INTEGRATED CIRCUITS DATA SHEET TDA5330T VHF, UHF and Hyperband mixer/oscillator for TV and VCR 3-band tuners Product specification File under Integrated Circuits, IC02 January 1988 Philips Semiconductors Product specification VHF, UHF and Hyperband mixer/oscillator for TV and VCR 3-band tuners TDA5330T GENERAL DESCRIPTION The TDA5330T is a monolithic integrated circuit that performs the band A, band B and band C mixer/oscillator functions in TV and VCR tuners. This device gives the designer the capability to design an economical and physically small 3-band tuner which will be capable of meeting the most stringent requirements e.g. FTZ or FCC. The tuner development time can be drastically reduced by using this device. Features • Balanced mixer with a common emitter input for band A • Amplitude-controlled oscillator for band A • Balanced mixer with common base input for band B and C • Balanced oscillator for band B and C • Local oscillator buffer output for external prescaler • SAW filter preamplifier with an output impedance of 100 Ω • Bandgap voltage stabilizer for oscillator stability • Electronic bandswitch QUICK REFERENCE DATA PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT Supply voltage V19−2, 26 − 12 − V Band A frequency range fA 48 − 180 MHz Band B frequency range fB 160 − 470 MHz Band C frequency range fC 430 − 860 MHz F 7 − 11 dB Band A input voltage 1% cross-modulation V24−26 − 100 − dBµV Band B and C input power 1% cross-modulation PI − −21 − dBm Band A voltage gain Gv − 24 − dB Band B voltage gain Gv − 37 − dB Band C voltage gain Gv − 36 − dB Conversion noise PACKAGE OUTLINE 28-lead mini-pack , plastic (SO20; SOT163A); SOT 163-1; 1996 November 28. January 1988 2 Philips Semiconductors Product specification TDA5330T Fig.1 Block diagram. VHF, UHF and Hyperband mixer/oscillator for TV and VCR 3-band tuners January 1988 3 Philips Semiconductors Product specification VHF, UHF and Hyperband mixer/oscillator for TV and VCR 3-band tuners TDA5330T PINNING Fig.2 Pinning diagram. 1 A OSC band A oscillator input 2 GND ground (0 V) 3 A OSC band A oscillator output 4 B OSC band B oscillator input 5 B OSC band B oscillator output 6 B OSC band B oscillator output 7 B OSC band B oscillator input 8 C OSC band C oscillator input 9 C OSC band C oscillator output 10 C OSC band C oscillator output 11 C OSC band C oscillator input 12 BS electronic bandswitch 13 IF OUT IF amplifier output 14 IF OUT IF amplifier output 15 IF IN IF amplifier input 16 IF IN IF amplifier input 17 MIX OUT mixer output 18 MIX OUT mixer output 19 VP positive supply voltage 20 C IN band C input 21 C IN band C input 22 B IN band B input 23 B IN band B input 24 A IN band A input 25 A IN band A input 26 RF GND ground for RF inputs 27 LO OUT local oscillator amplifier output 28 LO OUT local oscillator amplifier output RATINGS Limiting values in accordance with the Absolute Maximum System (IEC 134) PARAMETER CONDITIONS SYMBOL MIN. MAX. UNIT Supply voltage VP = V19−2, 26 −0.3 14 V Switching voltage V12 0 14 V Output current of each pin to ground IO − −10 mA Maximum short-circuit time (all pins) tSC − 10 s Storage temperature range Tstg −55 +150 °C Operating ambient temperature range Tamb −25 +80 °C THERMAL RESISTANCE From junction to ambient in free air January 1988 Rth j-a 4 typ. 75 K/W Philips Semiconductors Product specification VHF, UHF and Hyperband mixer/oscillator for TV and VCR 3-band tuners TDA5330T CHARACTERISTICS VP = 12 V; Tamb = 25 °C; unless otherwise specified. PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT Supply voltage V19−2, 26 10 − 13.2 V Supply current I19 − 42 55 mA band A V12 0 − 1.1 V band B V12 1.6 − 2.4 V band C V12 3.0 − 5.0 V I12 − − 50 µA fA 48 − 180 MHz 50 MHz NF − 7.5 9 dB 180 MHz NF − 9 10 dB 50 MHz G24−26 − 0.5 − mS 180 MHz G24−26 − 1.1 − mS Switching voltage; Switching current; band C Band A Mixer (including IF amplifier) measured using circuit shown in Fig.9 Frequency range Noise figure note 1; Optimum source conductance Input admittance see Fig.9 Input capacitance 50 - 180 MHz C24−26 − 2 − pF Input voltage 1% cross-modulation; in channel V24−26 97 100 − dBµV Input voltage 10 kHz pulling; in channel V24−26 100 108 − dBµV Voltage gain 20 log (V13−14/V24) Gv 22.5 25.0 27.5 dB Sc24−17, 18 − 3.5 − mS − 0.1 − mS − 2 − pF Band A mixer Conversion transadmittance Sc = I17/V24 mixer = −I18/V24 Mixer output admittance pins 15 and 16 Mixer output capacitance January 1988 C17−18 5 Philips Semiconductors Product specification VHF, UHF and Hyperband mixer/oscillator for TV and VCR 3-band tuners PARAMETER CONDITIONS TDA5330T SYMBOL MIN. TYP. MAX. UNIT Band A oscillator fA 80 − 216 MHz Frequency shift ∆VP = 10% ∆f − − 200 kHz Frequency drift ∆T = 25 °C ∆f − − 400 kHz Frequency drift 5 s to 15 min after switching on ∆f − 200 kHz fB 160 − 470 MHz 200 MHz NF − 8 10 dB 470 MHz NF − 8 10 dB 200 MHz PAI −24 −21 − dBm 470 MHz PAI −24 −21 − dBm − −11 − dBm − −11 − dBm Frequency range Band B mixer (including IF) − measured using circuit shown in Fig.9 measurements using hybrid; note 2 Frequency range Noise figure pins 22 and 23; Input admittance see Fig.5 Available input power 1% cross-modulation; in channel; pins 22 and 23; 10 kHz pulling pins 22 and 23; in channel; N+5 − 1 MHz pulling note 3; 470 MHz 430 MHz Voltage gain note 4; 200 MHz Gv 33 36 39 dB 470 MHz Gv 33 36 39 dB fB 200 − 500 MHz Band B oscillator Frequency range Frequency shift ∆VP = 10% ∆f − − 400 kHz Frequency drift ∆T = 25 °C ∆f − − 500 kHz Frequency drift 5 s to 15 min after switching on ∆f − − 200 kHz January 1988 6 Philips Semiconductors Product specification VHF, UHF and Hyperband mixer/oscillator for TV and VCR 3-band tuners PARAMETER Band C mixer (including IF) CONDITIONS TDA5330T SYMBOL MIN. TYP. MAX. UNIT measured using circuit shown in Fig.9; measurements using hybrid; note 2 fC 430 − 860 MHz 430 MHz NF − 9 11 dB 860 MHz NF − 9 11 dB 430 MHz PAI −25 −21 − dBm 860 MHz PAI −25 −21 − dBm − −20 − dBm −42 −35 − dBm Frequency range Noise figure pins 20 and 21; Input admittance see Fig.6 Available input power 1% cross-modulation in channel; pins 20 and 21; 10 kHz pulling pins 20 and 21; in channel; 860 MHz N+5 − 1 MHz pulling note 3; 820 MHz Voltage gain note 4; 430 MHz Gv 33 36 39 dB 860 MHz Gv 33 36 39 dB fC 470 − 900 MHz Band C oscillator Frequency range Frequency shift ∆Vb = 10% ∆f − − 400 kHz Frequency drift ∆T = 25 °C ∆f − − 800 kHz Frequency drift 5 s to 15 min after switching on ∆f − − 200 kHz IF Amplifier mod. phase note 5; differentially measured at 36 MHz; see Fig.7 Input reflection coefficient S11 − −0,5 −2.0 − dB/deg S12 − −41 −7 − dB/deg S21 − 12 160 − dB/deg S22 − −9 10 − dB/deg Reverse transmission coefficient Forward transmission coefficient Output reflection coefficient January 1988 see Fig.8 7 Philips Semiconductors Product specification VHF, UHF and Hyperband mixer/oscillator for TV and VCR 3-band tuners PARAMETER CONDITIONS TDA5330T SYMBOL MIN. TYP. MAX. UNIT LO output Output voltage into 50 Ω resistor V27−28 14 35 100 mV note 6 SRF − − −10 dB measured at 50 Ω SHD − − −10 dB Spurious signal on LO output with respect to LO output signal LO signal harmonics with respect to LO signal Notes 1. Measured with an input circuit for optimum noise. (see Fig.3). 2. The values have been corrected for hybrid and cable losses. The symmetrical output impedance of the circuit is 100 Ω. 3. The input level of a N+5 − 1 MHz signal (just visible). 4. The gain is defined as the transducer gain (measured in Fig.9) plus the voltage transformation ratio of L6 to L7 (6:1, 16 dB). 5. All S parameters are referred to a 50 Ω system. 6. Measured with 50 Ω output impedance on pins 26 and 27 and a RF input signal level of: RF level = 1 V at f < 180 MHz RF power = 0.5 dBm at 100 MHz < f < 225 MHz RF power = −10 dBm at 225 MHz < f < 860 MHz Fig.3 Input circuit for optimum noise. Table 1 Component values COMPONENT F = 50 MHz F = 180 MHz L 13 t, ∅ 5.5 mm, wire 0.7 mm (note 1) L2 rigid cable, 2.9 cm (note 1) L3 rigid cable, 4 cm (note 1) C 9.6 pF (note 1) Note 1. Value to be fixed. January 1988 8 Philips Semiconductors Product specification VHF, UHF and Hyperband mixer/oscillator for TV and VCR 3-band tuners Table 2 TDA5330T Electrical parameters of the circuit (for appropriate impedance and selectivity) PARAMETER F = 50 MHz F = 180 MHz UNIT Insertion loss 0.3 (note 1) dB Bandwidth 8 (note 1) MHz Image suppression 15 (note 1) dB Output impedance (source for IC) 2 (note 1) kΩ Note 1. Value to be fixed. Fig.4 S11 of the band A mixer input (40 to 220 MHz). January 1988 9 Philips Semiconductors Product specification VHF, UHF and Hyperband mixer/oscillator for TV and VCR 3-band tuners Fig.5 S11 of the band B mixer input (150 to 500 MHz). Fig.6 S11 of the band C mixer input (450 to 900 MHz). January 1988 10 TDA5330T Philips Semiconductors Product specification VHF, UHF and Hyperband mixer/oscillator for TV and VCR 3-band tuners Fig.7 S11 of the LO output (50 to 900 MHz). Fig.8 S11, S12 and S22 of the IF amplifier (30 to 60 MHz). January 1988 11 TDA5330T Philips Semiconductors Product specification TDA5330T Fig.9 Test circuit diagram. VHF, UHF and Hyperband mixer/oscillator for TV and VCR 3-band tuners January 1988 12 Philips Semiconductors Product specification VHF, UHF and Hyperband mixer/oscillator for TV and VCR 3-band tuners TDA5330T Component values of the test circuit resistors R1 = 47 kΩ R2 = 18 Ω R3 = 22 kΩ R4 = 22 kΩ R5 = 22 Ω (SMD) R6 = 22 kΩ R7 = 1 kΩ R8 = 2.2 kΩ R9 = 22 kΩ R10 = 15 kΩ R11 = 22 kΩ C1 = 1 nF C2 = 1 nF C3 = 1 nF C4 = 1 nF C5 = 1 nF C6 = 1 nF C7 = 1 nF C8 = 1 nF C9 = 1 nF C10 = 1 nF C11 = 1 nF C12 = 15 pF (N750) C13 = 15 pF (N750) C14 = 1 nF C15 = 1 nF C16 = 1 nF C17 = 0.68 pF (SMD) C18 = 1 pF (SMD) C19 = 100 pF (SMD) C20 = 5.6 pF (SMD) C21 = 1 pF C22 = 0.68 pF (SMD) C23 = 150 pF (N750) C24 = 1.8 pF (N750) C25 = 3.3 pF (SMD) C26 = 3.3 pF (SMD) C27 = 1.8 pF (SMD) C28 = 1 nF C29 = 1 pF (NPO) C30 = 1 pF (NPO) C31 = 82 pF (N750) C32 = 1 nF C33 = 1 µF (40 V) Cm = 18 pF (N750) capacitors diodes and IC D1 = BB911 D2 = BB909B D3 = BB405B L1 = 6.5 t (φ3) L2 = 1.5 t (φ3) L3 = 1.5 t (φ3) L4 = 1.5 t (φ3) L5 = 2 × 6 t (note 1) L6 = 12 t (note 1) L7 = 2 t (mounted on L6) L8 = 5 µH (choke coil) IC = TDA5330T coils wire size for L1 to L4 = 0.4 and for L5 to L7 = 0.1 mm. Note 1. Coil type: TOKO 7 kN; material: 113 kN, screw core (03-0093), pot core (04-0026). January 1988 13 Philips Semiconductors Product specification VHF, UHF and Hyperband mixer/oscillator for TV and VCR 3-band tuners TDA5330T PACKAGE OUTLINE SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 D E A X c HE y v M A Z 11 20 Q A2 A (A 3) A1 pin 1 index θ Lp L 1 10 e bp detail X w M 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.30 0.10 2.45 2.25 0.25 0.49 0.36 0.32 0.23 13.0 12.6 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.9 0.4 inches 0.10 0.012 0.096 0.004 0.089 0.01 0.019 0.013 0.014 0.009 0.51 0.49 0.30 0.29 0.050 0.419 0.043 0.055 0.394 0.016 0.043 0.039 0.01 0.01 0.004 0.035 0.016 Z (1) θ 8o 0o Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT163-1 075E04 MS-013AC January 1988 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-01-24 97-05-22 14 Philips Semiconductors Product specification VHF, UHF and Hyperband mixer/oscillator for TV and VCR 3-band tuners TDA5330T SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). Reflow soldering Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C. Wave soldering Wave soldering techniques can be used for all SO packages if the following conditions are observed: • A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. • The longitudinal axis of the package footprint must be parallel to the solder flow. • The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Repairing soldered joints Fix the component by first soldering two diagonally- opposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. January 1988 15 Philips Semiconductors Product specification VHF, UHF and Hyperband mixer/oscillator for TV and VCR 3-band tuners TDA5330T DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. January 1988 16