INTEGRATED CIRCUITS DATA SHEET TDA3833 BTSC-stereo/SAP/DBX decoder and DBX expander Product specification File under Integrated Circuits, IC02 September 1992 Philips Semiconductors Product specification BTSC-stereo/SAP/DBX decoder and DBX expander FEATURES • DBX decoder, MPX decoder and SAP decoder on chip TDA3833 QUICK REFERENCE DATA SYMBOL PARAMETER TYP. UNIT VP positive supply voltage (pin 32) 5 V IP supply current 42 mA Vi input signal, 100% modulated, mono (RMS value, pin 1) 100 mV • Stereo and SAP signal available simultaneously Vo AF output signal (RMS value, pins 7, 23 and 24) 550 mV S/N(W) signal-to-noise ratio, weighted 50 dB • Reliable stereo/SAP identification by means of the noise detector S/N signal-to-noise ratio 60 dB αCH stereo channel separation 26 dB αCR crosstalk attenuation 60 dB THD total harmonic distortion 0.2 % • Extensive switching possibilities for the AF outputs and the extra headphone output • Integrated filters • DAC control possible for most alignments • Few external components • Low power consumption (200 mW) • +5 V supply voltage GENERAL DESCRIPTION The TDA3833 is a sound processor for stereo/second audio program (SAP) baseband signals in accordance with the BTSC standard for television receivers and video tape recorders. September 1992 ORDERING INFORMATION PACKAGE EXTENDED TYPE NUMBER PINS PIN POSITION MATERIAL CODE TDA3833 32 SDIL plastic SOT232AG(1) TDA3833T 32 SO plastic SOT287AH(2) Note 1. SOT232-1; 1996 December 13. 2. SOT287-1; 1996 December 13. 2 Product specification TDA3833 (1) control possible by DAC (2) DBX encoded BTSC-stereo/SAP/DBX decoder and DBX expander September 1992 3 Fig.1 Block diagram, test and application circuit. Philips Semiconductors Philips Semiconductors Product specification BTSC-stereo/SAP/DBX decoder and DBX expander TDA3833 PINNING SYMBOL PIN DESCRIPTION Vi 1 composite input signal (MPX/SAP) ILV 2 input level control fref 3 adjustment of filter reference CSAP 4 SAP identity smoothing capacitor CND 5 SAP noise detector smoothing capacitor SAPI 6 SAP indicator output (sink) Vo HP 7 SAP/mono headphone output Vo SAP 8 output signal SAP/(L-R) without DBX SAPLV 9 SAP level control LRLV 10 (L-R) level control MODE 11 4-state mode control C1SPB 12 spectral band timing capacitor DBXLV 13 DBX spectral adjust C1WB 14 wideband timing capacitor DBXT 15 DBX timing adjust C2SPB 16 spectral RMS-detector smoothing capacitor C2WB 17 wideband RMS-detector smoothing capacitor C1DC 18 DC decoupling capacitor 1 for offset compensation C2DC 19 DC decoupling capacitor 2 for offset compensation EMPH1 20 time constant for variable emphasis DBXIN 21 DBX signal input EMPH2 22 time constant for variable emphasis VoAF1 23 AF output signal right/SAP or mono VoAF2 24 AF output signal left/SAP or mono GND 25 ground (0 V) Cref 26 smoothing capacitor for internal reference voltage VCO 27 VCO free running frequency adjustment LOOP 28 phase detector loop filter STERI 29 stereo indicator output (sink) PILOT 30 pilot cancel adjustment Cpil 31 pilot detector smoothing capacitor, VCO/4 output VP 32 +5 V supply voltage September 1992 4 Fig.2 Pin configuration. Philips Semiconductors Product specification BTSC-stereo/SAP/DBX decoder and DBX expander TDA3833 LIMITING VALUES In accordance with the Absolute Maximum System (IEC134) SYMBOL PARAMETER MIN. MAX. UNIT VP supply voltage (pin 32) 0 8 V V1 composite input voltage 0 VP V V11 MODE input voltage 0 8 V I7,23,24 output current (AF outputs) 0 5 mA I6,29 output current (indication outputs) 0 5 mA Ptot total power dissipation 0 500 mW Tstg storage temperature range −55 +150 °C Tamb operating ambient temperature range 0 +70 °C VESD electrostatic handling for all pins (note 1) − ±4000 V Note to the limiting values 1. Equivalent to discharging a 100 pF capacitor through an 1.5 kΩ series resistor. CHARACTERISTICS VP = 5 V; Tamb = +25 °C; for MPX: ∆f = 25 kHz for L+R (100% modulation); fmod = 1 kHz; and for SAP: ∆f = 10 kHz; fmod = 1 kHz, unless otherwise specified. Measurements taken in Fig. 1 including all adjustments. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT VP supply voltage range (pin 32) 4.75 5 5.35 V IP supply current − 42 − mA Vn DC input/output voltage at pins 1, 7, 8, 18, 19, 21, 23 and 24 − VP/2 − V mono/SAP 0 − VP/2−1 V SAP VP/2-0.4 − VP/2+0.4 V stereo VP/2+1 − VP V mono VP+1.4 − 8 V mono/SAP − − 15 µA SAP − − 15 µA stereo − − 5 µA − − 300 µA MODE select 4-state input (see Table 1) V11 I11 input voltage for input current for mono September 1992 V11 = 7.2 V 5 Philips Semiconductors Product specification BTSC-stereo/SAP/DBX decoder and DBX expander SYMBOL PARAMETER CONDITIONS TDA3833 MIN. TYP. MAX. UNIT Composite input (pin 1) Ri input resistance on pin 1 Vi input signal on pin 1 (RMS value) 14 20 26 kΩ 70 100 140 mV stereo on − − 16 mV stereo off 5 − − mV MPX − 2.5 − dB SAP on − − 37 mV SAP off 16 − − mV see note 1 L+R (all other signals in accordance with BTSC system specification) pilot threshold for MPX hysteresis of threshold Vi pilot threshold for SAP hysteresis of threshold SAP − 2 − dB Gv gain control range dependent on V2 ±5 ±7.5 − dB V2 control voltage range (pin 2) − 1 to 4 − V I2 input current (pin 2) V2 = VP/2 − − 5 µA Voltage controlled oscillator (VCO) (pin 27) fVCO nominal VCO frequency (4fH) see note 2 − 62.94 − kHz ∆f29 capture range nominal pilot − − 1 kHz TC temperature coefficient − − 50 10−6/K stereo present − − 0.5 V stereo not present VP−0.5 − VP V stereo present 3 − − mA output signal (RMS value, pin 7) see note 3 − 550 − mV output signal headroom mono Stereo indication output (pin 29) V29 I29 output voltage range output current active LOW SAP/mono output (pin 7) Vo − 9.5 − dB R7 output resistance − 100 200 Ω RL load resistance 10 − − kΩ CL load capacitance − − 500 pF THD total harmonic distortion SAP signal − 0.5 − % mono signal − 0.2 − % B frequency response 50 to 10000 Hz mono; external 75 µs de-emphasis −3 − − dB S/N(W) weighted signal-to-noise ratio (CCIR468-3) mono; external 75 µs de-emphasis − 50 − dB September 1992 6 Philips Semiconductors Product specification BTSC-stereo/SAP/DBX decoder and DBX expander SYMBOL PARAMETER CONDITIONS TDA3833 MIN. TYP. MAX. UNIT SAP indication output (pin 6) V6 I6 output voltage range output current active LOW SAP present − − 0.5 V SAP not present VP-0.5 − VP V SAP present 3 − − mA see note 3 − 550 − mV Audio outputs (pins 23 and 24) Vo output signal (RMS value, pins 23 and 24) output signal headroom − 9.5 − dB ∆VL,R output signal difference between L and R f = 250 to 6300 Hz − − 3 dB ∆Vo output signal difference after switching from L or R to SAP f = 250 to 6300 Hz − − 3 dB ∆V23,24 DC offset voltage after switching stereo/mono/SAP − − ±100 mV R23,24 output resistance − 200 300 Ω RL load resistance 10 − − kΩ CL load capacitance − − 500 pF THD total harmonic distortion L and R signal − 0.2 − % SAP signal − 0.5 − % f = 50 to 10000 Hz 12 kHz related to 1 kHz −3 − − dB − −3 − dB SAP frequency response f = 50 to 8000 Hz −3 − − dB S/N(W) weighted signal-to-noise ratio L + R signal; CCIR468-3 − 50 − dB S/N unweighted signal-to-noise ratio (RMS value) L + R signal; f = 20 to 20000 Hz − 60 − dB αCR crosstalk L or R into SAP 50 63 − dB B αCH L and R frequency response channel separation (according to DBX requirements) SAP into L or R 50 70 − dB f = 100 to 5000 Hz 10% 75 µs equivalent input modulation 20 26 − dB 1 to 100% 75 µs 15 20 − dB equivalent input modulation September 1992 7 Philips Semiconductors Product specification BTSC-stereo/SAP/DBX decoder and DBX expander SYMBOL PARAMETER CONDITIONS TDA3833 MIN. TYP. MAX. UNIT DBX section V9 SAP level control voltage range − 1 to 4 − V V10 (L - R) level control voltage range − 1 to 4 − V V13 spectral band level control voltage range − 1.8 to 3.2 − V − − 5 µA 343 381 419 dB/s − 22.5 − µA I9,10,13 input current S1 spectral RMS-detector release rate I12 timing current for nominal release rate of spectral RMS-detector VI = 0.5VP see note 4 current adjustment range − 11 to 45 S2 wideband RMS-detector release rate 112.5 125 137.5 dB/s I14 timing current for nominal release rate of wideband RMS-detector − 7.5 − µA current adjustment range − 4 to 15 − µA V15 timing adjustment − 1.5 to 3.8 − V 0.33l12; see note 4 µA Notes to the characteristics 1. Requirements for the MPX/SAP input signal to ensure correct system performance: a) Maximum variation of MPX/SAP signal under operating conditions: to be found (1 dB). b) 3 dB bandwidth ≥ 130 kHz (∆f = 25 kHz). c) THD (L + R, ∆f = 25 kHz, fmod = 1 kHz): 0.2%. d) S/N(W), weighted in accordance with CCIR468-3 (L + R, ∆f = 25 kHz for sound carrier, fmod = 1 kHz, 75 µs de-emphasis; with critical picture modulation): S/N(W) > 44 dB; with sync only: S/N(W) > 54 dB. e) Spectral spurious attenuation: 40 dB (mainly n × fH; L + R, ∆f = 25 kHz for sound carrier fmod = 1 kHz, 50 Hz to 100 kHz, no de-emphasis). f) Maximum white noise level (unweighted, 200 Hz to 100 kHz) to avoid malfunctioning of the identification circuits: 500 mV (RMS). 2. Adjustable on pin 27, measurement (fH) on pin 7 with a 2.7 kΩ resistor connected between VP and pin 31. 3. Can also be aligned to 600 mV (RMS), then identification threshold and AF output headroom will be decreased by 1.6 dB. 4. I12 and I14 can be measured via an ammeter connected to 4 V (3.5 to 4.1 V). September 1992 8 Philips Semiconductors Product specification BTSC-stereo/SAP/DBX decoder and DBX expander Table 1 TDA3833 MODE select; 4-state pin 11 V11 (VP = 5 V) MODE AF OUTPUTS (V) mono SAP/MONO OUTPUT SAP CARRIER PIN 23 PIN 24 PIN 7 8 on mono mono SAP without DBX stereo VP on right left SAP without DBX SAP VP/2 on SAP SAP mono mono/SAP 0 on SAP mono SAP without DBX mono 8 off mono mono mono stereo VP off right left mono SAP VP/2 off right left mono mono/SAP 0 off mute mono mono September 1992 9 Philips Semiconductors Product specification BTSC-stereo/SAP/DBX decoder and DBX expander TDA3833 PACKAGE OUTLINES SDIP32: plastic shrink dual in-line package; 32 leads (400 mil) SOT232-1 ME seating plane D A2 A A1 L c e Z (e 1) w M b1 MH b 17 32 pin 1 index E 1 16 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 min. A2 max. b b1 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.7 0.51 3.8 1.3 0.8 0.53 0.40 0.32 0.23 29.4 28.5 9.1 8.7 1.778 10.16 3.2 2.8 10.7 10.2 12.2 10.5 0.18 1.6 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 92-11-17 95-02-04 SOT232-1 September 1992 EUROPEAN PROJECTION 10 Philips Semiconductors Product specification BTSC-stereo/SAP/DBX decoder and DBX expander TDA3833 SO32: plastic small outline package; 32 leads; body width 7.5 mm SOT287-1 D E A X c y HE v M A Z 17 32 Q A2 A (A 3) A1 pin 1 index θ Lp L 16 1 0 detail X w M bp e 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 2.65 0.3 0.1 2.45 2.25 0.25 0.49 0.36 0.27 0.18 20.7 20.3 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.2 1.0 0.25 0.25 0.1 0.95 0.55 inches 0.10 0.012 0.096 0.004 0.086 0.01 0.02 0.01 0.011 0.007 0.81 0.80 0.30 0.29 0.050 0.42 0.39 0.055 0.043 0.016 0.047 0.039 0.01 0.01 0.004 0.037 0.022 θ 8o 0o Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 92-11-17 95-01-25 SOT287-1 September 1992 EUROPEAN PROJECTION 11 Philips Semiconductors Product specification BTSC-stereo/SAP/DBX decoder and DBX expander TDA3833 method. Typical reflow temperatures range from 215 to 250 °C. SOLDERING Introduction Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C. There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. WAVE SOLDERING Wave soldering techniques can be used for all SO packages if the following conditions are observed: This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). • A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. SDIP • The longitudinal axis of the package footprint must be parallel to the solder flow. • The package footprint must incorporate solder thieves at the downstream end. SOLDERING BY DIPPING OR BY WAVE The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. REPAIRING SOLDERED JOINTS REPAIRING SOLDERED JOINTS Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. SO REFLOW SOLDERING Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating September 1992 12 Philips Semiconductors Product specification BTSC-stereo/SAP/DBX decoder and DBX expander TDA3833 DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. September 1992 13