ZXT12P40DX SuperSOT4™ DUAL 40V PNP SILICON LOW SATURATION SWITCHING TRANSISTOR SUMMARY VCEO=-40V; RSAT = 75m ; IC= -2A DESCRIPTION This new 4th generation ultra low saturation transistor utilises the Zetex matrix structure combined with advanced assembly techniques to give extremely low on state losses. This makes it ideal for high efficiency, low voltage switching applications. MSOP8 FEATURES • Extremely Low Equivalent On Resistance • Extremely Low Saturation Voltage • hFE characterised up to 5A • IC=2A Continuous Collector Current • MSOP8 package C2 C1 B1 B2 APPLICATIONS • DC - DC Converters • Power Management Functions • Power switches • Motor control E1 ZXT12P40DXTA 7 12mm embossed 1000 units ZXT12P40DXTC 13 12mm embossed 4000 units 2 Top View DEVICE MARKING T12P40DX ISSUE 2 - DECEMBER 2006 1 8 B2 7 QUANTITY PER REEL C1 6 TAPE WIDTH (mm) C1 C2 5 REEL SIZE (inches) E2 3 DEVICE B1 4 E1 ORDERING INFORMATION 1 E2 C2 ZXT12P40DX ABSOLUTE MAXIMUM RATINGS. PARAMETER SYMBOL LIMIT UNIT Collector-Base Voltage V CBO -50 V Collector-Emitter Voltage V CEO -40 V Emitter-Base Voltage V EBO -7.5 V Peak Pulse Current I CM -5 A Continuous Collector Current IC -2 A Base Current IB -500 mA Power Dissipation at TA=25°C (a)(d) Linear Derating Factor PD 0.87 6.9 W mW/°C Power Dissipation at TA=25°C (a)(e) Linear Derating Factor PD 1.04 8.3 W mW/°C Power Dissipation at TA=25°C (b)(d) Linear Derating Factor PD 1.25 10 W mW/°C Operating and Storage Temperature Range T j :T stg -55 to +150 °C THERMAL RESISTANCE PARAMETER SYMBOL VALUE UNIT Junction to Ambient (a)(d) R θJA 143 °C/W Junction to Ambient (b)(d) R θJA 100 °C/W Junction to Ambient (a)(e) R θJA 120 °C/W NOTES (a) For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions (b) For a device surface mounted on FR4 PCB measured at t⭐5 secs. (c) Repetitive rating - pulse width limited by maximum junction temperature. Refer to Transient Thermal Impedance graph. (d) For device with one active die. (e) For device with two active die running at equal power. ISSUE 2 - DECEMBER 2006 2 ZXT12P40DX CHARACTERISTICS ISSUE 2 - DECEMBER 2006 3 ZXT12P40DX ELECTRICAL CHARACTERISTICS (at Tamb = 25°C unless otherwise stated). PARAMETER SYMBOL MIN. TYP. Collector-Base Breakdown Voltage V (BR)CBO -50 Collector-Emitter Breakdown Voltage V (BR)CEO Emitter-Base Breakdown Voltage V (BR)EBO Collector Cut-Off Current I CBO Emitter Cut-Off Current UNIT CONDITIONS. -95 V I C =-100A -40 -80 V I C =-10mA* -7.5 -8.5 V I E =-100A -100 nA V CB =-40V I EBO -100 nA V EB =-6V Collector Emitter Cut-Off Current I CES -100 nA V CES =-40V Collector-Emitter Saturation Voltage V CE(sat) -22 -215 -260 -190 mV mV mV mV I C =-0.1A, I B =-10mA* I C =-1A, I B =-20mA* I C =-2A, I B =-100mA* I C =-2A, I B =-200mA* Base-Emitter Saturation Voltage V BE(sat) -0.92 -1.0 V I C =-2A, I B =-100mA* Base-Emitter Turn-On Voltage V BE(on) -0.80 -0.85 V I C =-2A, V CE =-2V* Static Forward Current Transfer Ratio h FE Transition Frequency fT 130 MHz I C =-30mA, V CE =-10V f=-50MHz Output Capacitance C obo 35 pF V CB =-10V, f=1MHz Turn-On Time t (on) 97 ns Turn-Off Time t (off) 640 ns V CC =-10V, I C =-1A I B1 =I B2 =-20mA -18 -155 -190 -150 300 300 150 10 450 450 300 25 MAX. *Measured under pulsed conditions. Pulse width=300µs. Duty cycle ≤ 2% ISSUE 2 - DECEMBER 2006 4 I C =-10mA, V CE =-2V* I C =-1A, V CE =-2V* I C =-2A, V CE =-2V* I C =-5A, V CE =-2V* 900 ZXT12P40DX TYPICAL CHARACTERISTICS ISSUE 2 - DECEMBER 2006 5 ZXT12P40DX PAD LAYOUT DETAILS PACKAGE DIMENSIONS D 6 5 2 3 4 E H 8 7 1 eX6 θ° A1 B L C Conforms to JEDEC MO-187 Iss A DIM Millimetres Inches MIN MIN A MAX 1.10 MAX 0.043 A1 0.05 0.15 0.002 0.006 B 0.25 0.40 0.010 0.016 C 0.13 0.23 0.005 0.009 D 2.90 3.10 0.114 0.122 e 0.65 BSC 0.0256 BSC E 2.90 3.10 0.114 0.122 H 4.90 BSC 0.193 BSC L 0.40 0.70 0.016 0.028 q° 0° 6° 0° 6° Europe Zetex GmbH Kustermann-park Zetex GmbH Balanstraße 59 Balanstraße59 D-81541 München D-81673 München Germany Germany Telefon: (49)(49) 8989 4545494949 Telefon: 4900 Fax: Fax: (49)(49) 89 89 45 45 4949 494949 49 [email protected] Zetex Semiconductors plc, Americas Pacific ZetexTechnology Park, Chadderton, Oldham,Asia OL9 9LL, United Kingdom. Telephone:+44 (0)161 622 4444 Zetex Zetex (Asia Ltd) Fax: +44 Inc (0)161 622 4420 Corporate Headquarters Zetex Semiconductors plc 700 Veterans Memorial Highway 3701-04 Metroplaza Tower 1 Zetex Technology Park, Chadderton Zetex Inc. TheseFong are supported by Hauppauge, NY 11788 Zetex (Asia) Ltd. 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The Company reserves © 2006 Published by Zetex Semiconductors the right to alter without notice the specification,plc. design, price or conditions of supply of any product or service. ISSUE 2 - DECEMBER 2006 6 Part no. Definitions Product change Zetex Semiconductors reserves the right to alter, without notice, specifications, design, price or conditions of supply of any product or service. Customers are solely responsible for obtaining the latest relevant information before placing orders. Applications disclaimer The circuits in this design/application note are offered as design ideas. It is the responsibility of the user to ensure that the circuit is fit for the user’s application and meets with the user’s requirements. No representation or warranty is given and no liability whatsoever is assumed by Zetex with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Zetex does not assume any legal responsibility or will not be held legally liable (whether in contract, tort (including negligence), breach of statutory duty, restriction or otherwise) for any damages, loss of profit, business, contract, opportunity or consequential loss in the use of these circuit applications, under any circumstances. Life support Zetex products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Zetex Semiconductors plc. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Reproduction The product specifications contained in this publication are issued to provide outline information only which (unless agreed by the company in writing) may not be used, applied or reproduced for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned. Terms and Conditions All products are sold subjects to Zetex’ terms and conditions of sale, and this disclaimer (save in the event of a conflict between the two when the terms of the contract shall prevail) according to region, supplied at the time of order acknowledgement. For the latest information on technology, delivery terms and conditions and prices, please contact your nearest Zetex sales office. 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Samples may be available “Active” Product status recommended for new designs “Last time buy (LTB)” Device will be discontinued and last time buy period and delivery is in effect “Not recommended for new designs” Device is still in production to support existing designs and production “Obsolete” Production has been discontinued Datasheet status key: “Draft version” This term denotes a very early datasheet version and contains highly provisional information, which may change in any manner without notice. “Provisional version” This term denotes a pre-release datasheet. It provides a clear indication of anticipated performance. However, changes to the test conditions and specifications may occur, at any time and without notice. “Issue” This term denotes an issued datasheet containing finalized specifications. However, changes to specifications may occur, at any time and without notice.