Document No. 001-98254 Rev. *B ECN #: 5085143 Cypress Semiconductor Product Qualification Report QTP # 145202 VERSION*B January 2016 CCG2 Device Family S8PR2-10R Technology, Fab 4 CMI CYPD2103** CYPD2104** CYPD2105** USB Type-C Controller Gen2 with Power Delivery CYPD2122** CYPD2134** FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Josephine Pineda (JYF) Reliability Engineer Reviewed By: Rene Rodgers (RT) Reliability Engineer MTS Approved By: Don Darling (DCDA) Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 18 Document No. 001-98254 Rev. *B ECN #: 5085143 PRODUCT QUALIFICATION HISTORY QTP Number Description of Qualification Purpose Date 083401 Qualify SONOS S8DI-5R Technology in Fab 4 using PSoC 8C20066BC Krypton Device Jan. 2009 145202 Qualify CCG2 Device (7C64100AC), S8PR2-10R Technology in Fab 4 May 2015 151909 153402 Qualify CCG2 Rev. *A Silicon Device (7C64100AC), S8PF-10R Technology in Fab 4 Qualify CCG2 Rev. *B Silicon Device (7C64100AC), S8PF-10R Technology in Fab 4 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 18 Oct. 2015 Oct. 2015 Document No. 001-98254 Rev. *B ECN #: 5085143 PRODUCT DESCRIPTION (for qualification) Qualification Purpose: To qualify CCG2 Device (7C64100AC), S8PR2-10R Technology in Fab 4 Marketing Part #: CYPD2103**/CYPD2104**/CYPD2105**/CYPD2122**/CYPD2134** Device Description: USB Type-C Controller Gen2 with Power Delivery Cypress Division: Cypress Semiconductor – Data Communication Division TECHNOLOGY/FAB PROCESS DESCRIPTION Number of Metal Layers: 5 Metal Composition: Metal 1: 100° Ti / 3200° Al 0.5%Cu / 300° TiW Metal 2: 100° Ti/3200° Al 0.5% Cu/350° TiW Metal 3: 150° Ti / 7200° Al 0.5%Cu / 350° TiW Metal 4: 150° Ti / 7200° Al 0.5%Cu / 350° TiW Metal 5: 300° Ti / 12000° Al 0.5%Cu / 300A TiW Passivation Type and Thickness: 1,000A NFUSOX /6,000A Nitride Generic Process Technology/Design Rule (-drawn): S8PIR-10R Gate Oxide Material/Thickness (MOS): SiO2 / 32A & SiO2 / 120A Name/Location of Die Fab (prime) Facility: Fab 4, CMI-Minnesota Die Fab Line ID/Wafer Process ID: S8PR2-10 PACKAGE AVAILABILITY PACKAGE ASSEMBLY FACILITY SITE WIRE MATERIAL QTP NUMBER 20-Ball WLCSP DT-Philippines - 145201 14-Lead DFN ASE-Taiwan (G) 0.8 mil CuPd 152007 ASE-Taiwan (G) 0.8 mil CuPd 153006 CML-RA 0.8 mil CuPd 153007 24-Lead QFN Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 18 Document No. 001-98254 Rev. *B ECN #: 5085143 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: Package Outline, Type, or Name: FN20B 20-Ball Wafer Level Chip Scale Package (WLCSP) (1.63x2.03x0.55mm) Die Backside Preparation Method: Backgrind Die Separation Method: Saw Solder Ball/Bump Material: SAC405 Bonding Method: Bump/ RDL Bond Diagram Designation: 001-95726 Thermal Resistance Theta JA °C/W: 66°C/W Package Cross Section Yes/No: N/A Assembly Process Flow: 001-69882 Name/Location of Assembly (prime) facility: DT-Philippines MSL Level 1 Reflow Profile 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: DT-Philippines Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 18 Document No. 001-98254 Rev. *B ECN #: 5085143 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: Package Outline, Type, or Name: Mold Compound Name/Manufacturer: LH14A 14-Lead Dual-Flat No Lead (DFN), 2.5 x 3.5 x 0.6mm EME-G700LA/Sumitomo Mold Compound Flammability Rating: UL-94 V-0 Oxygen Rating Index: >28% 54% Leadframe Designation FMP Lead Frame Material: Copper Lead Finish, Composition / Thickness: Pure Sn Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: Saw Die Attach Supplier: Furukawa Die Attach Material: NEX-130 Bond Diagram Designation: 001-97348 Wire Bond Method: Thermosonic Wire Material/Size: CuPd/ 0.8 mil Thermal Resistance Theta JA °C/W: 31°C/W Package Cross Section Yes/No: No Assembly Process Flow: 49-41999 Name/Location of Assembly (prime) facility: ASE-Taiwan (G) MSL Level 3 Reflow Profile 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: ASE-Taiwan (G) Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 18 Document No. 001-98254 Rev. *B ECN #: 5085143 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: LQ24A Package Outline, Type, or Name: Quad Flat No Lead (QFN), 4x4x0.6mm Mold Compound Name/Manufacturer: EME-G700LA/Sumitomo Mold Compound Flammability Rating: UL-94 V-0 Oxygen Rating Index: >28% 54% Lead Frame Designation: FMP Lead Frame Material: Copper Lead Finish, Composition / Thickness: Pure Sn Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: Saw Process Die Attach Supplier: Hitachi Die Attach Material: FH-900 Die Attach Film (DAF) Bond Diagram Designation 001-89835 Wire Bond Method: Thermosonic Wire Material/Size: 0.8 mil /CuPd Thermal Resistance Theta JA C/W: 18.36 C /W Package Cross Section Yes/No: Yes Assembly Process Flow: 001-89390 Name/Location of Assembly (prime) facility: ASE-Taiwan (G) MSL Level 3 Reflow Profile 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: ASE-Taiwan (G) Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 18 Document No. 001-98254 Rev. *B ECN #: 5085143 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: LQ24A Package Outline, Type, or Name: Quad Flat No Lead (QFN), 4x4x0.6mm Mold Compound Name/Manufacturer: GE7470L-A/Nitto Mold Compound Flammability Rating: V-0 UL94 Oxygen Rating Index: >28% 54% Lead Frame Designation: FMP Lead Frame Material: Copper Lead Finish, Composition / Thickness: NiPdAu Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: Saw Process Die Attach Supplier: Henkel Die Attach Material: QMI 519 Bond Diagram Designation 001-93281 Wire Bond Method: Thermosonic Wire Material/Size: 0.8 mil /CuPd Thermal Resistance Theta JA C/W: 18.36 C /W Package Cross Section Yes/No: Yes Assembly Process Flow: 11-21099 Name/Location of Assembly (prime) facility: CML-RA MSL Level 3 Reflow Profile 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML-RA Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 18 Document No. 001-98254 Rev. *B ECN #: 5085143 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test Test Condition (Temp/Bias) Electrostatic Discharge Charge Device Model (ESD-CDM) Electrostatic Discharge Human Body Model (ESD-HBM) Electrostatic Discharge Machine Model (ESD-MM) J-STD-020 Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260C Reflow) 200C, 4hrs MIL-STD-883, Method 883-2011 150°C, No Bias JESD22-A117 and JESD22-A103 125°C, 8.5V JESD78 500V/1,000V/1,250V JESD22-C101 1,100V/2,200V /3,300V JESD22, Method A114 200V, 220V, 275V, 330V JESD22-A115 Endurance Test MIL-STD-883, Method 883-1033/ JESD22-A117 Acoustic Microscopy Age Bond Strength Data Retention Dynamic Latch-up High Accelerated Saturation Test (HAST) High Temperature Operating Life Early Failure Rate High Temperature Operating Life Early Failure Rate, Regulator On High Temperature Operating Life Latent Failure Rate High Temperature Steady State life JEDEC STD 22-A110: 130°C, 85% RH, 5.25V Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260C Reflow) Dynamic Operating Condition, Vcc Max=2.1V/1.95V/2.268V, 150°C JESD22-A-108 Dynamic Operating Condition, Vcc Max=5V, 125°C/150°C Dynamic Operating Condition, Vcc Max=1.95V, 150°C JESD22-A-108 Dynamic Operating Condition, Vcc Max=2.1V,150°C JESD22-A-108 Static Operating Condition, Vcc Max=2.1V, 150°C JESD22-A-108 Result P/F P P P P P P P P P P P P P Internal Visual MIL-STD-883-2014 P Low Temperature Operating Life Dynamic Operating Condition, -30°C, 2.1V JESD22-A108 P Low Temperature Storage Life -40°C, No Bias P Pressure Cooker JESD22-A102:121°C /100%RH, 15 PSIG Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260C Reflow) P SEM Analysis MIL-STD-883, Method 2018 P Static Latch-up Temperature Cycle 85C/125C, +/-140mA 85C, +/- 200mA, +/-300mA JESD 78 MIL-STD-883, Method 1010, Condition C, -65°C to 150°C Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260C Reflow) Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 8 of 18 P P Document No. 001-98254 Rev. *B ECN #: 5085143 RELIABILITY FAILURE RATE SUMMARY Stress/Test Failure Rate Device Tested/ Device Hours # Fails Activation Energy Thermal AF3 High Temperature Operating Life Early Failure Rate 3,042 Devices 1 N/A N/A 329 PPM High Temperature Operating Life Long Term Failure Rate 585,000 DHRs 0 0.7 170 9 FIT 1 2 3 (1) (2) Assuming an ambient temperature of 55C and a junction temperature rise of 15C. Chi-squared 60% estimations used to calculate the failure rate. Thermal Acceleration Factor is calculated from the Arrhenius equation E 1 1 AF = exp A - k T 2 T1 where: EA =The Activation Energy of the defect mechanism. -5 K = Boltzmann’s constant = 8.62x10 eV/Kelvin. T1 is the junction temperature of the device under stress and T2 is the junction temperature of the device at use conditions. (1) (2) Early Failure Rate was computed from QTP# 145202 Long Term Failure Rate was computed from QTP# 083401 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 9 of 18 Document No. 001-98254 Rev. *B ECN #: 5085143 Reliability Test Data QTP #: 083401 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ACOUSTIC, MSL3 CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA COMP 15 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA COMP 15 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA COMP 15 0 STRESS: AGE BOND STRENGTH CY8C20566 (8C20566AC) 4827949 610844164 CML-R COMP 3 0 CY8C20466 (8C20466AC) 4804681 610822808 Malaysia-CA COMP 3 0 CY8C20666 (8C20666AC) 4836589 610852813 Malaysia-CA COMP 3 0 STRESS: DATA RETENTION, PLASTIC, 150C CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 500 77 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 1000 77 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 500 78 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 1000 78 0 CY8C20566 (8C20566AC) 4836589 610851914 CML-R 500 78 0 CY8C20566 (8C20566AC) 4836589 610851914 CML-R 1000 78 0 CY8C20566 (8C20566AC) 4810486 610830786 CML-R 168 77 0 CY8C20566 (8C20566AC) 4815537 610835437 CML-R 168 77 0 CY8C20566 (8C20566AC) 4827949 610844164 CML-R 168 79 0 CY8C20566 (8C20566AC) 4835945 610848270 CML-R 168 78 0 CY8C20566 (8C20566AC) 4836589 610851914 CML-R 168 76 0 STRESS: ENDURANCE STRESS: ESD-CHARGE DEVICE MODEL, (500V) CY8C20566 (8C20566AC) 4810486 610830371 CML-R 500 9 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 500 9 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 500 9 0 N/A N/A COMP 1 0 STRESS: SEM CROSS SECTION CY8C20066 (8C20066AC) 4810486 STRESS: STATIC LATCH-UP (85C, 8.25V, +/-200mA) CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA COMP 6 0 CY8C20666 (8C20666AC) 4836589 610852813 Malaysia-CA COMP 6 0 CY8C20666 (8C20666AC) 4837410 410.23.02 Promex COMP 6 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 10 of 18 Document No. 001-98254 Rev. *B ECN #: 5085143 Reliability Test Data QTP #: 083401 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114, (2,200V) CY8C20566 (8C20566AC) 4810486 610830371 CML-R 2200 8 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 2200 8 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 2200 8 0 STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114, (3,300V) CY8C20566 (8C20566AC) 4810486 610830371 CML-R 3300 3 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 3300 3 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 3300 3 0 STRESS: ESD-MACHINE MODEL, (200V) CY8C20236A (8C202662A) 4126494 611143319 KOREA-L 200 5 0 CY8C20236A (8C202662A) 4125077 611143627 PHIL-MB 200 5 0 STRESS: ESD-MACHINE MODEL, (220V) CY8C20566 (8C20566AC) 4810486 610830371 CML-R 220 6 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 220 6 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 220 6 0 STRESS: ESD-MACHINE MODEL, (275V) CY8C20566 (8C20566AC) 4810486 610830371 CML-R 275 3 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 275 3 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 275 3 0 STRESS: ESD-MACHINE MODEL, (330V) CY8C20566 (8C20566AC) 4810486 610830371 CML-R 330 3 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 330 3 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 330 3 0 STRESS: DYNAMIC LATCH-UP (125C, 8.5V) CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA COMP 5 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA COMP 5 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA COMP 5 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 11 of 18 Document No. 001-98254 Rev. *B ECN #: 5085143 Reliability Test Data QTP #: 083401 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (150, 2.1V, Vcc Max) CY8C20566 (8C20566AC) 4827949 610844164 CML-R 48 1002 0 CY8C20566 (8C20566AC) 4815537 610835437 CML-R 48 1008 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 48 1004 1 CY8C20466 (8C20466AC) 4836589 610851747 Malaysia-CA 48 1004 0 STRESS: Read NV Latch (1) HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE REGULATOR ON (150, 5V, Vcc Max) CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 48 45 0 CY8C20566 (8C20566AC) 4835945 610848270 CML-R 48 45 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE REGULATOR ON (125C, 5V, Vcc Max) CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA 96 45 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (150C, 2.1V, Vcc Max) CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 80 390 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 500 390 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 80 390 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 500 390 0 CY8C20466 (8C20466AC) 4836589 610851747 Malaysia-CA 80 390 0 CY8C20466 (8C20466AC) 4836589 610851747 Malaysia-CA 500 390 0 STRESS: HIGH TEMP STEADY STATE LIFE TEST (150C, 2.1V) CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA 80 77 0 CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA 168 77 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 80 77 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 168 77 0 CY8C20566 (8C20566AC) 4835945 610848270 CML-R 80 77 0 CY8C20566 (8C20566AC) 4835945 610848270 CML-R 168 77 0 STRESS: LOW TEMPERATURE DYNAMIC OPERATING LIFE, -30C, 2.1V CY8C20566 (8C20566AC) 4815537 610835437 CML-R 500 77 0 CY8C20566 (8C20566AC) 4835945 610848270 CML-R 500 77 0 (1) Destroyed during failure analysis Company Confidential A printed copy of this document is considered uncontrolled. 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Page 12 of 18 Document No. 001-98254 Rev. *B ECN #: 5085143 Reliability Test Data QTP #: 083401 Device Fab Lot # Assy Lot # Assy Lot Duration Samp Rej Failure Mechanism STRESS: HI-ACCEL SATURATION TEST (130C, 85%RH, 5.25V), PRE COND 192 HR 30C/60%RH (MSL3) CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA 128 77 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 128 77 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 256 77 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 128 77 0 STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR 30C/60%RH (MSL3) CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA 168 77 0 CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA 333 77 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 168 77 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 288 77 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 168 77 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 288 77 0 STRESS: TC COND. C -65C TO 150C, PRE COND 192 HRS 30C/60%RH (MSL3) CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA 500 77 0 CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA 1000 77 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 500 77 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 1000 77 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 500 77 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 1000 77 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 13 of 18 Document No. 001-98254 Rev. *B ECN #: 5085143 Reliability Test Data ER114031 Device Fab Lot # Assy Lot # Assy Lot Duration Samp Rej Failure Mechanism STRESS: LOW TEMPERATURE STORAGE, -40C, No Bias CY8C20236A (8C202662A) 4137730 611155459 L-KOREA 1000 100 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 14 of 18 Document No. 001-98254 Rev. *B ECN #: 5085143 Reliability Test Data QTP #: 145202 Device STRESS: Fab Lot # Assy Lot # Assy Loc Duration Samp Rej ESD-CHARGE DEVICE MODEL CYPD2103 (7F64100A) 4452163 611504790 DT-PHIL 500 9 0 CYPD2103 (7F64100A) 4452163 611504790 DT-PHIL 1000 3 0 CYPD2103 (7F64100A) 4452163 611504790 DT-PHIL 1250 3 0 STRESS: Failure Mechanism ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114 CYPD2103 (7F64100A) 4452163 611504790 DT-PHIL 1100 3 0 CYPD2103 (7F64100A) 4452163 611504790 DT-PHIL 2200 8 0 CYPD2103 (7F64100A) 4452163 611504790 DT-PHIL 3300 3 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (150, 1.95V, Vcc Max) CYPD2103 (7CP64100A) 4452163 611505270 CML-RA 48 1505 1 Scan Non-Visual Failure STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (150, 2.268V, Vcc Max) CYPD2103 (7CP64100A) STRESS: 4452194 611510023 CML-RA 48 1537 0 HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE REGULATOR ON (150, 1.95V, Vcc Max) CYPD2103 (7CP64100A) 4452163 611505270 CML-RA 48 50 0 DT-PHIL COMP 6 0 DT-PHIL COMP 3 0 DT-PHIL COMP 3 0 DT-PHIL COMP 3 0 STRESS: STATIC LATCH-UP (85C, +/-140mA) CYPD2103 (7F64100A) 4452163 611504790 STRESS: STATIC LATCH-UP (85C, +/-200mA) CYPD2103 (7F64100A) 4452163 611504790 STRESS: STATIC LATCH-UP (85C, +/-300mA) CYPD2103 (7F64100A) 4452163 611504790 STRESS: STATIC LATCH-UP (125C, +/-140mA) CYPD2103 (7F64100A) 4452163 611504790 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 15 of 18 Document No. 001-98254 Rev. *B ECN #: 5085143 Reliability Test Data QTP #: 151909 Device Fab Lot # YIELD: Duration Samp Rej 4512819 611519415/16/17/18/19 DT-PHILS COMP EQUIVALENT 4452194 N/A N/A COMP EQUIVALENT 4512819 N/A N/A COMP EQUIVALENT Failure Mechanism E-TEST 7C64100AC YIELD: Assy Loc BACKEND 7F64100AC YIELD: Assy Lot # SORT 7C64100AC Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 16 of 18 Document No. 001-98254 Rev. *B ECN #: 5085143 Reliability Test Data QTP #: 153402 Device Fab Lot # Assy Lot # Assy Loc Duration Samp 7CP64101BC 4525553 611533168 CML-RA COMP EQUIVALENT 7F64101BC 4525553 611533490 DT-PHILS COMP EQUIVALENT 4525553 N/A N/A COMP EQUIVALENT 4523565/4525220/ N/A N/A COMP EQUIVALENT YIELD: YIELD: Failure Mechanism BACKEND E-TEST 7C64100AC YIELD: Rej SORT 7C64100AC 4192152/4525553 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 17 of 18 Document No. 001-98254 Rev. *B ECN #: 5085143 Document History Page Document Title: Document Number: Rev. ECN No. QTP#145202: CCG2 DEVICE FAMILY,S8PR2-10R TECHNOLOGY, FAB 4 (CMI) 001-98254 Orig. of Change ** 4810887 JYF JYF *A 4869566 DCON *B 5085143 JYF Description of Change Initial spec release. Added 24L QFN assembled at CML-RA and ASE-Taiwan as package option for CCG2 device (QTP# 153006/QTP#153007). Removed distribution and posting. Added CCG2 Rev.*A (QTP# 151909) and Rev.*B (QTP# 153402) qualification data. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 18 of 18