MOTOROLA MMDF2N06VL

Order this document
by MMDF2N06VL/D
SEMICONDUCTOR TECHNICAL DATA

N–Channel Enhancement–Mode Silicon Gate
TMOS V is a new technology designed to achieve an on–resistance area product about one–half that of standard MOSFETs. This
new technology more than doubles the present cell density of our
50 and 60 volt TMOS devices. Just as with our TMOS E–FET
designs, TMOS V is designed to withstand high energy in the
avalanche and commutation modes. Designed for low voltage, high
speed switching applications in power supplies, converters and
power motor controls, these devices are particularly well suited for
bridge circuits where diode speed and commutating safe operating
areas are critical and offer additional safety margin against
unexpected voltage transients.
New Features of TMOS V
• On–resistance Area Product about One–half that of Standard
MOSFETs with New Low Voltage, Low RDS(on) Technology
• Faster Switching than E–FET Predecessors
DUAL TMOS MOSFET
2.5 AMPERES
60 VOLTS
RDS(on) = 0.130 OHM
TM
D
CASE 751–05, Style 11
SO–8
G
S
Features Common to TMOS V and TMOS E–FETS
• Avalanche Energy Specified
• IDSS and VDS(on) Specified at Elevated Temperature
• Static Parameters are the Same for both TMOS V and TMOS E–FET
• Miniature SO–8 Surface Mount Package – Saves Board Space
• Mounting Information for SO–8 Package Provided
Source–1
1
8
Drain–1
Gate–1
2
7
Drain–1
Source–2
3
6
Drain–2
Gate–2
4
5
Drain–2
Top View
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Rating
Drain–to–Source Voltage
Drain–to–Gate Voltage, (RGS = 1 MΩ)
Gate–to–Source Voltage — Continuous
Drain Current — Continuous @ TA = 25°C
Drain Current — Continuous @ TA = 100°C
Drain Current — Single Pulse (tp ≤ 10 µs)
Total Power Dissipation @ TA = 25°C (1)
Operating and Storage Temperature Range
Single Pulse Drain–to–Source Avalanche Energy — Starting TJ = 25°C
(VDD = 25 Vdc, VGS = 5.0 Vdc, Peak IL = 3.3 Apk, L = 10 mH, RG = 25 Ω)
Thermal Resistance, Junction to Ambient (1)
Maximum Lead Temperature for Soldering Purposes, 0.0625″ from case for 10 seconds
Symbol
Value
Unit
VDSS
VDGR
60
Vdc
60
Vdc
VGS
ID
ID
IDM
PD
± 15
Vdc
2.5
0.5
7.5
Adc
2.0
W
TJ, Tstg
EAS
– 55 to 175
°C
54
mJ
RθJA
62.5
°C/W
TL
260
°C
Apk
DEVICE MARKING
2N6VL
(1) Mounted on G10/FR4 glass epoxy board using minimum recommended footprint.
ORDERING INFORMATION
Device
Reel Size
Tape Width
Quantity
MMDF2N06VLR1
7″
12mm embossed tape
500
MMDF2N06VLR2
13″
12mm embossed tape
2500
This document contains information on a new product. Specifications and information herein are subject to change without notice.
E–FET and TMOS V are trademarks of Motorola, Inc. TMOS is a registered trademark of Motorola, Inc.
TMOS
Motorola
Motorola, Inc.
1996 Power MOSFET Transistor Device Data
1
MMDF2N06VL
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic
Symbol
Min
Typ
Max
Unit
60
—
—
66
—
—
—
—
—
—
10
100
—
—
100
1.0
—
1.5
3.0
2.0
—
—
0.12
0.13
—
—
—
—
0.4
0.3
gFS
1.0
3.0
—
Mhos
Ciss
—
340
480
pF
Coss
—
110
150
Crss
—
27
50
td(on)
—
10
20
tr
—
30
60
td(off)
—
32
60
tf
—
28
60
QT
—
11
20
Q1
—
1.5
—
Q2
—
3.8
—
Q3
—
3.5
—
VSD
—
—
0.84
0.67
1.2
—
Vdc
trr
—
49
—
ns
ta
—
32
—
tb
—
17
—
QRR
—
0.08
—
OFF CHARACTERISTICS
Drain–to–Source Breakdown Voltage
(VGS = 0 Vdc, ID = 0.25 mAdc)
Temperature Coefficient (Positive)
V(BR)DSS
Zero Gate Voltage Drain Current
(VDS = 60 Vdc, VGS = 0 Vdc)
(VDS = 60 Vdc, VGS = 0 Vdc, TJ = 150°C)
IDSS
Gate–Body Leakage Current (VGS = ± 15 Vdc, VDS = 0 Vdc)
IGSS
Vdc
mV/°C
µAdc
nAdc
ON CHARACTERISTICS(1)
Gate Threshold Voltage
(VDS = VGS, ID = 250 µAdc)
Threshold Temperature Coefficient (Negative)
VGS(th)
Static Drain–to–Source On–Resistance
(VGS = 5.0 Vdc, ID = 2.5 Adc)
RDS(on)
Drain–to–Source On–Voltage
(VGS = 5.0 Vdc, ID = 2.5 Adc)
(VGS = 5.0 Vdc, ID = 1.25 Adc, TJ = 150°C)
VDS(on)
Forward Transconductance (VDS = 15 Vdc, ID = 1.25 Adc)
Vdc
mV/°C
Ohm
Vdc
DYNAMIC CHARACTERISTICS
Input Capacitance
Output Capacitance
(VDS = 25 Vdc, VGS = 0 Vdc,
f = 1.0 MHz)
Transfer Capacitance
SWITCHING CHARACTERISTICS(2)
Turn–On Delay Time
Rise Time
Turn–Off Delay Time
(VDD = 30 Vdc, ID = 2.5 Adc,
VGS = 5.0 Vdc,
RG = 9.1 Ω)
Fall Time
Gate Charge
(VDS = 48 Vdc, ID = 2.5 Adc,
VGS = 5.0 Vdc)
SOURCE–DRAIN DIODE CHARACTERISTICS
Forward On–Voltage(1)
(IS = 2.5 Adc, VGS = 0 Vdc)
(IS = 2.5 Adc, VGS = 0 Vdc, TJ =
150°C)
Reverse Recovery Time
(IS = 2.5 Adc, VGS = 0 Vdc,
dIS/dt = 100 A/µs)
Reverse Recovery Storage Charge
ns
nC
µC
(1) Pulse Test: Pulse Width ≤ 300 µs, Duty Cycle ≤ 2%.
(2) Switching characteristics are independent of operating junction temperature.
2
Motorola TMOS Power MOSFET Transistor Device Data
MMDF2N06VL
PACKAGE DIMENSIONS
–A–
M
1
4
R
0.25 (0.010)
4X
–B–
X 45 _
B
M
5
P
8
NOTES:
1. DIMENSIONS A AND B ARE DATUMS AND T IS A
DATUM SURFACE.
2. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
3. DIMENSIONS ARE IN MILLIMETER.
4. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
5. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
6. DIMENSION D DOES NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS
OF THE D DIMENSION AT MAXIMUM MATERIAL
CONDITION.
J
M_
C
F
G
–T–
K
SEATING
PLANE
8X
D
0.25 (0.010)
M
T B
S
A
S
CASE 751–05
SO–8
ISSUE P
Motorola TMOS Power MOSFET Transistor Device Data
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
4.80
5.00
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.18
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
STYLE 11:
PIN 1.
2.
3.
4.
5.
6.
7.
8.
SOURCE 1
GATE 1
SOURCE 2
GATE 2
DRAIN 2
DRAIN 2
DRAIN 1
DRAIN 1
3
MMDF2N06VL
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of
others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other
applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury
or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola
and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
Motorola was negligent regarding the design or manufacture of the part. Motorola and
are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal
Opportunity/Affirmative Action Employer.
How to reach us:
USA / EUROPE / Locations Not Listed: Motorola Literature Distribution;
P.O. Box 20912; Phoenix, Arizona 85036. 1–800–441–2447 or 602–303–5454
JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, 6F Seibu–Butsuryu–Center,
3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 03–81–3521–8315
MFAX: [email protected] – TOUCHTONE 602–244–6609
INTERNET: http://Design–NET.com
ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park,
51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298
4
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*MMDF2N06VL/D*
MMDF2N06VL/D
Motorola TMOS Power MOSFET Transistor
Device Data