Document No. 002-11642 Rev. ** ECN #: 5171948 Cypress Semiconductor Package Qualification Report QTP# 160703 VERSION ** March, 2016 48 FBGA Package (6mm x 10mm x 1.2mm) SAC105, CuPd MSL3, 260C Reflow BKK-SB / Thailand FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Becky Thomas Reliability Engineer Reviewed By: Lorena Zapanta Reliability Manager Approved By: Don Darling Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 7 Document No. 002-11642 Rev. ** ECN #: 5171948 PACKAGE/PRODUCT QUALIFICATION HISTORY QTP Number Description of Qualification Purpose Date 160703 Qualification of the 48 FBGA (6mm x 10mm x 1.2mm) Package for nvSRAM at BKK, using ShinEtsu KMC3580LVA, Sumitomo CRM-1577DB, and 0.8 mil CuPd Wire with SAC105 Finish at MSL3 Mar 2016 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 7 Document No. 002-11642 Rev. ** ECN #: 5171948 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: Package Outline, Type, or Name: Mold Compound Name/Manufacturer: BK48C Mold Compound Flammability Rating: 48 FBGA (6mm x 10mm x 1.2mm) KMC-3580LVA / ShinEtsu V-0 / UL94 Mold Compound Alpha Emission Rate: 0.002 C/cm2h max Oxygen Rating Index: >28% >40% Substrate Material: BT Resin Lead Finish, Composition / Thickness: SAC105 Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: Saw Die Attach Supplier: Sumitomo Die Attach Material: CRM-1577DB Bond Diagram Designation 001-98461 / 001-98460 Wire Bond Method: Thermosonic Wire Material/Size: 0.8 mil CuPd Thermal Resistance Theta JA C/W: 48.19 Package Cross Section Yes/No: yes Assembly Process Flow: 001-97055 Name/Location of Assembly (prime) facility: BKK / Thailand MSL LEVEL MSL 3 REFLOW PROFILE 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML, PHILIPPINES Note: Please contact a Cypress Representative for other package availability. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 7 Document No. 002-11642 Rev. ** ECN #: 5171948 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test High Accelerated Saturation Test (HAST) Pressure Cooker Test Temperature Cycle High Temp Storage Electrostatic Discharge Charge Device Model (ESD-CDM) Acoustic Microscopy Ball Shear Bond Pull Constructional Analysis Die Shear Test Condition (Temp/Bias) JEDEC STD 22-A110: 130C, 85%RH, 3.6V Precondition: JESD22 Moisture Sensitivity Level 3 (192 Hrs., 30 C, 60% RH) JESD22-A102: 121 C, 100%RH, 15 PSIG Precondition: JESD22 Moisture Sensitivity Level 3 (192 Hrs., 30 C, 60% RH) MIL-STD-883C, Method 1010, Condition C, -65 C to 150 C Precondition: JESD22 Moisture Sensitivity Level 3 (192 Hrs., 30 C, 60% RH) JESD22-A103: 150 C, no bias Result P/F P P P P (500V, 1,000V, 1250V) JESD22-C101 P J-STD-020 Precondition: JESD22 Moisture Sensitivity Level 3 (192 Hrs., 30 C, 60% RH) JESD22-B116A Cpk : 1.33, Ppk : 1.66 MIL-STD-883 – Method 2011, Cpk : 1.33, Ppk : 1.66 Criteria: Meet external and internal characteristics of Cypress package P MIL-STD-883, Method 2019 P P P P Per die size: Dye Penetrant Test <3000 sq. mils = 1.2 kgf 30001-5000 sq. mils = 1.2 kgf >5001 sq. mils = 1.2 kgf P Internal Visual Test to determine the existence and extent of cracks, Criteria: No Package Crack JESD22-B117B Cpk : 1.33, Ppk : 1.66 MIL-STD-883-2014 Final Visual Inspection JESD22-B101B P Physical Dimension MIL-STD-1835, JESD22-B100 P Solderability, Steam Aged X-Ray J-STD-002, JESD22-B102 95% solder coverage minimum P MIL-STD-883 - 2012 P BGA Solder Ball Shear Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 7 P P Document No. 002-11642 Rev. ** ECN #: 5171948 Reliability Test Data QTP #: 160703 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: Highly Accelerated Saturation Test (HAST), 130C, 85%RH, 3.6V (MSL 3 Preconditioning) CY14V101LA-BA45XIKK CY14V101LA-BA45XIKK CY14B104NA-BA25XIKK 4523280 4523280 4523022 611534262 611534263 611534268 BKK-SG BKK-SG BKK-SG 96 96 96 25 25 27 0 0 0 STRESS: Temperature Cycling Test (TCT), Condition C, -65 C to 150 C (MSL 3 Preconditioning) CY14V101LA-BA45XIKK CY14V101LA-BA45XIKK 4523280 4523280 611534262 611534262 BKK-SG BKK-SG 500 1000 80 80 0 0 CY14V104NA-BA45XIKK CY14V104NA-BA45XIKK 4522711 4522711 611534270 611534270 BKK-SG BKK-SG 500 1000 80 80 0 0 CY14B104NA-BA25XIKK CY14B104NA-BA25XIKK 4523022 4523022 611534268 611534268 BKK-SG BKK-SG 500 1000 80 80 0 0 STRESS: Pressure Cooker Test (PCT), 121 C, 100%RH, 15 PSIG (MSL 3 Preconditioning) CY14V101LA-BA45XIKK CY14V101LA-BA45XIKK 4523280 4523280 611534262 611534262 BKK-SG BKK-SG 168 288 78 78 0 0 CY14V101LA-BA45XIKK CY14V101LA-BA45XIKK 4523280 4523280 611534263 611534263 BKK-SG BKK-SG 168 288 80 80 0 0 CY14B104NA-BA25XIKK CY14B104NA-BA25XIKK 4523022 4523022 611534268 611534268 BKK-SG BKK-SG 168 288 80 80 0 0 611534262 611534262 BKK-SG BKK-SG 500 1000 80 80 0 0 9 0 3 0 STRESS: High Temperature Storage: 150C CY14V101LA-BA45XIKK 4523280 CY14V101LA-BA45XIKK 4523280 STRESS: Electrostatic Discharge- Charge Device Model (ESD-CDM): 48 BGA- 500V CY14V101LA-BA45XIKK 4523280 611534262 BKK-SG 500V STRESS: Electrostatic Discharge- Charge Device Model (ESD-CDM): 48 BGA- 1,000V CY14V101LA-BA45XIKK 4523280 611534262 BKK-SG 1,000V STRESS: Electrostatic Discharge- Charge Device Model (ESD-CDM): 48 BGA- 1,250V CY14V101LA-BA45XIKK 4523280 611534262 BKK-SG 1,250V 3 0 STRESS: Acoustic Microscopy (MSL 3 Preconditioning) CY14V101LA-BA45XIKK CY14V101LA-BA45XIKK CY14V104NA-BA45XIKK CY14B104NA-BA25XIKK 4523280 4523280 4522711 4523022 611534262 611534263 611534270 611534268 BKK-SG BKK-SG BKK-SG BKK-SG COMP COMP COMP COMP 15 15 15 15 0 0 0 0 4523280 4523280 4522711 4523022 611534262 611534263 611534270 611534268 BKK-SG BKK-SG BKK-SG BKK-SG COMP COMP COMP COMP 30 30 30 30 0 0 0 0 STRESS: Wire Bond Shear CY14V101LA-BA45XIKK CY14V101LA-BA45XIKK CY14V104NA-BA45XIKK CY14B104NA-BA25XIKK Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 7 Document No. 002-11642 Rev. ** ECN #: 5171948 Reliability Test Data QTP #: 160703 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: Wire Bond Pull CY14V101LA-BA45XIKK CY14V101LA-BA45XIKK CY14V104NA-BA45XIKK CY14B104NA-BA25XIKK 4523280 4523280 4522711 4523022 611534262 611534263 611534270 611534268 BKK-SG BKK-SG BKK-SG BKK-SG COMP COMP COMP COMP 30 30 30 30 0 0 0 0 4523280 4523280 4523022 611534262 611534263 611534268 BKK-SG BKK-SG BKK-SG COMP COMP COMP 5 5 5 0 0 0 4523280 4523280 4522711 4523022 611534262 611534263 611534270 611534268 BKK-SG BKK-SG BKK-SG BKK-SG COMP COMP COMP COMP 10 10 10 10 0 0 0 0 4523280 4523280 4522711 4523022 611534262 611534263 611534270 611534268 BKK-SG BKK-SG BKK-SG BKK-SG COMP COMP COMP COMP 15 15 15 15 0 0 0 0 611534262 611534263 611534270 611534268 BKK-SG BKK-SG BKK-SG BKK-SG COMP COMP COMP COMP 25 25 25 25 0 0 0 0 611534262 BKK-SG COMP 5 0 4523280 4523280 4522711 4523022 611534262 611534263 611534270 611534268 BKK-SG BKK-SG BKK-SG BKK-SG COMP COMP COMP COMP 1233 326 655 652 0 0 0 0 4523280 4523280 4522711 4523022 611534262 611534263 611534270 611534268 BKK-SG BKK-SG BKK-SG BKK-SG COMP COMP COMP COMP 1233 326 655 652 0 0 0 0 CY14V101LA-BA45XIKK CY14V101LA-BA45XIKK CY14V104NA-BA45XIKK 4523280 4523280 4522711 611534262 611534263 611534270 BKK-SG BKK-SG BKK-SG COMP COMP COMP 3 3 3 0 0 0 STRESS: X-RAY CY14V101LA-BA45XIKK CY14V101LA-BA45XIKK CY14V104NA-BA45XIKK CY14B104NA-BA25XIKK 4523280 4523280 4522711 4523022 611534262 611534263 611534270 611534268 BKK-SG BKK-SG BKK-SG BKK-SG COMP COMP COMP COMP 10 10 10 10 0 0 0 0 STRESS: Constructional Analysis CY14V101LA-BA45XIKK CY14V101LA-BA45XIKK CY14B104NA-BA25XIKK STRESS: Die Shear CY14V101LA-BA45XIKK CY14V101LA-BA45XIKK CY14V104NA-BA45XIKK CY14B104NA-BA25XIKK STRESS: Dye Penetrant Test CY14V101LA-BA45XIKK CY14V101LA-BA45XIKK CY14V104NA-BA45XIKK CY14B104NA-BA25XIKK STRESS: BGA Solder Ball Shear CY14V101LA-BA45XIKK CY14V101LA-BA45XIKK CY14V104NA-BA45XIKK CY14B104NA-BA25XIKK 4523280 4523280 4522711 4523022 STRESS: Internal Visual Inspection CY14V101LA-BA45XIKK 4523280 STRESS: Final Visual Inspection CY14V101LA-BA45XIKK CY14V101LA-BA45XIKK CY14V104NA-BA45XIKK CY14B104NA-BA25XIKK STRESS: Physical Dimensions CY14V101LA-BA45XIKK CY14V101LA-BA45XIKK CY14V104NA-BA45XIKK CY14B104NA-BA25XIKK STRESS: Solderability- BGA Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 7 Document No.002-11642 Rev. ** ECN # 5171948 Document History Page Document Title: Document Number: QTP# 160703: Qualification of the 48 FBGA (6mm x 10mm x 1.2mm) BKK Package for nvSRAM, using KMC-3580LVA, CRM-1577DB, CuPd, and SAC105 002-11642 Rev. ECN Orig. of No. Change ** 5171948 BECK Description of Change Initial Release. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 7