DIODES ZXTP25060BFHTA

ZXTP25060BFH
60V, SOT23, PNP medium power transistor
Summary
BV(BR)CEX > -100V, BV(BR)CEO > -60V
BV(BR)ECO > -7V ;
IC(cont) = -3A;
RCE(sat) = 58 m⍀ typical;
VCE(sat) < -85mV @ -1A ;
PD = 1.25W
Complementary part number ZXTN25060BFH
Description
C
Advanced process capability and package design have been used to
maximize the power handling and performance of this small outline
transistor. The compact size and ratings of this device make it ideally
suited to applications where space is at a premium.
B
Features
•
Higher power dissipation SOT23 package
•
High peak current
•
Low saturation voltage
•
100V forward blocking voltage
•
7V reverse blocking voltage
E
E
C
Applications
•
MOSFET gate drivers
•
Power switches
•
Motor control
B
Pinout - top view
Ordering information
Device
ZXTP25060BFHTA
Reel size
(inches)
Tape width
Quantity per reel
7
8mm
3,000
Device marking
028
Issue 3 - March 2008
© Zetex Semiconductors plc 2008
1
www.zetex.com
ZXTP25060BFH
Absolute maximum ratings
Parameter
Symbol
Limit
Unit
Collector-base voltage
VCBO
-100
V
Collector-emitter voltage (forward blocking)
VCEX
-100
V
Collector-emitter voltage
VCEO
-60
V
Emitter-collector voltage (reverse blocking)
VECO
-7
V
Emitter-base voltage
VEBO
-7
V
IC
-3
A
Peak pulse current
ICM
-9
A
Power dissipation at TA =25°C (a)
Linear derating factor
PD
0.73
5.84
W
mW/°C
Power dissipation at TA =25°C (b)
Linear derating factor
PD
1.05
8.4
W
mW/°C
Power dissipation at TA =25°C (c)
Linear derating factor
PD
1.25
9.6
W
mW/°C
Power dissipation at TA =25°C (d)
Linear derating factor
PD
1.81
14.5
W
mW/°C
Tj, Tstg
-55 to 150
°C
Symbol
Limit
Unit
Junction to ambient (a)
R⍜JA
171
°C/W
Junction to ambient (b)
R⍜JA
119
°C/W
Junction to ambient (c)
R⍜JA
100
°C/W
Junction to ambient (d)
R⍜JA
69
°C/W
Continuous collector current (a)
Operating and storage temperature range
Thermal resistance
Parameter
NOTES:
(a) For a device surface mounted on 15mm x 15mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in
still air conditions.
(b) Mounted on 25mm x 25mm x 1.6mm FR4 PCB with a high coverage of single sided 2 oz copper in still air conditions.
(c) Mounted on 50mm x 50mm x 1.6mm FR4 PCB with a high coverage of single sided 2 oz copper in still air conditions.
(d) As (c) above measured at t<5secs
Issue 3 - March 2008
© Zetex Semiconductors plc 2008
2
www.zetex.com
ZXTP25060BFH
Characteristics
Issue 3 - March 2008
© Zetex Semiconductors plc 2008
3
www.zetex.com
ZXTP25060BFH
Electrical characteristics (at TAMB = 25°C unless otherwise stated)
Parameter
Symbol
Min.
Typ.
Collector-base breakdown BVCBO
voltage
-100
Collector-emitter
breakdown voltage
(forward blocking)
BVCEX,
Collector-emitter
breakdown voltage (base
open)
Max.
Unit
Conditions
-120
V
IC = -100mA
-100
-120
V
IC = -100mA,
RBE < 1k⍀ or
-0.25V < VBE < 1V
BVCEO
-60
-80
V
IC = -10mA (*)
Emitter-collector
breakdown voltage
(reverse blocking)
BVECO
-7
-8.6
V
IE = -100uA (*)
Emitter-base breakdown
voltage
BVEBO
-7
-8.1
V
IE = -100␮A
Collector cut-off current
ICBO
<-1
-50
-20
nA
␮A
VCB = -80V
VCB = -80V, TAMB= 100°C
Collector emitter cut-off
current
ICEX
-
-100
nA
VCE = -80V;
RBE < 1k⍀ or
-0.25V < VBE < 1V
Emitter cut-off current
IEBO
<-1
-50
nA
VEB = -5.6V
Collector-emitter
saturation voltage
VCE(sat)
-45
-55
mV
IC = -0.5A, IB = -50mA (*)
-100
-135
mV
IC = -0.5A, IB = -10mA (*)
-70
-85
mV
IC = -1A, IB = -100mA (*)
-175
-235
mV
IC = -3A, IB = -300mA (*)
Base-emitter saturation
voltage
VBE(sat)
-940
-1040
mV
IC = -3A, IB = -300mA (*)
Base-emitter turn-on
voltage
VBE(on)
-830
-930
mV
IC = -3A, VCE = -2V (*)
Static forward current
transfer ratio
hFE
100
200
300
75
150
IC = -1A, VCE = -2V (*)
30
60
IC = -3A, VCE = -2V (*)
Transition frequency
fT
250
Output capacitance
COBO
17.6
Turn-on time
t(on)
Turn-off time
t(off)
IC = -10mA, VCE = -2V (*)
MHz
IC = -100mA, VCE = -5V
f = 100MHz
pF
VCB = -10V, f = 1MHz (*)
26.5
ns
291
ns
VCC = -10V. IC = -500mA,
IB1 = IB2= -50mA.
30
NOTES:
(*) Measured under pulsed conditions. Pulse width ⱕ300␮s; duty cycle ⱕ2%.
Issue 3 - March 2008
© Zetex Semiconductors plc 2008
4
www.zetex.com
ZXTP25060BFH
Typical characteristics
Issue 3 - March 2008
© Zetex Semiconductors plc 2008
5
www.zetex.com
ZXTP25060BFH
Package outline - SOT23
E
e
e1
b
3 leads
L1
D
E1
A
A1
Dim.
L
c
Millimeters
Inches
Dim.
Millimeters
Min.
Max.
Min.
Max.
A
-
1.12
-
0.044
e1
A1
0.01
0.10
0.0004
0.004
E
2.10
2.64
0.083
0.104
b
0.30
0.50
0.012
0.020
E1
1.20
1.40
0.047
0.055
c
0.085
0.20
0.003
0.008
L
0.25
0.60
0.0098
0.0236
D
2.80
3.04
0.110
0.120
L1
0.45
0.62
0.018
0.024
-
-
-
-
-
e
0.95 NOM
Min.
0.037 NOM
Max.
Inches
1.90 NOM
Min.
Max.
0.075 NOM
Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches
Issue 3 - March 2008
© Zetex Semiconductors plc 2008
6
www.zetex.com
ZXTP25060BFH
Intentionally left blank
Issue 3 - March 2008
© Zetex Semiconductors plc 2008
7
www.zetex.com
ZXTP25060BFH
Definitions
Product change
Zetex Semiconductors reserves the right to alter, without notice, specifications, design, price or conditions of supply of any product or
service. Customers are solely responsible for obtaining the latest relevant information before placing orders.
Applications disclaimer
The circuits in this design/application note are offered as design ideas. It is the responsibility of the user to ensure that the circuit is fit for
the user’s application and meets with the user’s requirements. No representation or warranty is given and no liability whatsoever is
assumed by Zetex with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights
arising from such use or otherwise. Zetex does not assume any legal responsibility or will not be held legally liable (whether in contract,
tort (including negligence), breach of statutory duty, restriction or otherwise) for any damages, loss of profit, business, contract,
opportunity or consequential loss in the use of these circuit applications, under any circumstances.
Life support
Zetex products are specifically not authorized for use as critical components in life support devices or systems without the express written
approval of the Chief Executive Officer of Zetex Semiconductors plc. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body
or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to
cause the failure of the life support device or to affect its safety or effectiveness.
Reproduction
The product specifications contained in this publication are issued to provide outline information only which (unless agreed by the
company in writing) may not be used, applied or reproduced for any purpose or form part of any order or contract or be regarded as a
representation relating to the products or services concerned.
Terms and Conditions
All products are sold subjects to Zetex’ terms and conditions of sale, and this disclaimer (save in the event of a conflict between the two
when the terms of the contract shall prevail) according to region, supplied at the time of order acknowledgement.
For the latest information on technology, delivery terms and conditions and prices, please contact your nearest Zetex sales office.
Quality of product
Zetex is an ISO 9001 and TS16949 certified semiconductor manufacturer.
To ensure quality of service and products we strongly advise the purchase of parts directly from Zetex Semiconductors or one of our
regionally authorized distributors. For a complete listing of authorized distributors please visit: www.zetex.com/salesnetwork
Zetex Semiconductors does not warrant or accept any liability whatsoever in respect of any parts purchased through unauthorized sales channels.
ESD (Electrostatic discharge)
Semiconductor devices are susceptible to damage by ESD. Suitable precautions should be taken when handling and transporting devices.
The possible damage to devices depends on the circumstances of the handling and transporting, and the nature of the device. The extent
of damage can vary from immediate functional or parametric malfunction to degradation of function or performance in use over time.
Devices suspected of being affected should be replaced.
Green compliance
Zetex Semiconductors is committed to environmental excellence in all aspects of its operations which includes meeting or exceeding regulatory requirements with respect to the use of hazardous substances. Numerous successful programs have been implemented to reduce
the use of hazardous substances and/or emissions.
All Zetex components are compliant with the RoHS directive, and through this it is supporting its customers in their compliance with
WEEE and ELV directives.
Product status key:
“Preview”
Future device intended for production at some point. Samples may be available
“Active”
Product status recommended for new designs
“Last time buy (LTB)”
Device will be discontinued and last time buy period and delivery is in effect
“Not recommended for new designs” Device is still in production to support existing designs and production
“Obsolete”
Production has been discontinued
Datasheet status key:
“Draft version”
This term denotes a very early datasheet version and contains highly provisional information, which
may change in any manner without notice.
“Provisional version”
This term denotes a pre-release datasheet. It provides a clear indication of anticipated performance.
However, changes to the test conditions and specifications may occur, at any time and without notice.
“Issue”
This term denotes an issued datasheet containing finalized specifications. However, changes to
specifications may occur, at any time and without notice.
Zetex sales offices
Europe
Americas
Asia Pacific
Corporate Headquarters
Zetex GmbH
Kustermann-park
Balanstraße 59
D-81541 München
Germany
Telefon: (49) 89 45 49 49 0
Fax: (49) 89 45 49 49 49
europe.sales@zetex.com
Zetex Inc
700 Veterans Memorial Highway
Hauppauge, NY 11788
USA
Zetex (Asia Ltd)
3701-04 Metroplaza Tower 1
Hing Fong Road, Kwai Fong
Hong Kong
Zetex Semiconductors plc
Zetex Technology Park, Chadderton
Oldham, OL9 9LL
United Kingdom
Telephone: (1) 631 360 2222
Fax: (1) 631 360 8222
usa.sales@zetex.com
Telephone: (852) 26100 611
Fax: (852) 24250 494
asia.sales@zetex.com
Telephone: (44) 161 622 4444
Fax: (44) 161 622 4446
hq@zetex.com
© 2008 Published by Zetex Semiconductors plc
Issue 3 - March 2008
© Zetex Semiconductors plc 2008
8
www.zetex.com