- 65 to +175
℃
-55 to +125
2. Rise Time= 10ns max., Source Impedance= 50 ohms.
Storage Temperature
Range
TSTG
PF
℃
CHARACTERISTICS
VF
|
+0.5A
Maximum Average Reverse
Current at @T
A=25℃
|
|
@T
A=125℃
|
Rated DC Blocking Voltage
|
|
|
|
NOTES:
0
1- Measured at 1 MHZ-0.25A
and applied reverse voltage of 4.0 VDC.
2- Thermal Resistance From Junction to Ambient
IR
JUNCTION CAPACITANCE,(pF)
SYMBOL FM120-MH FM130-MH FM140-MH FM150-MH FM160-MH FM180-MH FM1100-MH FM1150-MH FM1200-MH UNIT
Maximum Forward Voltage at 1.0A trrDC
0.50
0.70
0.85
0.5
0.9
0.92
Volts
10
mAmps
-1.0A
REVERSE VOLTAGE,(V)
1cm
SET TIME BASE FOR
50 / 10ns / cm
2012-06
2012-1
WILLAS ELECTRONIC CORP.
WILLAS ELECTRONIC CORP.
WILLAS
FM120-M+
FFM01L
THRU
.0A SUFRACE MOUNT FAST RECOVERY RECTIFIERS-50-1000V
THRU
FM1200-M+
FFM07L
Pb Free Product
1.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIERS -20V- 200V
6 0 & /PACKAGE
PACKAGE
SOD-123+
Package outline
Features
Pinning
information
• Batch process design, excellent power dissipation offers
better reverse leakage current and thermal resistance.
SOD-123H
Simplified
outline
surface mounted application in order
to
• Low profile Pin
optimize board space.
• Low power loss, high efficiency.
Pin1
currentcathode
capability, low forward voltage drop.
• High
1
surge capability.
• High
Pin2
anode
• Guardring for overvoltage protection.
• Ultra high-speed switching.
• Silicon epitaxial planar chip, metal silicon junction.
• Lead-free parts meet environmental standards of
MIL-STD-19500 /228
• RoHS product for packing code suffix "G"
Marking
Halogen free product for packing code suffix "H"
Mechanical data
Type number
Symbol
0.146(3.7)
0.130(3.3)
2
0.012(0.3) Typ.
1
2
0.071(1.8)
0.056(1.4)
Marking code
0.040(1.0)
0.024(0.6)
• Epoxy : UL94-V0 rated flame retardant
FFM301/
F31
plastic, SOD-123H
• Case : Molded
,
FFM302/
F32
• Terminals :Plated terminals, solderable per MIL-STD-750
FFM303/
Method 2026
• Polarity FFM304/
: Indicated by cathode band
FFM305/
Position : Any
• Mounting
FFM306/
• Weight : Approximated 0.011 gram
FFM307/
0.031(0.8) Typ.
F33
F34
F35
F36
F37
0.031(0.8) Typ.
Dimensions in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25℃ ambient temperature unless otherwise specified.
Single phase half wave, 60Hz, resistive of inductive load.
For capacitive load, derate current by 20%
Suggested solder pad layout
RATINGS
SYMBOL FM120-MH FM130-MH FM140-MH FM150-MH FM160-MH FM180-MH FM1100-MH FM1150-MH FM1200-MH UNIT
Marking Code
12
20
VRRM
Maximum Recurrent Peak Reverse Voltage
Maximum RMS Voltage
VRMS
14
Maximum DC Blocking Voltage
VDC
20
Maximum Average Forward Rectified Current
IO
IFSM
Peak Forward Surge Current 8.3 ms single half sine-wave
A
superimposed on rated load (JEDEC method)
13
30
CJ
Typical Junction Capacitance (Note 1)
Storage Temperature Range
16
60
18
80
10
100
115
150
120
200
Volts
21
28
35
42
56
70
105
140
30
40
50
60
80
100
150
200
Volts
1.0
30
40
120
B
-55 to +125
TJ
Operating Temperature Range
15
50
Volts
C
RΘJA
Typical Thermal Resistance (Note 2)
14
40
Amps
Amps
℃/W
PF
-55 to +150
℃
- 65 to +175
TSTG
℃
CHARACTERISTICS
SYMBOL FM120-MH FM130-MH FM140-MH FM150-MH FM160-MH FM180-MH FM1100-MH FM1150-MH FM1200-MH UNIT
VF
Maximum Forward Voltage at 1.0A DC
Maximum Average Reverse Current at @T A=25℃
Rated DC Blocking Voltage
0.50
0.70
Dimensions in inches and (millimeters)
@T A=125℃
0.85
0.5
IR
0.9
0.92
Volts
10
mAmps
NOTES:
1- Measured at 1 MHZ and applied reverse voltage of 4.0 VDC.
2- Thermal Resistance From Junction to Ambient
2012-06
2012-1
PACKAGE
A
B
C
SMC/
0.189 (4.80)
0.063 (1.60)
0.158 (4.00)
WILLAS ELECTRONIC CORP.
WILLAS ELECTRONIC CORP.
WILLAS
FM120-M+
FFM01L
THRU
.0A SUFRACE MOUNT FAST RECOVERY RECTIFIERS-50-1000V
THRU
FM1200-M+
FFM07L
Pb Free Product
1.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIERS -20V- 200V
6 0 & /PACKAGE
PACKAGE
SOD-123+
Package outline
Packing
information
Features
• Batch process design, excellent power dissipation offers
better reverse leakage current and thermal resistance.
SOD-123H
• Low profile surface mounted application in order to
P0
optimize board space.
• Low power loss, high efficiency.
P1
voltage drop.
• High current capability, low forward
d
• High surge capability.
for overvoltage protection.
• Guardring
E
• Ultra high-speed switching.
•FSilicon epitaxial planar chip, metal silicon junction.
• Lead-free parts meet environmental standards of
•
0.146(3.7)
0.130(3.3)
0.012(0.3) Typ.
0.071(1.8)
0.056(1.4)
B
MIL-STD-19500 /228
RoHS product for packing code suffix "G"
Halogen free product for packing code suffix "H"
W
Mechanical data
0.040(1.0)
0.024(0.6)
A
P
rated flame retardant
• Epoxy : UL94-V0
• Case : Molded plastic, SOD-123H
,
• Terminals :Plated terminals, solderable per MIL-STD-750
0.031(0.8) Typ.
0.031(0.8) Typ.
Method 2026
• Polarity : Indicated by cathode band
• Mounting Position : Any
• Weight : Approximated 0.011 gram
Dimensions in inches and (millimeters)
D2
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
D1
T
Ratings at 25℃ ambient temperature unless otherwise specified.
Single phase half wave, 60Hz, resistive of inductive load.
For capacitive load, derate current by 20%
C
W1
D
RATINGS
SYMBOL FM120-MH FM130-MH FM140-MH FM150-MH FM160-MH FM180-MH FM1100-MH FM1150-MH FM1200-MH UNIT
Marking Code
VRRM
Maximum Recurrent Peak Reverse Voltage
12
20
13
30
14
40
15
50
16
60
Maximum RMS Voltage
VRMS
14
21
28
35
42
Maximum DC Blocking Voltage
VDC
20
30
40
50
60
Maximum Average Forward Rectified Current
Item
Peak Forward Surge Current 8.3 ms single half sine-wave
superimposed on rated load (JEDEC method)
IO
IFSM
Symbol
Tolerance
18
80
56
unit:mm
80
1.0
SMC
30
115
150
120
200
Volts
70
105
140
Volts
100
150
200
Volts
Amps
Amps
5.10
Carrier width
A
0.1
40
RΘJA
7.20
Carrier length
B
0.1
120
Typical Junction Capacitance (Note 1)
CJ
Carrier depth
C
0.1
2.50
-55 to +125
-55 to +150
Operating Temperature Range
TJ
1.50
Sprocket hole
d
0.1
65
to
+175
Storage Temperature Range
TSTG
330.00
13" Reel outside diameter
D
2.0
50.00
13" Reel inner diameter
D1
min
FM150-MH FM160-MH
CHARACTERISTICS
SYMBOL FM120-MHDFM130-MH FM140-MH
178.00 FM180-MH FM1100-MH FM1150-MH FM1200-MH
7" Reel outside diameter
2.0
0.9
Maximum Forward Voltage at 1.0A DC
0.92
VF
0.50min
0.70 62.00
0.85
7" Reel inner diameter
D1
0.5
Maximum Average Reverse Current Feed
at @T
13.00
hole
diameter
0.5
D2
A=25℃
IR
1.75
Sprocket
hole position
E
0.1
10
@T A=125℃
Rated DC Blocking Voltage
5.50
Punch hole position
F
0.1
NOTES:
8.00
Punch hole pitch
P
0.1
1- Measured at 1 MHZ and applied reverse
voltagehole
of 4.0
VDC.
4.00
P0
0.1
Sprocket
pitch
2- Thermal Resistance From Junction toEmbossment
Ambient
2.00
0.1
center
P1
0.23
Overall tape thickness
T
0.1
12.00
W
0.3
Tape width
18.00
Reel width
W1
1.0
Typical Thermal Resistance (Note 2)
10
100
℃/W
PF
℃
℃
UNIT
Volts
mAmps
Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above.
2012-06
2012-1
WILLAS ELECTRONIC CORP.
WILLAS ELECTRONIC CORP.