Document No.002-12558 Rev. ** ECN # 5228155 Cypress Semiconductor Package Qualification Report QTP# 150413 VERSION** April 2016 48 VFBGA (6x8x1.0mm) SAC 105 Solder Ball Finish, CuPd Wire MSL3, 260C Reflow ASE-Taiwan (G) FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Josephine Pineda (JYF) Sr. Reliability Engineer Reviewed By: Rene Rodgers (RT) Sr. MTS Reliability Engineer Approved By: Don Darling (DCDA) Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 8 Document No.002-12558 Rev. ** ECN # 5228155 PACKAGE QUALIFICATION HISTORY QTP Number Description of Qualification Purpose Date 131204 Qualification of 48 VFBGA (6x8x1.0 mm) at ASE-Taiwan (G) using KE-G2250 Mold Compound, Ablestik 2100A Die Attach Epoxy, SAC-105 Solder Ball Finish, 0.8 mil Cu/Pd Wire,with MSL 3, 260°C Reflow Temperature Dec 2013 150413 Qualification of 48 VFBGA (6x8x1.0 mm) at ASE-Taiwan (G) using KE-G2250 Mold Compound, Ablestik 2100A Die Attach Epoxy, SAC-105 Solder Ball Finish, 0.8 mil Cu/Pd Wire,with MSL 3, 260°C Reflow Temperature June 2015 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 8 Document No.002-12558 Rev. ** ECN # 5228155 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: Package Outline, Type, or Name: Mold Compound Name/Manufacturer: Mold Compound Flammability Rating: BZ48A VFBGA (Very Fine Ball Grid Array) KE-G2250/Kyocera V-0 / UL94 Oxygen Rating Index: 28% Substrate Material: BT resin Lead Finish, Composition / Thickness: SAC105 Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: Saw Die Attach Supplier: Ablestik Die Attach Material: Ablestik 2100A Bond Diagram Designation: 001-95771 Wire Bond Method: Thermosonic Wire Material/Size: CuPd, 0.8 mil Thermal Resistance Theta JA °C/W: 31.35°C/W Package Cross Section Yes/No: Yes Assembly Process Flow: 001-89076 Name/Location of Assembly (prime) facility: ASE-Taiwan (G) MSL Level 3 Reflow Profile 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML-R, CML-RA, Chipmos-GO Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 8 Document No.002-12558 Rev. ** ECN # 5228155 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test Test Condition (Temp/Bias) Result P/F Acoustic Microscopy J-STD-020 Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30C, 60% RH, 260C Reflow) P Ball Shear JESD22-B116 P Bond Pull MIL-STD-883 – Method 2011 P Electrostatic Discharge Charge Device Model (ESD-CDM) Criteria: Meet external and internal characteristics of Cypress package MIL-STD-883, Method 2019 Per die size: <3000 sq. mils = 1.2 kgf 30001-5000 sq. mils = 1.2 kgf >5001 sq. mils = 1.2 kgf Test to determine the existence and extent of cracks, Criteria: No Package Crack 500V/1,000V/1,250V JESD22-C101 Final Visual JESD22-B101 P High Accelerated Saturation Test (HAST) JEDEC STD 22-A110: 110°C, 85%RH, 3.65V Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30C, 60% RH, 260C Reflow) P High Temperature Storage JESD22-A103:150°C No bias P Internal Visual MIL-STD-883-2014 P Physical Dimension MIL-STD-1835, JESD22-B100 P Pressure Cooker JESD22-A102: 121C, 100%RH, 15 PSIG Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30C, 60% RH, 260C Reflow) P Solder Ball Shear JESD22-B117 P Temperature Cycle MIL-STD-883, Method 1010, Condition C, -65°C to 150°C Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30C, 60% RH, 260C Reflow) P X-Ray MIL-STD-883 - 2012 P Constructional Analysis Die Shear Dye Penetrant Test Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 8 P P P P Document No.002-12558 Rev. ** ECN # 5228155 Reliability Test Data QTP #: 131204 Device Fab Lot # Assy Lot # Ass Loc Duration Samp Rej Failure Mechanism STRESS: ACOUSTIC, MSL3 CY62167GE30 (7CC1721673A) 9302002 611314681 G-TAIWAN COMP 15 0 CY62167G30 (7CC172167A) 9308001 611320113 G-TAIWAN COMP 15 0 CY62167G30 (7CC172167A) 9308001 611320115 G-TAIWAN COMP 15 0 CY62167GE30 (7CC1721673A) 9302002 611314681 G-TAIWAN COMP 100 0 611314681 G-TAIWAN COMP 100 0 611314681 G-TAIWAN COMP 5 0 611314681 G-TAIWAN COMP 15 0 CY62167GE30 (7CC1721673A) 9302002 611314681 G-TAIWAN COMP 15 0 CY62167G30 (7CC172167A) 9308001 611320113 G-TAIWAN COMP 15 0 CY62167G30 (7CC172167A) 9308001 611320115 G-TAIWAN COMP 15 0 CY62167GE30 (7CC1721673A) 9302002 611314681 G-TAIWAN 500 9 0 CY62167GE30 (7CC1721673A) 9302002 611314681 G-TAIWAN 1000 3 0 CY62167GE30 (7CC1721673A) 9302002 611314681 G-TAIWAN 1250 3 0 611314681 G-TAIWAN COMP 315 0 STRESS: BALL SHEAR STRESS: BOND PULL CY62167GE30 (7CC1721673A) 9302002 STRESS: CONSTRUCTIONAL ANALYSIS CY62167GE30 (7CC1721673A) 9302002 STRESS: DIE SHEAR CY62167GE30 (7CC1721673A) 9302002 STRESS: DYE PENETRANT TEST STRESS: ESD-CHARGE DEVICE MODEL STRESS: FINAL VISUAL CY62167GE30 (7CC1721673A) 9302002 STRESS: HI-ACCEL SATURATION TEST, 110C, 85%RH, 3.65V, PRE COND 192 HR 30C/60%RH, MSL3 CY62167GE30 (7CC1721673A) 9302002 611314681 G-TAIWAN 264 80 0 STRESS: HIGH TEMPERATURE STORAGE, PLASTIC, 150C CY62167GE30 (7CC1721673A) 9302002 611314681 G-TAIWAN 500 80 0 CY62167GE30 (7CC1721673A) 9302002 611314681 G-TAIWAN 1000 80 0 CY62167GE30 (7CC1721673A) 9302002 611314681 G-TAIWAN 1500 80 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 8 Document No.002-12558 Rev. ** ECN # 5228155 Reliability Test Data QTP #: 131204 Device Fab Lot # Assy Lot # Ass Loc Duration Samp Rej Failure Mechanism STRESS: INTERNAL VISUAL CY62167GE30 (7CC1721673A) 9302002 611314681 G-TAIWAN COMP 5 0 611314681 G-TAIWAN COMP 30 0 STRESS: PHYSICAL DIMENSION CY62167GE30 (7CC1721673A) 9302002 STRESS: PRESSURE COOKER TEST, 121C, 100%RH, 15 Psig, PRE COND 192 HR 30C/60%RH, MSL3 CY62167GE30 (7CC1721673A) 9302002 611314681 G-TAIWAN 168 80 0 CY62167GE30 (7CC1721673A) 9302002 611314681 G-TAIWAN 288 79 0 CY62167GE30 (7CC1721673A) 9302002 611314681 G-TAIWAN COMP 30 0 CY62167G30 (7CC172167A) 9308001 611320113 G-TAIWAN COMP 30 0 CY62167G30 (7CC172167A) 9308001 611320115 G-TAIWAN COMP 30 0 STRESS: SOLDER BALL SHEAR STRESS: TEMPERATURE CYCLE COND. C -65C TO 150C, PRE COND 192 HRS 30C/60%RH, MSL3 CY62167GE30 (7CC1721673A) 9302002 611314681 G-TAIWAN 500 80 0 CY62167GE30 (7CC1721673A) 9302002 611314681 G-TAIWAN 1000 80 0 CY62167G30 (7CC172167A) 9308001 611320113 G-TAIWAN 500 79 0 CY62167G30 (7CC172167A) 9308001 611320113 G-TAIWAN 1000 79 0 CY62167G30 (7CC172167A) 9308001 611320115 G-TAIWAN 500 80 0 CY62167G30 (7CC172167A) 9308001 611320115 G-TAIWAN 1000 80 0 CY62167GE30 (7CC1721673A) 9302002 611314681 G-TAIWAN COMP 2378 0 STRESS: X-RAY Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 8 Document No.002-12558 Rev. ** ECN # 5228155 Reliability Test Data QTP #: 150413 Device Fab Lot # Assy Lot # Ass Loc Duration Samp Rej Failure Mechanism STRESS: ACOUSTIC CY62147G30 (7CP172147AO) 9507001 611513217 G-TAIWAN COMP 15 0 CY62147G30 (7CP1721472AO) 9507001 611515060 G-TAIWAN COMP 15 0 CY7C1041G30 (7CP171041AO) 9507001 611515059 G-TAIWAN COMP 15 0 CY62147G30 (7CP172147AO) 9507001 611513217 G-TAIWAN COMP 5 0 CY62147G30 (7CP1721472AO) 9507001 611515060 G-TAIWAN COMP 5 0 CY7C1041G30 (7CP171041AO) 9507001 611515059 G-TAIWAN COMP 5 0 CY62147G30 (7CP172147AO) 9507001 611513217 G-TAIWAN COMP 15 0 CY62147G30 (7CP1721472AO) 9507001 611515060 G-TAIWAN COMP 15 0 CY7C1041G30 (7CP171041AO) 9507001 611515059 G-TAIWAN COMP 15 0 STRESS: CONSTRUCTIONAL ANALYSIS STRESS: DYE PENETRANT TEST Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 8 Document No.002-12558 Rev. ** ECN # 5228155 Document History Page Document Title: QTP# 150413:48 VFBGA (6X8X1.0MM) SAC 105 SOLDER BALL FINISH, CUPD WIRE, MSL3, 260C REFLOW, ASE-TAIWAN (G) Document Number: 002-12558 Rev. ECN Orig. of No. Change ** 5228155 JYF Description of Change Initial spec release. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 8 of 8