PHILIPS BGY206

DISCRETE SEMICONDUCTORS
DATA SHEET
M3D369
BGY206
UHF amplifier module
Product specification
Supersedes data of 1998 Apr 15
1998 May 08
Philips Semiconductors
Product specification
UHF amplifier module
BGY206
FEATURES
PINNING - SOT388B
• 4.8 V nominal supply voltage
PIN
DESCRIPTION
• 3 W output power
1
RF input
• Easy control of output power by DC voltage.
2
VC
3
VS
4
RF output
APPLICATIONS
• Digital cellular radio systems with Time Division Multiple
Access (TDMA) operation (GSM systems) in the
880 to 915 MHz frequency range.
Flange
ground
handbook, halfpage
DESCRIPTION
The BGY206 is a three-stage UHF amplifier module in a
SOT388B package. The module consists of three NPN
silicon planar transistor dies mounted together with
matching and bias circuit components on a metallized
ceramic substrate.
1
2
Top view
3
4
MBK197
Fig.1 Simplified outline.
QUICK REFERENCE DATA
RF performance at Tmb = 25 °C.
MODE OF
OPERATION
f
(MHz)
VS
(V)
VC
(V)
PL
(W)
Gp
(dB)
η
(%)
ZS; ZL
(Ω)
Pulsed; δ = 1 : 8
880 to 915
4.8
≤3.5
3
≥30
typ. 45
50
1998 May 08
2
Philips Semiconductors
Product specification
UHF amplifier module
BGY206
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VS
DC supply voltage
−
10
V
VC
DC control voltage
−
4
V
PD
input drive power
−
13
mW
PL
load power
−
3.5
W
Tstg
storage temperature
−40
+100
°C
Tmb
operating mounting base temperature
−30
+100
°C
VC < 0.5 V
CHARACTERISTICS
ZS = ZL = 50 Ω; PD = 3 mW; VS = 4.8 V; VC ≤ 3.5 V; f = 880 to 915 MHz; Tmb = 25 °C; δ = 1 : 8; tp = 575 µs;
unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
IQ
leakage current
VC = 0.5 V
−
−
100
µA
IC
control current
adjust VC for PL = 3 W
−
−
500
µA
PL
load power
VC = 3.5 V
3
−
−
W
VC = 3.5 V; VS = 4.3 V; Tmb = 85 °C
2
−
−
W
Gp
power gain
adjust VC for PL = 3 W
30
−
−
dB
η
efficiency
adjust VC for PL = 3 W
40
45
−
%
H2
second harmonic
adjust VC for PL = 3 W
−
−
−40
dBc
H3
third harmonic
adjust VC for PL = 3 W
−
−
−40
dBc
VSWRin
input VSWR
adjust VC for PL = 3 W
−
−
2.5 : 1
stability
PD = 1.5 to 6 mW; VS = 4 to 6.5 V;
VC = 0 to 3.5 V; PL ≤ 3 W;
VSWR ≤ 6 : 1 through all phases
−
−
−60
dBc
isolation
VC = 0.5 V
−
−
−36
dBm
1
−
−
MHz
noise power
PL = 3 W; bandwidth = 30 kHz;
20 MHz above transmission band
−
−
−85
dBm
ruggedness
VS = 6.5 V; adjust VC for PL = 3 W;
VSWR ≤ 10 : 1 through all phases
control bandwidth
Pn
1998 May 08
3
no degradation
Philips Semiconductors
Product specification
UHF amplifier module
BGY206
MGD352
MGD353
40
50
handbook, halfpage
PL
(dBm)
PL
(dBm)
30
30
880 MHz
20
915 MHz
10
915 MHz
10
880 MHz
-10
0
-30
1.2
1.6
2.0
2.4
2.8
−10
−25
3.2
3.6
VC (V)
−20
−15
−10
−5
0
5
PD (dBm)
ZS = ZL = 50 Ω; VS = 4.8 V; PD = 3 mW;
Tmb = 25 °C; δ = 1 : 8; tp = 575 µs.
ZS = ZL = 50 Ω; VS = 4.8 V; adjust VC for PL = 3 W;
Tmb = 25 °C; δ = 1 : 8; tp = 575 µs.
Fig.2
Fig.3
Load power as a function of control voltage;
typical values.
Load power as a function of drive power;
typical values.
MBK512
6
MGD355
50
handbook, halfpage
handbook, halfpage
η
(%)
PL
(W)
915 MHz
40
880 MHz
4
880 MHz
915 MHz
30
20
2
10
0
4
5
6
VS (V)
0
7
0
1
2
ZS = ZL = 50 Ω; VC = 3.5 V; PD = 3 mW;
Tmb = 25 °C; δ = 1 : 8; tp = 575 µs.
ZS = ZL = 50 Ω; VS = 4.8 V; PD = 3 mW;
Tmb = 25 °C; δ = 1 : 8; tp = 575 µs
Fig.4
Fig.5
Load power as a function of supply voltage;
typical values.
1998 May 08
4
3
P L (W)
4
Efficiency as a function of load power;
typical values.
Philips Semiconductors
Product specification
UHF amplifier module
BGY206
MGD356
MGD357
5
4
handbook, halfpage
handbook, halfpage
PL
(W)
VC
(V)
4
3
3
2
2
1
1
0
880
890
900
910
f (MHz)
0
880
920
890
900
910
f (MHz)
ZS = ZL = 50 Ω; VS = 4.8 V; PD = 3 mW; VC = 3.5 V;
Tmb = 25 °C; δ = 1 : 8; tp = 575 µs.
ZS = ZL = 50 Ω; VS = 4.8 V; PD = 3 mW; PL = 3 W;
Tmb = 25 °C; δ = 1 : 8; tp = 575 µs.
Fig.6
Fig.7
Load power as a function of frequency;
typical values.
Control voltage as a function of frequency;
typical values.
MGD358
−30
920
MGD359
4
handbook, halfpage
VC
(V)
H2, H3
(dBc)
3
−40
915 MHz
880 MHz
2
H3
−50
H2
−60
880
890
900
910
1
f (MHz)
0
−40
920
0
40
Tmb (oC)
ZS = ZL = 50 Ω; VS = 4.8 V; PD = 3 mW; PL = 3 W;
Tmb = 25 °C; δ = 1 : 8; tp = 575 µs.
ZS = ZL = 50 Ω; VS = 4.8 V; PD = 3 mW; PL = 3 W;
δ = 1 : 8; tp = 575 µs.
Fig.8
Fig.9
Harmonics as a function of frequency;
typical values.
1998 May 08
5
80
Control voltage as a function of mounting
base temperature; typical values.
Philips Semiconductors
Product specification
UHF amplifier module
BGY206
MGD360
MGD361
5
5
handbook, halfpage
handbook, halfpage
PL
(W)
PL
(W)
4
4
880 MHz
915 MHz
880 MHz
3
3
915 MHz
2
2
1
1
0
−20
0
20
40
0
−20
60
80
Tmb (oC)
ZS = ZL = 50 Ω; VS = 4.3 V; PD = 3 mW; VC = 3.5 V;
δ = 1 : 8; tp = 575 µs.
0
20
40
60
80
Tmb (oC)
ZS = ZL = 50 Ω; VS = 4.8 V; PD = 3 mW; VC = 3.5 V;
δ = 1 : 8; tp = 575 µs.
Fig.10 Load power as a function of mounting base
temperature (reduced supply voltage);
typical values.
Fig.11 Load power as a function of mounting base
temperature; typical values.
MGD362
MGD354
10
30
handbook, halfpage
handbook, halfpage
Gp
(dB)
Output AM
(%)
8
PL = 25 dBm
15 dBm
20
6
34.8 dBm
4
880 MHz
10
915 MHz
2
0
0
0
1
2
f (MHz)
0
3
10
20
30
PL (dBm)
40
ZS = ZL = 50 Ω; VS = 4.8 V; PD = 3 mW; f = 900 MHz; C1 = 0;
R1 = 100 Ω; Tmb = 25 °C; δ = 1 : 8; tp = 575 µs.
ZS = ZL = 50 Ω; VS = 4.8 V; PD = 3 mW; Tmb = 25 °C;
input amplitude modulation = 3%; δ = 1 : 8; tp = 575 µs.
Fig.12 Control loop power gain as a function of
frequency on the control pin; typical values.
Fig.13 Output amplitude modulation as a function
of load power; typical values.
1998 May 08
6
Philips Semiconductors
Product specification
UHF amplifier module
BGY206
handbook, full pagewidth
C5
C2
L1
C1
Z1
R1
RF input
Z2
C3
C4
VC
typ.
1.35A
MBK513
VS
RF output
Fig.14 Test circuit.
handbook, full pagewidth
1
90
2 3 4
50 Ω
input
50 Ω
output
47
VC
VS
Dimensions in mm.
Fig.15 Printed-circuit board layout.
1998 May 08
7
MBH435
Philips Semiconductors
Product specification
UHF amplifier module
BGY206
List of components (See Fig 14)
COMPONENT
DESCRIPTION
VALUE
DIMENSIONS
CATALOGUE NO.
C1, C2
multilayer ceramic chip capacitor
680 pF
2222 851 11681
C3
tantalum capacitor
2.2 µF; 35 V
−
C4
electrolytic capacitor
47 µF; 40 V
2222 030 37479
C5
multilayer ceramic chip capacitor
100 nF
L1
Grade 4S2 Ferroxcube bead
Z1, Z2
stripline; note 1
50 Ω
R1
metal film resistor
100 Ω; 0.6 W
2222 852 47104
4330 030 36300
width 2.33 mm
−
2322 156 11001
Note
1. The striplines are on a double copper-clad printed-circuit board with PTFE fibreglass dielectric (εr = 2.2);
thickness 1⁄32 inch.
1998 May 08
8
Philips Semiconductors
Product specification
UHF amplifier module
BGY206
SOLDERING
The indicated temperatures are those at the solder
interfaces.
MGM159
300
handbook, halfpage
Advised solder types are types with a liquidus less than or
equal to 210 °C.
T
(°C)
Solder dots or solder prints must be large enough to wet
the contact areas.
200
Soldering can be carried out using a conveyor oven, a hot
air oven, an infrared oven or a combination of these ovens.
A double reflow process is permitted.
100
Hand soldering must be avoided because the soldering
iron tip can exceed the maximum permitted temperature of
250 °C and damage the module.
The maximum allowed temperature is 250 °C for
5 seconds.
0
0
1
2
3
4
t (min)
5
The maximum ramp-up is 10 °C per second.
The maximum cool-down is 5 °C per second.
Fig.16 Recommended reflow temperature profile.
Cleaning
The following fluids may be used for cleaning:
• Alcohol
• Bio-Act (Terpene Hydrocarbon)
• Acetone.
Ultrasonic cleaning should not be used since this can
cause serious damage to the product.
1998 May 08
9
Philips Semiconductors
Product specification
UHF amplifier module
BGY206
17.7
handbook, full pagewidth
12.5
12
6
4
8.75
6.75
footprint metallization
1
solder area
2.9
occupied area
1.8
0.57
0.7
1.37
5.08
1.7
5.08
2.54
17.9
17.1
12.4
12.1
6.4
solder area
7.55
5.55
2.45
1.67
2.7
1.1
0.5
1.37
5.08
1.5
5.08
Dimensions in mm.
Fig.17 Footprint SOT388B.
1998 May 08
10
2.54
MGM150
12.5
Philips Semiconductors
Product specification
UHF amplifier module
BGY206
PACKAGE OUTLINE
Rectangular single-ended surface-mount package; metal cap; 4 in-line leads
SOT388B
U
A
y
U1
E
1
2
3
Q
4
L
b
Z
e
c
w M
e1
e
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
b
c
e
e1
E
L
Q
U
U1
w
y
Z
mm
2.2
1.8
0.56
0.46
0.30
0.20
5.08
2.54
12.2
11.8
0.7
0.3
3.4
3.0
17.3
16.9
6.0
5.6
0.25
0.15
2.3
1.9
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
EIAJ
ISSUE DATE
97-11-19
SOT388B
1998 May 08
EUROPEAN
PROJECTION
11
Philips Semiconductors
Product specification
UHF amplifier module
BGY206
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1998 May 08
12
Philips Semiconductors
Product specification
UHF amplifier module
BGY206
NOTES
1998 May 08
13
Philips Semiconductors
Product specification
UHF amplifier module
BGY206
NOTES
1998 May 08
14
Philips Semiconductors
Product specification
UHF amplifier module
BGY206
NOTES
1998 May 08
15
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© Philips Electronics N.V. 1998
SCA60
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Printed in The Netherlands
125108/00/04/pp16
Date of release: 1998 May 08
Document order number:
9397 750 03827