Document No. 002-11995 Rev. ** ECN #: 5212970 Cypress Semiconductor Package Qualification Report QTP# 153304 VERSION ** April 2016 124 vFBGA Package (9x9x1.0mm) SAC-105, CuPd MSL3, 260C Reflow ASEK-Taiwan (G) FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Honesto Sintos Reliability Engineer Reviewed By: Lorena Zapanta Reliability Manager Approved By: Don Darling Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 8 Document No. 002-11995 Rev. ** ECN #: 5212970 PACKAGE/PRODUCT QUALIFICATION HISTORY QTP Number Description of Qualification Purpose Date 153304 Qualification of 124vFBGA (9x9x1.0mm) package at ASEKTaiwan (G) using 0.8mil CuPd wire with KE-G1250 mold compound, Ablestik 2025D die attach material, BT resin substrate and SAC-105 ball finish at MSL3. Mar 2016 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 8 Document No. 002-11995 Rev. ** ECN #: 5212970 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: Package Outline, Type, or Name: Mold Compound Name/Manufacturer: BZ0AA Mold Compound Flammability Rating: 124-vFBGA FBGA (9x9x1.0mm) KE-G1250 / Kyocera UL 94 V=0 pass Mold Compound Alpha Emission Rate: N/A (not low alpha mold compound) Oxygen Rating Index: >28% 54% (typical) Substrate Material: N/A Lead Finish, Composition / Thickness: N/A Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: Wafer saw Die Attach Supplier: Ablestik Die Attach Material: 2025D Bond Diagram Designation 001-98724 Wire Bond Method: Thermosonic Wire Material/Size: CuPd / 0.8mil Thermal Resistance Theta JA C/W: 34.83C /W Package Cross Section Yes/No: N Assembly Process Flow: 001-81701 Name/Location of Assembly (prime) facility: ASEK-Taiwan (G) MSL LEVEL MSL 3 REFLOW PROFILE 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML, PHILIPPINES Note: Please contact a Cypress Representative for other package availability. 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Page 3 of 8 Document No. 002-11995 Rev. ** ECN #: 5212970 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test High Accelerated Saturation Test (HAST) Pressure Cooker Test Temperature Cycle High Temp Storage Electrostatic Discharge Charge Device Model (ESD-CDM) Acoustic Microscopy Ball Shear Bond Pull Constructional Analysis Die Shear Test Condition (Temp/Bias) JEDEC STD 22-A110: 130C, 85%RH, 3.6V Precondition: JESD22 Moisture Sensitivity Level 3 (192 Hrs., 30 C, 60% RH) JESD22-A102: 121 C, 100%RH, 15 PSIG Precondition: JESD22 Moisture Sensitivity Level 3 (192 Hrs., 30 C, 60% RH) MIL-STD-883C, Method 1010, Condition C, -65 C to 150 C Precondition: JESD22 Moisture Sensitivity Level 3 (192 Hrs., 30 C, 60% RH) JESD22-A103: 150 C, no bias Result P/F P P P P (500V, 1,000V, 1250V) JESD22-C101 P J-STD-020 Precondition: JESD22 Moisture Sensitivity Level 3 (192 Hrs., 30 C, 60% RH) JESD22-B116A Cpk : 1.33, Ppk : 1.66 MIL-STD-883 – Method 2011, Cpk : 1.33, Ppk : 1.66 Criteria: Meet external and internal characteristics of Cypress package P MIL-STD-883, Method 2019 P P P P Per die size: Dye Penetrant Test <3000 sq. mils = 1.2 kgf 30001-5000 sq. mils = 1.2 kgf >5001 sq. mils = 1.2 kgf P Internal Visual Test to determine the existence and extent of cracks, Criteria: No Package Crack JESD22-B117B Cpk : 1.33, Ppk : 1.66 MIL-STD-883-2014 Final Visual Inspection JESD22-B101B P Physical Dimension MIL-STD-1835, JESD22-B100 P Solderability, Steam Aged X-Ray J-STD-002, JESD22-B102 95% solder coverage minimum P MIL-STD-883 - 2012 P BGA Solder Ball Shear Company Confidential A printed copy of this document is considered uncontrolled. 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Page 4 of 8 P P Document No. 002-11995 Rev. ** ECN #: 5212970 Reliability Test Data QTP #: Device 153304 Fab Lot # Assy Lot # Assy Loc Duration Samp Rej CY8C4248BZI (8CP42005AC) 4534099 611530960 ASEK-G COMP 15 0 CY8C4248BZI (8CP42005AC) 4534099 611537578 ASEK-G COMP 15 0 CY8C4248BZI (8CP42005AC) 4534099 611537577 ASEK-G COMP 15 0 CY8C4248BZI (8CP42005AC) 4534099 611530960 ASEK-G COMP 24 0 CY8C4248BZI (8CP42005AC) 4534099 611537578 ASEK-G COMP 100 0 CY8C4248BZI (8CP42005AC) 4534099 611537577 ASEK-G COMP 100 0 CY8C4248BZI (8CP42005AC) 4534099 611530960 ASEK-G COMP 24 0 CY8C4248BZI (8CP42005AC) 4534099 611537578 ASEK-G COMP 100 0 CY8C4248BZI (8CP42005AC) 4534099 611537577 ASEK-G COMP 100 0 4534099 611530960 ASEK-G COMP 5 0 CY8C4248BZI (8CP42005AC) 4534099 611537578 ASEK-G COMP 15 0 CY8C4248BZI (8CP42005AC) 4534099 611537577 ASEK-G COMP 15 0 CY8C4248BZI (8CP42005AC) 4534099 611530960 ASEK-G COMP 15 0 CY8C4248BZI (8CP42005AC) 4534099 611537578 ASEK-G COMP 15 0 CY8C4248BZI (8CP42005AC) 4534099 611537577 ASEK-G COMP 15 0 CY8C4248BZI (8CP42005AC) 4534099 611530960 ASEK-G 500 15 0 CY8C4248BZI (8CP42005AC) 4534099 611530960 ASEK-G 1000 15 0 CY8C4248BZI (8CP42005AC) 4534099 611530960 ASEK-G 1250 15 0 CY8C4248BZI (8CP42005AC) 4534099 611537578 ASEK-G COMP 2651 0 CY8C4248BZI (8CP42005AC) 4534099 611537577 ASEK-G COMP 2503 0 Failure Mechanism STRESS: ACOUSTICS STRESS: BALL SHEAR STRESS: BOND PULL STRESS: CONSTRUCTIONAL ANALYSIS CY8C4248BZI (8CP42005AC) STRESS: DIE SHEAR STRESS: DYE PENETRANT STRESS: ESD-CDM STRESS: FINAL VISUAL Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 8 Document No. 002-11995 Rev. ** ECN #: 5212970 Reliability Test Data QTP #: Device Fab Lot # Assy Lot # Assy Loc 153304 Duration Samp Rej Failure Mechanism STRESS: HI-ACCEL SATURATION TEST, 130C, 85%RH, 3.63V, PRE COND 192 HR 30C/60%RH, MSL3 CY8C4248BZI (8CP42005AC) 4534099 611530960 ASEK-G 96 26 0 STRESS: HIGH TEMPERATURE STORAGE CY8C4248BZI (8CP42005AC) 4534099 611530960 ASEK-G 500 78 0 CY8C4248BZI (8CP42005AC) 4534099 611530960 ASEK-G 1000 78 0 CY8C4248BZI (8CP42005AC) 4534099 611530960 ASEK-G COMP 5 0 CY8C4248BZI (8CP42005AC) 4534099 611537578 ASEK-G COMP 5 0 CY8C4248BZI (8CP42005AC) 4534099 611537577 ASEK-G COMP 5 0 STRESS: INTERNAL VISUAL STRESS: PRESSURE COOKER TEST, 121C, 100%RH, 15 Psig, PRE COND 192 HR 30C/60%RH, MSL3 CY8C4248BZI (8CP42005AC) 4534099 611530960 ASEK-G 96 78 0 CY8C4248BZI (8CP42005AC) 4534099 611530960 ASEK-G 168 78 0 STRESS: PHYSICAL DIMENSION CY8C4248BZI (8CP42005AC) 4534099 611537578 ASEK-G COMP 30 0 CY8C4248BZI (8CP42005AC) 4534099 611537577 ASEK-G COMP 30 0 STRESS: SOLDER BALL SHEAR CY8C4248BZI (8CP42005AC) 4534099 611537578 ASEK-G COMP 15 0 CY8C4248BZI (8CP42005AC) 4534099 611537577 ASEK-G COMP 15 0 CY8C4248BZI (8CP42005AC) 4534099 611537578 ASEK-G COMP 3 0 CY8C4248BZI (8CP42005AC) 4534099 611537577 ASEK-G COMP 3 0 CY14B104NA (7A1404B6CC) 4520595 611530604 ASEK-G COMP 15 0 CY14B104NA (7A1404B6CC) 4504243 611530606 ASEK-G COMP 15 0 CY14B104NA (7A1404B6CC) 4519953 611530603 ASEK-G COMP 15 0 STRESS: SOLDERABILITY Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 8 Document No. 002-11995 Rev. ** ECN #: 5212970 Reliability Test Data QTP #: Device Fab Lot # Assy Lot # Assy Loc 153304 Duration Samp Rej Failure Mechanism STRESS: TC COND. C -65C TO 150C, PRE COND 192 HRS 30C/60%RH, MSL3 CY8C4248BZI (8CP42005AC) 4534099 611530960 ASEK-G 500 78 0 CY8C4248BZI (8CP42005AC) 4534099 611530960 ASEK-G 1000 78 0 CY8C4248BZI (8CP42005AC) 4534099 611537578 ASEK-G 500 80 0 CY8C4248BZI (8CP42005AC) 4534099 611537578 ASEK-G 1000 80 0 CY8C4248BZI (8CP42005AC) 4534099 611537577 ASEK-G 500 80 0 CY8C4248BZI (8CP42005AC) 4534099 611537577 ASEK-G 1000 80 0 CY8C4248BZI (8CP42005AC) 4534099 611537578 ASEK-G COMP 15 0 CY8C4248BZI (8CP42005AC) 4534099 611537577 ASEK-G COMP 15 0 STRESS: X-RAY Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 8 Document No.002-11995 Rev. ** ECN # 5212970 Document History Page Document Title: Document Number: QTP#153304: 124 vFBGA Package (9x9x1.0mm) SAC-105, CuPd MSL3, 260C Reflow ASEKTaiwan (G) 002-11995 Rev. ECN Orig. of No. Change ** 5212970 HSTO Description of Change Initial Release. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 8 of 8