INTEGRATED CIRCUITS DATA SHEET TDA1518BQ 24 W BTL or 2 x 12 watt stereo car radio power amplifier Product specification File under Integrated Circuits, IC01 July 1994 Philips Semiconductors Product specification 24 W BTL or 2 x 12 watt stereo car radio power amplifier TDA1518BQ GENERAL DESCRIPTION The TDA1518BQ is an integrated class-B output amplifier in a 13-lead single-in-line (SIL) plastic power package. The device is primarily developed for car radio applications. FEATURES • Requires very few external components • Thermally protected • Flexibility in use stereo as well as mono BTL • Reverse polarity safe • High output power (without bootstrap) • Capability to handle high energy on outputs (VP = 0 V) • Low offset voltage at output (important for BTL) • No switch-on/switch-off plop • Fixed gain • Flexible leads • Good ripple rejection • Low thermal resistance • Mute/stand-by switch • Identical inputs (inverting and non-inverting) • Load dump protection • Compatible with TDA1516BQ (except gain). • A.C. and d.c. short-circuit-safe to ground and VP QUICK REFERENCE DATA PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT Supply voltage range operating VP 6,0 14,4 18,0 V non-operating VP − − 30,0 V load dump VP − − 45,0 V IORM − − 4 A Total quiescent current Itot − 30 − mA Stand-by current lsb − 0,1 100 µA Switch-on current Isw − − 40 µA BTL |ZI| 25 − − kΩ stereo |ZI| 50 − − kΩ THD = 10%; 4 Ω Po − 6 − W THD = 10%; 2 Ω Po − 11 − W Channel separation α 40 − − dB Noise output voltage Vno(rms) − 150 − µV Po − 22 − W RR 48 − − dB |∆VO| − − 250 mV Repetitive peak output current Input impedance Stereo application Output power BTL application Output power THD = 10%, 4 Ω Supply voltage RS = 0 Ω; ripple rejection f = 100 Hz to 10 kHz D.C. output offset voltage July 1994 2 Philips Semiconductors Product specification 24 W BTL or 2 x 12 watt stereo car radio power amplifier TDA1518BQ PACKAGE OUTLINE 13-lead SIL-bent-to-DIL; plastic power (SOT141C); SOT141-6; 1996 July 19. Fig.1 Block diagram. July 1994 3 Philips Semiconductors Product specification 24 W BTL or 2 x 12 watt stereo car radio power amplifier TDA1518BQ PINNING 1 −INV1 non-inverting input 1 8 BS2 bootstrap 2 2 INV inverting input 9 OUT2 output 2 3 GND1 ground (signal) 10 VP supply voltage 4 Vref reference voltage 11 M/SS mute/stand-by switch 5 OUT1 output 1 12 RR supply voltage ripple rejection 13 −INV2 non-inverting input 2 6 BS1 bootstrap 1 7 GND2 ground (substrate) FUNCTIONAL DESCRIPTION The TDA1518BQ contains two identical amplifiers with differential input stages. This device can be used for stereo or bridge applications. The gain of each amplifier is fixed at 40 dB. A special feature of this device is the mute/stand-by switch which has the following features: • low stand-by current (< 100 µA) • low mute/stand-by switching current (low cost supply switch) • mute condition. RATINGS Limiting values in accordance with the Absolute Maximum System (IEC 134) PARAMETER CONDITIONS SYMBOL MIN. MAX. UNIT Supply voltage operating VP − 18 V non-operating VP − 30 V VP − 45 V safe voltage VPSC − 18 V Reverse polarity VPR − 6 V − 200 mJ IOSM − 6 A IORM − 4 A Ptot − 25 W Crystal temperature Tc − 150 °C Storage temperature range Tstg −55 +150 °C load dump during 50 ms; tr ≥ 2,5 ms A.C. and d.c. short-circuit- Energy handling capability at outputs VP = 0 V Non-repetitive peak output current Repetitive peak output current Total power dissipation July 1994 see Fig.2 4 Philips Semiconductors Product specification 24 W BTL or 2 x 12 watt stereo car radio power amplifier TDA1518BQ Fig.2 Power derating curve. July 1994 5 Philips Semiconductors Product specification 24 W BTL or 2 x 12 watt stereo car radio power amplifier TDA1518BQ D.C. CHARACTERISTICS (note 1) VP = 14.4 V; Tamb = 25 °C; unless otherwise specified PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT Supply Supply voltage range note 2 Quiescent current VP 6,0 14,4 18,0 V IP − 30 note 3 mA VO − 6,8 − V |∆V5-9| − − 200 mV VON 8,5 − − V Vmute 3,0 − 6,4 V VO − note 3 20 mV |∆V5-9| − − 250 mV Vsb 0 − 2 V lsb − − 100 µA lsw − 12 40 µA D.C. output voltage at approximately VP/2 note 4 D.C. output offset voltage Mute/stand-by switch Switch-on voltage level Mute condition Output signal in mute position VI = 1 V (max.); f = 20 Hz to 15 kHz D.C. output offset voltage Stand-by condition D.C. current in stand-by condition Switch-on current July 1994 6 Philips Semiconductors Product specification 24 W BTL or 2 x 12 watt stereo car radio power amplifier TDA1518BQ A.C. CHARACTERISTICS VP = 14,4 V; RL = 4 Ω; f = 1 kHz; Tamb = 25 °C; unless otherwise specified PARAMETER Stereo application Output power CONDITIONS SYMBOL MIN. TYP. MAX. UNIT note 1 note 5; THD = 0,5% Po 4 5 − W THD = 10% Po 5,5 6,0 − W Po 6 7 − W THD = 0,5% Po 7,75 8,5 − W THD = 10% Po 10 11 − W Po 10,5 12,0 − W −3 dB fL − 45 − Hz −1 dB fH 20 − − kHz Gv 39 40 41 dB notes 5 and 6; THD = 10% Output power at RL = 2 Ω note 5; notes 5 and 6; THD = 10% Low frequency roll-off High frequency roll-off note 7; Closed loop voltage gain Supply voltage ripple rejection: note 8 ON RR 48 − − dB mute RR 48 − − dB stand-by RR 80 − − dB |ZI| 50 60 75 kΩ Input impedance Noise output voltage: note 9; ON RS = 0 Ω Vno(rms) − 150 − µV ON RS = 10 kΩ Vno(rms) − 250 500 µV mute note 10 Vno(rms) − 120 − µV RS = 10 kΩ α 40 − − dB Gv − 0.1 1 dB Channel separation Channel balance BTL application note 11 Output power THD = 0,5% Po 15,5 17,0 − W THD = 10% Po 20 22 − W note 6; THD = 10% Po 21 24 − W THD = 0,5% Po − 13.5 − W THD = 10% Po − 17 − W note 6; THD = 10% Po − 19 − W Bw − 20 to − Hz Output power at VP = 13,2 V Power bandwidth THD = 0,5% Po = 15 W 15 000 July 1994 7 Philips Semiconductors Product specification 24 W BTL or 2 x 12 watt stereo car radio power amplifier PARAMETER TDA1518BQ CONDITIONS SYMBOL MIN. TYP. MAX. UNIT Low frequency roll-off note 7; −3 dB fL − 45 − Hz High frequency roll-off −1 dB fH 20 − − kHz Gv 45 46 47 dB ON RR 48 − − dB mute RR 48 − − dB stand-by RR 80 − − dB |ZI| 25 30 38 kΩ Closed loop voltage gain Supply voltage ripple rejection: note 8 Input impedance Noise output voltage: note 9; ON RS = 0 Ω Vno(rms) − 200 − µV ON RS = 10 kΩ Vno(rms) − 350 700 µV mute note 10 Vno(rms) − 120 − µV dV/dt − − note 3 V/ms Switch-on/switch-off behaviour Notes to the characteristics 1. All characteristics, for stereo application are measured using the circuit shown in Fig.3. 2. The circuit is d.c. adjusted at VP = 6 V to 18 V and a.c. operating at VP = 8,1 V to 18 V. 3. Value to be fixed. 4. At 18 V < VP < 30 V the d.c. output voltage ≤ VP/2. 5. Output power is measured directly at the output pins of the lC. 6. With bootstrap and a 100 kΩ resistor from pin 12 to the positive supply voltage (VP), value of bootstrap capacitor is 47 µF. 7. Frequency response externally fixed. 8. Ripple rejection measured at the output with a source impedance of 0 Ω (maximum ripple amplitude of 2 V) and a frequency between 1 kHz and 10 kHz. 9. Noise voltage measured in a bandwidth of 20 Hz to 20 kHz. 10. Noise output voltage independent of RS (VI = 0 V). 11. All characteristics, for BTL application are measured using the circuit shown in Fig.4. July 1994 8 Philips Semiconductors Product specification 24 W BTL or 2 x 12 watt stereo car radio power amplifier TDA1518BQ APPLICATION INFORMATION Fig.3 Stereo application circuit diagram. Fig.4 BTL application circuit diagram (without bootstrapping). July 1994 9 Philips Semiconductors Product specification 24 W BTL or 2 x 12 watt stereo car radio power amplifier TDA1518BQ PACKAGE OUTLINE DBS13P: plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm) SOT141-6 non-concave Dh x D Eh view B: mounting base side d A2 B j E A L3 L Q c 1 v M 13 e1 Z e bp e2 m w M 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A2 bp c D (1) d Dh E (1) e e1 e2 Eh j L L3 m Q v w x Z (1) mm 17.0 15.5 4.6 4.2 0.75 0.60 0.48 0.38 24.0 23.6 20.0 19.6 10 12.2 11.8 3.4 1.7 5.08 6 3.4 3.1 12.4 11.0 2.4 1.6 4.3 2.1 1.8 0.8 0.25 0.03 2.00 1.45 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 95-03-11 97-12-16 SOT141-6 July 1994 EUROPEAN PROJECTION 10 Philips Semiconductors Product specification 24 W BTL or 2 x 12 watt stereo car radio power amplifier TDA1518BQ The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. July 1994 11