Document No.001-89580 Rev. *A ECN # 4526481 Cypress Semiconductor Automotive Package Qualification Report QTP# 072108 VERSION*A October 2014 Automotive 20/28L SSOP MSL3, 260C (Amkor-M) FOR ANY QUESTIONS ON THIS REPORT, PLEAE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Honesto Sintos Reliability Engineer Reviewed By: Rene Rodgers Reliability Manager Approved By: Richard Oshiro Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 8 Document No.001-89580 Rev. *A ECN # 4526481 PACKAGE QUALIFICATION HISTORY Qual Report 072108 Description of Qualification Purpose Qualify Automotive 20/28 SSOP with EME-G600 Mold Compound, Ablestik 8290 Die Attach Epoxy, NiPdAu Leadfinish for MSL3/260C at Amkor-Philippines (M) Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 8 Date Comp Dec 07 Document No.001-89580 Rev. *A ECN # 4526481 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: Package Outline, Type, or Name: Mold Compound Name/Manufacturer: Mold Compound Flammability Rating: SP28 28-Lead SSOP Sumitomo EME-G600 V-O per UL94 Oxygen Rating Index: N/A Lead Frame Material: Copper Lead Finish, Composition / Thickness: Ni-Pd-Au Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: Wafer Saw Die Attach Supplier: Ablestik Die Attach Material: 8290 Die Attach Method: Epoxy Bond Diagram Designation: 10-05678 Wire Bond Method: Thermosonic Wire Material/Size: Au, 1.0mil Thermal Resistance Theta JA °C/W: 90°C/W Package Cross Section Yes/No: N/A Assembly Process Flow: 001−09888 Name/Location of Assembly (prime) facility: Amkor Philippines (M) MSL Level 3 Reflow Profile 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML-R Company Confidential A printed copy of this document is considered uncontrolled. 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Page 3 of 8 Document No.001-89580 Rev. *A ECN # 4526481 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENT Stress/Test High Temperature Operating Life Early Failure Rate High Accelerated Saturation Test (HAST) Test Condition (Temp/Bias) Result P/F AEC-Q100-008 and JESD22-A108 P Dynamic Operating Condition, Vcc Max = 5.5V, 125°C JESD22-A110, 130C, 5.25V, 85%RH Precondition: JESD22-A113 Moisture Sensitivity MSL 3 P 192 Hrs, 30C/60%RH+3IR-Reflow, 260°C+0, -5°C Temperature Cycle JESD22-A104, -65°C to 150°C Precondition: JESD22-A113 Moisture Sensitivity MSL 3 192 Hrs, 30C/60%RH+3IR-Reflow, 260°C+0, -5°C JESD22-A102, 121C, 100%RH, 15 Psig Precondition: JESD22-A113 Moisture Sensitivity MSL 3 Pressure Cooker P P 192 Hrs, 30C/60%RH+3IR-Reflow, 260°C+0, -5°C High Temperature Storage JESD22-A103, 150 ± 5°C no bias P Electrostatic Discharge Human Body Model (ESD-HBM) AEC-Q100-002 500V/1000V/1500V/2000V P Electrostatic Discharge Charge Device Model (ESD-CDM) AEC-Q100-002 200V/500V P Acoustic Microscopy JEDEC JSTD-020 P Wire Ball Shear AEC-Q100-001 P Wire Bond Pull Mil-Std 883, Method 2011 P Electrical Distribution AEC-Q100-009 P External Visual MIL-PRF-38535, MILSTD-883, METHOD 2009 P Physical Dimensions JESD22-B100/108 P Solderability JESD22-B102 P Static Latchup AEC-Q100-004, 125C, 5.79V, ± 100mA P Constructional Analysis Criteria: Meet external and internal characteristics of Cypress package P Dye Penetrant Test Test to determine the existence and extent of cracks, P Criteria: No Package Crack Company Confidential A printed copy of this document is considered uncontrolled. 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Page 4 of 8 Document No.001-89580 Rev. *A ECN # 4526481 Reliability Test Data QTP #:072108 Device Fab Lot # Assy Lot # Assy Loc CY8C29466 (8C29466A) 4547386 610608768 PHIL-M COMP 15 0 CY8C29466 (8C29466A) 4548960 610608766 PHIL-M COMP 15 0 CY8C29466 (8C29466A) 4549207 610610435 PHIL-M COMP 15 0 4547386 610608768 PHIL-M COMP 60 0 4547386 610608768 PHIL-M COMP 60 0 610608768 PHIL-M COMP 5 0 STRESS: STRESS: Duration Samp Rej Failure Mechanism ACOUSTIC, MSL3 BALL SHEAR CY8C29466 (8C29466A) STRESS: BOND PULL CY8C29466 (8C29466A) STRESS: CONSTRUCTIONAL ANALYSIS CY8C29466 (8C29466A) 4547386 STRESS: DYE PENETRANT TEST CY8C29466 (8C29466A) 4547386 610608768 PHIL-M COMP 15 0 CY8C29466 (8C29466A) 4548960 610608766 PHIL-M COMP 15 0 CY8C29466 (8C29466A) 4549207 610610435 PHIL-M COMP 15 0 CY8C29466 (8C29466A) 4547386 610608768 PHIL-M COMP 1396 0 CY8C29466 (8C29466A) 4548960 610608766 PHIL-M COMP 1299 0 CY8C29466 (8C29466A) 4549207 610610435 PHIL-M COMP 1314 0 STRESS: EXTERNAL VISUAL STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE, 125C, 5.5V, Vcc Max CY8C29466 (8C29466A) 4547386 610608768 PHIL-M 48 815 0 CY8C29466 (8C29466A) 4548960 610608766 PHIL-M 48 815 0 CY8C29466 (8C29466A) 4549207 610610435 PHIL-M 48 815 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE, 125C, 5.5V, Vcc Max CY8C29466 (8C29466A) 4547386 610608768 PHIL-M 1000 84 0 CY8C29466 (8C29466A) 4548960 610608766 PHIL-M 1000 84 0 CY8C29466 (8C29466A) 4549207 610610435 PHIL-M 1000 84 0 PHIL-M COMP 3 0 PHIL-M COMP 3 0 COMP 3 0 STRESS: ESD-CHARGE DEVICE MODEL, 200V CY8C29466 (8C29466A) STRESS: 610608768 ESD-CHARGE DEVICE MODEL, 500V CY8C29466 (8C29466A) STRESS: 4547386 4547386 610608768 ESD-HUMAN BODY CIRCUIT PER JESD22-A114-B, 500V CY8C29466 (8C29466A) 4547386 610608768 PHIL-M Company Confidential A printed copy of this document is considered uncontrolled. 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Page 5 of 8 Document No.001-89580 Rev. *A ECN # 4526481 Reliability Test Data QTP #:072108 Device STRESS: Fab Lot # Samp Rej Failure Mechanism 4547386 610608768 PHIL-M COMP 3 0 4547386 610608768 PHIL-M COMP 3 0 COMP 3 0 ESD-HUMAN BODY CIRCUIT PER JESD22-A114-B, 2,000V CY8C29466 (8C29466A) STRESS: Duration ESD-HUMAN BODY CIRCUIT PER JESD22-A114-B, 1,500V CY8C29466 (8C29466A) STRESS: Assy Loc ESD-HUMAN BODY CIRCUIT PER JESD22-A114-B, 1,000V CY8C29466 (8C29466A) STRESS: Assy Lot # 4547386 610608768 PHIL-M STATIC LATCH-UP TESTING, 125C, 5.79V, +/100mA CY8C29466 (8C29466A) 4547386 610608768 PHIL-M COMP 6 0 STRESS: ELECTRICAL DISTRIBUTION CY8C29466 (8C29466A) 4547386 610608768 PHIL-M COMP 30 0 CY8C29466 (8C29466A) 4548960 610608766 PHIL-M COMP 30 0 CY8C29466 (8C29466A) 4549207 610610435 PHIL-M COMP 30 0 STRESS: PHYSICAL DIMENSION CY8C29466 (8C29466A) 4547386 610608768 PHIL-M COMP 10 0 CY8C29466 (8C29466A) 4548960 610608766 PHIL-M COMP 10 0 CY8C29466 (8C29466A) 4549207 610610435 PHIL-M COMP 10 0 1000 80 0 STRESS: HIGH TEMPERATURE STORAGE, PLASTIC, 150C CY8C29466 (8C29466A) 4547386 610608768 PHIL-M STRESS: PRESSURE COOKER TEST, 121C, 100%RH, 15 Psig, PRE COND 192 HR 30C/60%RH, MSL3 CY8C29466 (8C29466A) 4547386 610608768 PHIL-M 96 80 0 CY8C29466 (8C29466A) 4547386 610608768 PHIL-M 168 80 0 CY8C29466 (8C29466A) 4548960 610608766 PHIL-M 96 79 0 CY8C29466 (8C29466A) 4548960 610608766 PHIL-M 168 79 0 CY8C29466 (8C29466A) 4549207 610610435 PHIL-M 96 76 0 CY8C29466 (8C29466A) 4549207 610610435 PHIL-M 168 76 0 STRESS: HI-ACCEL SATURATION TEST, 130C, 85%RH, 5.25V, PRE COND 192 HR 30C/60%RH, MSL3 CY8C29466 (8C29466A) 4547386 610608768 PHIL-M 128 80 0 CY8C29466 (8C29466A) 4548960 610608766 PHIL-M 96 78 0 CY8C29466 (8C29466A) 4548960 610608766 PHIL-M 128 78 0 CY8C29466 (8C29466A) 4549207 610610435 PHIL-M 96 78 0 CY8C29466 (8C29466A) 4549207 610610435 PHIL-M 128 78 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 8 Document No.001-89580 Rev. *A ECN # 4526481 Reliability Test Data QTP #:072108 Device STRESS: Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism TC COND. C -65C TO 150C, PRE COND 192 HRS 30C/60%RH, MSL3 CY8C29466 (8C29466A) 4547386 610608768 PHIL-M 500 80 0 CY8C29466 (8C29466A) 4547386 610608768 PHIL-M 1000 75 0 CY8C29466 (8C29466A) 4548960 610608766 PHIL-M 500 80 0 CY8C29466 (8C29466A) 4548960 610608766 PHIL-M 1000 79 0 CY8C29466 (8C29466A) 4549207 610610435 PHIL-M 1000 80 0 CY8C29466 (8C29466A) 4547386 610608768 PHIL-M COMP 15 0 CY8C29466 (8C29466A) 4548960 610608766 PHIL-M COMP 15 0 CY8C29466 (8C29466A) 4549207 610610435 PHIL-M COMP 15 0 STRESS: SOLDERABILITY Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 8 Document No.001-89580 Rev. *A ECN # 4526481 Document History Page Document Title: QTP#072108: Automotive 20/28L SSOP MSL3, 260C (Amkor-M) Document Number: 001-89580 Rev. ECN Orig. of No. Change ** 4149124 HSTO *A 4526481 HSTO Description of Change Initial Spec Release. Initiate report as per memo HGA-341. Align qualification report based on the new template in the front page Distribution: WEB Posting: None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 8 of 8