STMICROELECTRONICS STP2NA50

STP2NA50
STP2NA50FI
N - CHANNEL ENHANCEMENT MODE
POWER MOS TRANSISTOR
PRELIMINARY DATA
T YPE
ST P2NA50
ST P2NA50FI
■
■
■
■
■
■
■
V DSS
R DS(o n)
ID
500 V
500 V
<4Ω
<4 Ω
2.8 A
2A
TYPICAL RDS(on) = 3.25 Ω
± 30V GATE TO SOURCE VOLTAGE RATING
100% AVALANCHE TESTED
REPETITIVE AVALANCHE DATA AT 100oC
LOW INTRINSIC CAPACITANCES
GATE CHARGE MINIMIZED
REDUCED THRESHOLD VOLTAGE SPREAD
1
2
3
3
1
TO-220
APPLICATIONS
■
MEDIUM CURRENT, HIGH SPEED
SWITCHING
■
SWITCH MODE POWER SUPPLIES (SMPS)
■
CONSUMER AND INDUSTRIAL LIGHTING
2
ISOWATT220
INTERNAL SCHEMATIC DIAGRAM
ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Value
STP2NA50
Unit
STP2NA50F I
V DS
Drain-Source Voltage (V gs = 0)
500
V
VDGR
Drain-Gate Voltage (Rgs = 20 KΩ)
500
V
V GS
Gate-Source Voltage
± 30
V
o
ID
Drain-Current (continuous) at Tc = 25 C
2.8
2
A
ID
Drain-Current (continuous) at Tc = 100 C
o
1.8
1.25
A
11.2
11.2
A
I DM (•)
P t ot
V ISO
T stg
Tj
Drain-Current (Pulsed)
o
Total Dissipation at T c = 25 C
75
35
W
Derating Factor
0.6
0.28
W/ o C
-
4000
Insulation W ithstand Voltage (DC)
Storage T emperature
Max Operating Junction T emperature
V
-65 to 150
o
C
150
o
C
(•)Pulse width limited by safe operating area
March 1996
1/6
STP2NA50/FI
THERMAL DATA
R t hj-ca se
Thermal Resistance Junction-case
R t hj- amb
R thc- si nk
Tl
Thermal Resistance Junction-ambient
Max
Thermal Resistance Case-sink
Typ
Maximum Lead Temperature For Soldering Purpose
Max
TO 220
IS OW ATT 220
1.67
3.57
62.5
0.5
300
o
C/W
o
C/W
C/W
o
C
o
AVALANCHE CHARACTERISTICS
Symb ol
Max Valu e
Unit
I AR
Avalanche Current, Repetitive or Not-Repetitive
(pulse width limited by Tj max, δ < 1%)
Parameter
2.8
A
E AS
Single Pulse Avalanche Energy
o
(starting Tj = 25 C, ID = I AR , V DD = 50 V)
42
mJ
E AR
Repetitive Avalanche Energy
(pulse width limited by Tj max, δ < 1%)
1.6
mJ
I AR
Avalanche Current, Repetitive or Not-Repetitive
o
(T c = 100 C, pulse width limited by Tj max, δ < 1%)
1.8
A
ELECTRICAL CHARACTERISTICS (Tcase = 25 oC unless otherwise specified)
OFF
Symb ol
V (BR)DSS
Parameter
Drain-source
Breakdown Voltage
Test Cond ition s
I D = 250 µA
V GS = 0
Min.
Typ .
Max.
500
Un it
V
I DSS
Zero Gate Voltage
V DS = Max Rating
Drain Current (V GS = 0) V DS = Max Rating x 0.8 T c = 125 o C
250
1000
µA
µA
I GSS
Gate-Source Leakage
Current (V DS = 0)
V GS = ± 30 V
100
mA
Typ .
Max.
Un it
3
3.75
V
3.25
4
8
Ω
Ω
ON (∗)
Symb ol
Parameter
Test Cond ition s
= 250 µA
V GS(th)
Gate T hreshold Voltage V DS = VGS
R DS( on)
Static Drain-source On
Resistance
V GS = 10 V
V GS = 10 V
On State Drain Current
V DS > I D(on) x R DS(on) max
V GS = 10 V
ID(o n)
ID
I D = 1.4 A
ID = 1.4 A
Min.
2.25
T c = 100 oC
2.8
A
DYNAMIC
Symb ol
g fs (∗)
C iss
C oss
C rss
2/6
Parameter
Test Cond ition s
Forward
Transconductance
V DS > I D(on) x R DS(on) max
I D = 1.4 A
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
V DS = 25 V
V GS = 0
f = 1 MHz
Min.
Typ .
0.8
2
300
55
15
Max.
Un it
S
400
70
20
pF
pF
pF
STP2NA50/FI
ELECTRICAL CHARACTERISTICS (continued)
SWITCHING ON
Symb ol
t d(on)
tr
(di/dt) on
Qg
Q gs
Q gd
Typ .
Max.
Un it
Turn-on T ime
Rise Time
Parameter
V DD = 250 V
R G = 4.7 Ω
Test Cond ition s
I D = 1.4 A
V GS = 10 V
7
8
10
11
ns
ns
Turn-on Current Slope
V DD = 400 V
R G = 47 Ω
I D = 2.8 A
V GS = 10 V
350
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
V DD = 400 V
V GS = 10 V
18
5.5
7
25
nC
nC
nC
Typ .
Max.
Un it
7
7
14
10
10
20
ns
ns
ns
Typ .
Max.
Un it
2.8
11.2
A
A
1.6
V
ID =2.8 A
Min.
A/µs
SWITCHING OFF
Symb ol
t r(Vof f)
tf
tc
Parameter
Off-voltage Rise Time
Fall T ime
Cross-over T ime
Test Cond ition s
V DD = 400 V
R G = 4.7 Ω
Min.
I D = 2.8 A
V GS = 10 V
SOURCE DRAIN DIODE
Symb ol
Parameter
Test Cond ition s
I SD
I SDM (•)
Source-drain Current
Source-drain Current
(pulsed)
V SD (∗)
Forward O n Voltage
I SD = 2.8 A
Reverse Recovery
Time
Reverse Recovery
Charge
Reverse Recovery
Current
I SD = 2.8 A
V DD = 100 V
t rr
Q rr
I RRM
Min.
V GS = 0
di/dt = 100 A/µs
o
T j = 150 C
380
ns
4.4
µC
23
A
(∗) Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %
(•) Pulse width limited by safe operating area
3/6
STP2NA50/FI
TO-220 MECHANICAL DATA
mm
DIM.
MIN.
inch
TYP.
MAX.
MIN.
TYP.
MAX.
A
4.40
4.60
0.173
0.181
C
1.23
1.32
0.048
0.051
D
2.40
2.72
0.094
D1
0.107
1.27
0.050
E
0.49
0.70
0.019
0.027
F
0.61
0.88
0.024
0.034
F1
1.14
1.70
0.044
0.067
F2
1.14
1.70
0.044
0.067
G
4.95
5.15
0.194
0.203
0.106
G1
2.4
2.7
0.094
H2
10.0
10.40
0.393
L2
0.409
16.4
0.645
13.0
14.0
0.511
0.551
L5
2.65
2.95
0.104
0.116
L6
15.25
15.75
0.600
0.620
L7
6.2
6.6
0.244
0.260
L9
3.5
3.93
0.137
0.154
DIA.
3.75
3.85
0.147
0.151
D1
C
D
A
E
L4
H2
G
G1
F1
L2
F2
F
Dia.
L5
L9
L7
L6
4/6
L4
P011C
STP2NA50/FI
ISOWATT220 MECHANICAL DATA
mm
DIM.
MIN.
inch
TYP.
MAX.
MIN.
TYP.
MAX.
A
4.4
4.6
0.173
0.181
B
2.5
2.7
0.098
0.106
D
2.5
2.75
0.098
0.108
E
0.4
0.7
0.015
0.027
F
0.75
1
0.030
0.039
F1
1.15
1.7
0.045
0.067
F2
1.15
1.7
0.045
0.067
0.204
G
4.95
5.2
0.195
G1
2.4
2.7
0.094
0.106
H
10
10.4
0.393
0.409
30.6
1.126
L2
16
L3
0.630
28.6
1.204
9.8
10.6
0.385
0.417
L6
15.9
16.4
0.626
0.645
L7
9
9.3
0.354
0.366
Ø
3
3.2
0.118
0.126
B
D
A
E
L4
L3
L6
F
F1
L7
F2
H
G
G1
¯
1 2 3
L2
L4
P011G
5/6
STP2NA50/FI
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the
consequences of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No
license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned
in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied.
SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express
written approval of SGS-THOMSON Microelectonics.
 1995 SGS-THOMSON Microelectronics - All Rights Reserved
SGS-THOMSON Microelectronics GROUP OF COMPANIES
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