Document No. 002-09997 Rev. ** ECN #: 5019886 Cypress Semiconductor Package Qualification Report QTP# 154002 VERSION ** November, 2015 16LD (300-mil) SOIC NiPdAu, CuPd MSL3, 260C Reflow CML / Philippines FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Becky Thomas Reliability Engineer Reviewed By: Lorena Zapanta Reliability Manager Approved By: Don Darling Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 8 Document No. 002-09997 Rev. ** ECN #: 5019886 PACKAGE/PRODUCT QUALIFICATION HISTORY QTP Number Description of Qualification Purpose 154002 New Package Qualification of the 16LD 300-mil SOIC assembled at CML, Philippines, using 0.8mil CuPd bond wire, KEG6000DA mold compound, QMI 509 die attach, with Nov 2015 NiPdAu leadfinish, at MSL3 and 260C reflow temperature, with 1M nvSRAM, using S8 technology from CMI Fab4 Date Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 8 Document No. 002-09997 Rev. ** ECN #: 5019886 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: Package Outline, Type, or Name: Mold Compound Name/Manufacturer: SZ163 Mold Compound Flammability Rating: 16LD (300-mil) SOIC KEG6000DA / Kyocera UL94 V-0 Oxygen Rating Index: >28% 50% Lead Frame Designation: FMP Lead Frame Material: Copper Lead Finish, Composition: NiPdAu Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: 100% Saw Die Attach Supplier: Henkel Die Attach Material: QMI 509 Bond Diagram Designation 001-72731 Wire Bond Method: Thermosonic Wire Material/Size: 0.8 mil CuPd Thermal Resistance Theta JA C/W: 96C/W Package Cross Section Yes/No: Yes Assembly Process Flow: 001-68163 Name/Location of Assembly (prime) facility: CML / Philippines MSL LEVEL 3 REFLOW PROFILE 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML-RA, Philippines Note: Please contact a Cypress Representative for other package availability. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 8 Document No. 002-09997 Rev. ** ECN #: 5019886 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test High Accelerated Saturation Test (HAST) Pressure Cooker Test Temperature Cycle High Temp Storage Electrostatic Discharge Charge Device Model (ESD-CDM) Acoustic Microscopy Ball Shear Bond Pull Constructional Analysis Die Shear Test Condition (Temp/Bias) JEDEC STD 22-A110: 130C, 85%RH, 3.6V Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH) JESD22-A102: 121 C, 100%RH, 15 PSIG Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH) MIL-STD-883C, Method 1010, Condition C, -65 C to 150 C Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH) JESD22-A103: 150 C, no bias (500V, 1,000V, 1,250V) JESD22-C101 J-STD-020 Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH) JESD22-B116A Cpk : 1.33, Ppk : 1.66 MIL-STD-883 – Method 2011, Cpk : 1.33, Ppk : 1.66 Criteria: Meet external and internal characteristics of Cypress package MIL-STD-883, Method 2019 Result P/F P P P P P P P P P P Per die size: <3000 sq. mils = 1.2 kgf 30001-5000 sq. mils = 1.2 kgf >5001 sq. mils = 1.2 kgf P Internal Visual Test to determine the existence and extent of cracks, Criteria: No Package Crack MIL-STD-883-2014 Final Visual Inspection JESD22-B101B P Physical Dimension MIL-STD-1835, JESD22-B100 P Solderability, Steam Aged J-STD-002, JESD22-B102 P X-Ray 95% solder coverage minimum MIL-STD-883 - 2012 Dye Penetrant Test Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 8 P P Document No. 002-09997 Rev. ** ECN #: 5019886 Reliability Test Data QTP #: 154002 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: HIGH ACCELERATED SATURATION TEST (HAST), 130C, 85%RH, 3.60V, with MSL3 Preconditioning CY14B101Q3A-SFXI 4509467 611524636 CML-RA 96 25 0 STRESS: PRESSURE COOKER TEST, at 121 C, 100%RH, 15 PSIG, with MSL3 Preconditioning CY14B101Q3A-SFXI 4509467 611524636 CML-RA 168 80 0 CY14B101Q3A-SFXI 4509467 611524636 CML-RA 288 80 0 STRESS: TEMPERATURE CYCLE TEST, Condition C, -65 C to 150 C, with MSL3 Preconditioning CY14B101Q3A-SFXI 4509467 611524636 CML-RA 500 79 0 CY14B101Q3A-SFXI 4509467 611524636 CML-RA 1000 79 0 CY14B101Q3A-SFXI 4509467 611524636M CML-RA 500 80 0 CY14B101Q3A-SFXI 4509467 611524636M CML-RA 1000 80 0 CY14B101Q3A-SFXI 4509467 611524636M1 CML-RA 500 80 0 CY14B101Q3A-SFXI 4509467 611524636M1 CML-RA 1000 80 0 CML-RA 500 92 0 STRESS: HIGH TEMPERATURE STORAGE, 150 C CY14B101Q3A-SFXI 6042010 611237207 STRESS: CHARGED DEVICE MODEL (CDM) ESD: 500V, 1,000V, 1,250V CY14B101Q3A-SFXI 4509467 611524636 CML-RA 500 9 0 CY14B101Q3A-SFXI 4509467 611524636 CML-RA 1000 3 0 CY14B101Q3A-SFXI 4509467 611524636 CML-RA 1250 3 0 STRESS: ACOUSTIC MICROSCOPY / before and after MSL3 Preconditioning CY14B101Q3A-SFXI 4509467 611524636 CML-RA COMP 15 0 CY14B101Q3A-SFXI 4509467 611524636M CML-RA COMP 15 0 CY14B101Q3A-SFXI 4509467 611524636M1 CML-RA COMP 15 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 8 Document No. 002-09997 Rev. ** ECN #: 5019886 Reliability Test Data QTP #: 154002 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: BALL SHEAR CY14B101Q3A-SFXI 4509467 611524636 CML-RA COMP 100 0 CY14B101Q3A-SFXI 4509467 611524636M CML-RA COMP 100 0 CY14B101Q3A-SFXI 4509467 611524636M1 CML-RA COMP 100 0 CY14B101Q3A-SFXI 4509467 611524636 CML-RA COMP 100 0 CY14B101Q3A-SFXI 4509467 611524636M CML-RA COMP 100 0 CY14B101Q3A-SFXI 4509467 611524636M1 CML-RA COMP 100 0 STRESS: BOND PULL STRESS: CONSTRUCTIONAL ANALYSIS CY14B101Q3A-SFXI 4509467 611524636 CML-RA COMP 5 0 CY14B101Q3A-SFXI 4509467 611524636M CML-RA COMP 5 0 CY14B101Q3A-SFXI 4509467 611524636M1 CML-RA COMP 5 0 CY14B101Q3A-SFXI 4509467 611524636 CML-RA COMP 30 0 CY14B101Q3A-SFXI 4509467 611524636M CML-RA COMP 30 0 CY14B101Q3A-SFXI 4509467 611524636M1 CML-RA COMP 30 0 STRESS: DIE SHEAR STRESS: DIE PENETRATION TEST CY14B101Q3A-SFXI 4509467 611524636 CML-RA COMP 15 0 CY14B101Q3A-SFXI 4509467 611524636M CML-RA COMP 15 0 CY14B101Q3A-SFXI 4509467 611524636M1 CML-RA COMP 15 0 STRESS: INTERNAL VISUAL CY14B101Q3A-SFXI 4509467 611524636 CML-RA COMP 5 0 CY14B101Q3A-SFXI 4509467 611524636M CML-RA COMP 5 0 CY14B101Q3A-SFXI 4509467 611524636M1 CML-RA COMP 5 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 8 Document No. 002-09997 Rev. ** ECN #: 5019886 Reliability Test Data QTP #: 154002 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: FINAL VISUAL INSPECTION CY14B101Q3A-SFXI 4509467 611524636 CML-RA COMP 783 0 CY14B101Q3A-SFXI 4509467 611524636M CML-RA COMP 783 0 CY14B101Q3A-SFXI 4509467 611524636M1 CML-RA COMP 783 0 STRESS: PHYSICAL DIMENSION CY14B101Q3A-SFXI 4509467 611524636 CML-RA COMP 30 0 CY14B101Q3A-SFXI 4509467 611524636M CML-RA COMP 30 0 CY14B101Q3A-SFXI 4509467 611524636M1 CML-RA COMP 30 0 STRESS: STEAM-AGED SOLDERABILITY CY14B101Q3A-SFXI 4509467 611524636 CML-RA COMP 3 0 CY14B101Q3A-SFXI 4509467 611524636M CML-RA COMP 3 0 CY14B101Q3A-SFXI 4509467 611524636M1 CML-RA COMP 3 0 CY14B101Q3A-SFXI 4509467 611524636 CML-RA COMP 783 0 CY14B101Q3A-SFXI 4509467 611524636M CML-RA COMP 783 0 CY14B101Q3A-SFXI 4509467 611524636M1 CML-RA COMP 783 0 STRESS: X-RAY Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 8 Document No. 002-09997 Rev. ** ECN #: 5019886 Document History Page Document Title: Document Number: QTP# 154002: New Package Qualification of the CML 16LD 300-mil SOIC, with CuPd, KEG3000DA, QMI 509, NiPdAu, at MSL3, 260C, with 1M nvSRAM, S8 Technology from CMI Fab4 002-09997 Rev. ECN Orig. of No. Change ** 5019886 BECK Description of Change Initial Release Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 8 of 8