PHILIPS HEF4794BT

INTEGRATED CIRCUITS
DATA SHEET
HEF4794B
8-stage shift-and-store register
LED driver
Product specification
Supersedes data of 1994 Jul 01
File under Integrated Circuits, IC04
1999 Jun 30
Philips Semiconductors
Product specification
8-stage shift-and-store register LED driver
HEF4794B
transferred to the storage register when the strobe (STR)
input is HIGH. Data in the storage register appears at the
outputs whenever the output enable (EO) signal is HIGH.
APPLICATIONS
• Automotive
• Industrial.
Two serial outputs (OS and OS') are available for
cascading a number of HEF4794B devices. Data is
available at OS on positive-going clock edges to allow
high-speed operation in cascaded systems in which the
clock rise time is fast. The same serial information is
available at OS' on the next negative-going clock edge and
provides cascading HEF4794B devices when the clock
rise time is slow.
GENERAL DESCRIPTION
The HEF4794B is an 8-stage serial shift register having a
storage latch associated with each stage for strobing data
from the serial input to parallel LED driver outputs
O0 to O7. Data is shifted on positive-going clock
transitions. The data in each shift register stage is
ORDERING INFORMATION
PACKAGES
TYPE NUMBER
PINS
PIN POSITION
MATERIAL
CODE
HEF4794BT
16
SO16
plastic
SOT109-1
HEF4794BP
16
DIP16
plastic
SOT38-1
FUNCTIONAL DIAGRAM
LOGIC DIAGRAMS
V DD
16
HEF4794B
D 2
10 O S'
8-STAGE SHIFT
REGISTER
CP 3
9
STR
1
OS
D
handbook, halfpage
8-BIT STORAGE
REGISTER
CP
O
MBD912
EO
15
OPEN-DRAIN OUTPUTS
8
4
VSS O 0
5
6
O1
O2 O3
7
14
13
12
11
O4
O5 O6
O7
MBD909
Fig.2 One D-latch.
Fig.1 Functional diagram.
1999 Jun 30
2
Philips Semiconductors
Product specification
8-stage shift-and-store register LED driver
HEF4794B
handbook, full pagewidth
STAGE 0
D
D
STAGE 1 to 6
D
O
STAGE 7
O
CP
D
OS
O
CP
FF
1
FF
8
D
CP
OS '
Q
CP
latch
D
O
D
CP
O
CP
latch
1
latch
8
STR
HEF4794B
EO
MBD911
O0
O 1 O2 O 3 O 4 O 5 O 6
O7
Fig.3 Logic diagram.
PINNING
SYMBOL
PIN
DESCRIPTION
STR
1
strobe input
D
2
data input
CP
3
clock input
O0 to O3
VSS
OS,OS'
4 to 7
8
9 and 10
STR
1
16 VDD
D
2
15
14 O 4
EO
parallel outputs 0 to 3
(open drain)
CP
3
O0
4
ground
O1
5
12 O 6
serial outputs
O2
6
11 O 7
O3
7
10 O S'
V SS
8
9
O7
11
parallel output 7 (open drain)
O6
12
parallel output 6 (open drain)
O5
13
parallel output 5 (open drain)
O4
14
parallel output 4 (open drain)
EO
15
output enable input
VDD
16
supply voltage
1999 Jun 30
handbook, halfpage
13 O 5
HEF4794B
OS
MBD910
Fig.4 Pin configuration.
3
Philips Semiconductors
Product specification
8-stage shift-and-store register LED driver
HEF4794B
FUNCTIONAL DESCRIPTION
FAMILY DATA
Table 1
See “Family Specifications” except for: rating for DC
current into any open-drain output is 40 mA.
Function table; note 1
PARALLEL
OUTPUTS
INPUTS
SERIAL
OUTPUTS
CP
EO
STR
D
O0
On
OS
OS'
↑
L
X
X
Z
Z
O6'
nc
↓
L
X
X
Z
Z
nc
O7
↑
H
L
X
nc
nc
O6'
nc
↑
H
H
L
L
On − 1
O6'
nc
↑
H
H
H
H
On − 1
O6'
nc
↓
H
H
H
nc
nc
nc
O7
IDD LIMITS CATEGORY MSI
See “Family Specifications” for ratings.
Note
1. H = HIGH state;
L = LOW state;
X = don’t care;
↑ = positive-going transition;
↓ = negative-going transition;
Z = high-impedance OFF state;
nc = no change;
O6' = the information in the seventh shift register
stage.
a) At the positive clock edge the information in the
7th register stage is transferred to the 8th register
stage and the OS output.
DC CHARACTERISTICS
VSS = 0 V.
Tamb (°C)
SYMBOL
PARAMETER
−40
CONDITIONS
MIN.
VOL
IOZH
1999 Jun 30
LOW level output
voltage
HIGH level output
leakage current;
3-state
MAX.
+25
MIN.
MAX.
+85
MIN.
UNIT
MAX.
VI = VSS or VDD;
IO < 20 mA; VDD = 5 V
−
0.75
−
0.75
−
1.5
V
VI = VSS or VDD;
IO < 20 mA;
VDD = 10 V
−
0.75
−
0.75
−
1.5
V
VI = VSS or VDD;
IO < 20 mA;
VDD = 15 V
−
0.75
−
0.75
−
1.5
V
VO = 15 V; VDD = 5 V
−
2
−
2
−
15
µA
VO = 15 V; VDD = 10 V
−
2
−
2
−
15
µA
VO = 15 V; VDD = 15 V
−
2
−
2
−
15
µA
4
Philips Semiconductors
Product specification
8-stage shift-and-store register LED driver
HEF4794B
AC POWER CHARACTERISTICS
VSS = 0 V; Tamb = 25 °C; input transition times ≤ 20 ns; unless otherwise specified.
SYMBOL
P
PARAMETER
TYPICAL FORMULA FOR P (µW)(1)
CONDITIONS
dynamic power dissipation per
package
VDD = 5 V
1200f i + Σ ( f o C L ) × V DD
VDD = 10 V
5550f i + Σ ( f o C L ) × V DD
VDD = 15 V
15000f i + Σ ( f o C L ) × V DD
2
2
2
Note
1. Where:
RL = ∞;
fi = input frequency (MHz);
fo = output frequency (MHz);
CL = load capacitance (pF);
Σ(foCL) = sum of outputs;
VDD = supply voltage (V).
AC TIMING CHARACTERISTICS
VSS = 0 V; Tamb = 25 °C; CL = 50 pF; input transition times ≤20 ns; unless otherwise specified.
SYMBOL
tPHL
tPLH
tPHL
tPLH
tPZL
tPLZ
1999 Jun 30
PARAMETER
propagation delay time CP to OS;
HIGH-to-LOW
propagation delay time CP to OS;
LOW-to-HIGH
propagation delay time CP to OS';
HIGH-to-LOW
propagation delay time CP to OS';
LOW-to-HIGH
propagation delay time CP to On;
OFF-to-LOW
propagation delay time CP to On;
LOW-to-OFF
VDD
(V)
MIN.
TYP.
MAX.
UNIT
TYPICAL
EXTRAPOLATION
FORMULA
5
−
160
320
ns
132 ns + (0.55 ns/pF)CL
10
−
65
130
ns
53 ns + (0.23 ns/pF)CL
15
−
45
90
ns
37 ns + (0.16 ns/pF)CL
5
−
130
260
ns
102 ns + (0.55 ns/pF)CL
10
−
55
110
ns
44 ns + (0.23 ns/pF)CL
15
−
40
80
ns
32 ns + (0.16 ns/pF)CL
5
−
120
240
ns
92 ns + (0.55 ns/pF)CL
10
−
50
100
ns
39 ns + (0.23 ns/pF)CL
15
−
40
80
ns
32 ns + (0.16 ns/pF)CL
5
−
130
260
ns
102 ns + (0.55 ns/pF)CL
10
−
60
120
ns
49 ns + (0.23 ns/pF)CL
15
−
45
90
ns
37 ns + (0.16 ns/pF)CL
5
−
240
480
ns
note 1
10
−
80
160
ns
15
−
55
110
ns
5
−
170
340
ns
10
−
75
150
ns
15
−
60
120
ns
5
note 1
Philips Semiconductors
Product specification
8-stage shift-and-store register LED driver
SYMBOL
tPZL
tPLZ
tTHL
tTLH
tPZL
tPLZ
tWCPL
PARAMETER
VDD
(V)
tsu
th
fclk(max)
−
MAX.
UNIT
−
−
propagation delay time STR to On; 5
LOW-to-OFF
10
−
100
−
40
100
ns
15
−
35
70
ns
5
−
85
170
ns
35 ns + (1.0 ns/pF)CL
10
−
40
80
ns
19 ns + (0.42 ns/pF)CL
15
−
30
60
ns
16 ns + (0.28 ns/pF)CL
5
−
85
170
ns
35 ns + (1.0 ns/pF)CL
10
−
40
80
ns
19 ns + (0.42 ns/pF)CL
15
−
30
60
ns
16 ns + (0.28 ns/pF)CL
5
−
100
200
ns
note 1
10
−
55
110
ns
15
−
50
100
ns
5
−
80
160
ns
10
−
40
80
ns
15
−
30
60
ns
5
60
30
−
ns
10
30
15
−
ns
output transition time OS and OS';
LOW-to-HIGH
output enable time EO to On;
OFF-to-LOW
output disable time EO to On;
LOW-to-OFF
minimum clock pulse width LOW
hold time D to CP
maximum clock frequency
ns
70
140
ns
55
110
ns
200
ns
24
12
−
ns
80
40
−
ns
10
60
30
−
ns
15
24
12
−
ns
5
60
30
−
ns
10
20
10
−
ns
15
15
5
−
ns
minimum strobe pulse width HIGH 5
set-up time D to CP
280
TYPICAL
EXTRAPOLATION
FORMULA
15
output transition time OS and OS';
HIGH-to-LOW
140
+5
+5
−15
−
ns
10
20
5
−
ns
15
20
5
−
ns
5
5
10
−
MHz
10
11
22
−
MHz
15
14
28
−
MHz
Note
1. Definition of symbol equivalent to 3-state outputs.
1999 Jun 30
TYP.
propagation delay time STR to On; 5
OFF-to-LOW
10
15
tWSTRH
MIN.
HEF4794B
6
note 1
note 1
note 1
Philips Semiconductors
Product specification
8-stage shift-and-store register LED driver
HEF4794B
handbook, full pagewidth
clock input
data input
strobe input
output enable input
internal O 0 ' (FF1)
output O0
internal O 6 ' (FF7)
output O6
serial output O S
serial output O S '
MBD914
Fig.5 Timing diagram.
1999 Jun 30
7
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O7
VDD
8
D
HEF4794B
EO
STR
O S'
CP
V SS
O0
VDD
O7
O S'
HEF4794B
D
EO
STR
CP
VSS
PWM
dimmer input
Philips Semiconductors
O0
8-stage shift-and-store register LED driver
VCC
APPLICATION INFORMATION
1999 Jun 30
VDD
MBD913
CONTROL AND
SYNC CIRCUITRY
DATA
CLOCK
Product specification
Fig.6 Application example: serial-to-parallel converting LED drivers.
HEF4794B
handbook, full pagewidth
from remote
controller
Philips Semiconductors
Product specification
8-stage shift-and-store register LED driver
HEF4794B
PACKAGE OUTLINES
SO16: plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
D
E
A
X
c
y
HE
v M A
Z
16
9
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
1
L
8
e
0
detail X
w M
bp
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
mm
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
10.0
9.8
4.0
3.8
1.27
6.2
5.8
1.05
1.0
0.4
0.7
0.6
0.25
0.25
0.1
0.7
0.3
0.01
0.019 0.0100 0.39
0.014 0.0075 0.38
0.16
0.15
0.244
0.050
0.041
0.228
0.039
0.016
0.028
0.020
inches
0.010 0.057
0.069
0.004 0.049
0.01
0.01
0.028
0.004
0.012
θ
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT109-1
076E07S
MS-012AC
1999 Jun 30
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
95-01-23
97-05-22
9
o
8
0o
Philips Semiconductors
Product specification
8-stage shift-and-store register LED driver
HEF4794B
DIP16: plastic dual in-line package; 16 leads (300 mil); long body
SOT38-1
ME
seating plane
D
A2
A
A1
L
c
e
Z
b1
w M
(e 1)
b
MH
9
16
pin 1 index
E
1
8
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
min.
A2
max.
b
b1
c
D (1)
E (1)
e
e1
L
ME
MH
w
Z (1)
max.
mm
4.7
0.51
3.7
1.40
1.14
0.53
0.38
0.32
0.23
21.8
21.4
6.48
6.20
2.54
7.62
3.9
3.4
8.25
7.80
9.5
8.3
0.254
2.2
inches
0.19
0.020
0.15
0.055
0.045
0.021
0.015
0.013
0.009
0.86
0.84
0.26
0.24
0.10
0.30
0.15
0.13
0.32
0.31
0.37
0.33
0.01
0.087
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT38-1
050G09
MO-001AE
1999 Jun 30
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
92-10-02
95-01-19
10
Philips Semiconductors
Product specification
8-stage shift-and-store register LED driver
HEF4794B
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.
SOLDERING
Introduction
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
WAVE SOLDERING
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mount components are mixed on
one printed-circuit board. However, wave soldering is not
always suitable for surface mount ICs, or for printed-circuit
boards with high population densities. In these situations
reflow soldering is often used.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
Through-hole mount packages
SOLDERING BY DIPPING OR BY SOLDER WAVE
• For packages with leads on two sides and a pitch (e):
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joints for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg(max)). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
The footprint must incorporate solder thieves at the
downstream end.
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
MANUAL SOLDERING
Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400 °C, contact may be up to 5 seconds.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Surface mount packages
REFLOW SOLDERING
MANUAL SOLDERING
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.
1999 Jun 30
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
11
Philips Semiconductors
Product specification
8-stage shift-and-store register LED driver
HEF4794B
Suitability of IC packages for wave, reflow and dipping soldering methods
SOLDERING METHOD
MOUNTING
PACKAGE
WAVE
REFLOW(1) DIPPING
Through-hole mount DBS, DIP, HDIP, SDIP, SIL
suitable(2)
−
suitable
Surface mount
not suitable
suitable
−
suitable
−
BGA, SQFP
suitable(3)
HLQFP, HSQFP, HSOP, HTQFP, HTSSOP,
SMS
not
PLCC(4), SO, SOJ
suitable
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
suitable
−
not
recommended(4)(5)
suitable
−
not
recommended(6)
suitable
−
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
4. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
1999 Jun 30
12
Philips Semiconductors
Product specification
8-stage shift-and-store register LED driver
HEF4794B
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1999 Jun 30
13
Philips Semiconductors
Product specification
8-stage shift-and-store register LED driver
NOTES
1999 Jun 30
14
HEF4794B
Philips Semiconductors
Product specification
8-stage shift-and-store register LED driver
NOTES
1999 Jun 30
15
HEF4794B
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Tel. +91 22 493 8541, Fax. +91 22 493 0966
Indonesia: PT Philips Development Corporation, Semiconductors Division,
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,
Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080
Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,
20124 MILANO, Tel. +39 02 67 52 2531, Fax. +39 02 67 52 2557
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,
TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087
Middle East: see Italy
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. +31 40 27 82785, Fax. +31 40 27 88399
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. +64 9 849 4160, Fax. +64 9 849 7811
Norway: Box 1, Manglerud 0612, OSLO,
Tel. +47 22 74 8000, Fax. +47 22 74 8341
Pakistan: see Singapore
Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474
Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. +48 22 612 2831, Fax. +48 22 612 2327
Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
Tel. +7 095 755 6918, Fax. +7 095 755 6919
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,
Tel. +65 350 2538, Fax. +65 251 6500
Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,
Tel. +27 11 471 5401, Fax. +27 11 471 5398
South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 821 2382
Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 93 301 6312, Fax. +34 93 301 4107
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 5985 2000, Fax. +46 8 5985 2745
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2741 Fax. +41 1 488 3263
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. +66 2 745 4090, Fax. +66 2 398 0793
Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381, Fax. +1 800 943 0087
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 62 5344, Fax.+381 11 63 5777
For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
Internet: http://www.semiconductors.philips.com
© Philips Electronics N.V. 1999
SCA 66
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
245002/02/pp16
Date of release: 1999 Jun 30
Document order number:
9397 750 06151