STPS20L15D/G ® LOW DROP OR-ing POWER SCHOTTKY DIODE MAIN PRODUCT CHARACTERISTICS IF(AV) 20 A VRRM 15 V Tj (max) 125°C VF (max) 0.33 V K K FEATURES AND BENEFITS VERY LOW FORWARD VOLTAGE DROP FOR LESS POWER DISSIPATION AND REDUCED HEATSINK SIZE REVERSE VOLTAGE SUITED TO OR-ing OF 3V, 5V and 12V RAILS A A K DESCRIPTION Packaged in TO-220AC or D2PAK, this device is especially intended for use as an OR-ing diode in fault tolerant power supply equipments. NC TO-220AC STPS20L15D D2PAK STPS20L15G ABSOLUTE RATINGS (limiting values) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 15 V IF(RMS) RMS forward current 30 A IF(AV) Average forward current Tc = 115°C δ = 1 20 A IFSM Surge non repetitive forward current tp = 10 ms Sinusoidal 310 A IRRM Repetitive peak reverse current tp = 2 µs F = 1kHz 2 A IRSM Non repetitive peak reverse current tp = 100 µs 3 A Tstg Storage temperature range - 65 to + 150 °C 125 °C 10000 V/µs Tj dV/dt * : Maximum operating junction temperature * Critical rate of rise of reverse voltage dPtot 1 < thermal runaway condition for a diode on its own heatsink Rth(j−a) dTj July 1999 - Ed: 2B 1/5 STPS20L15D/G THERMAL RESISTANCES Symbol Parameter Value Unit 1.6 °C/W Junction to case Rth (j-c) STATIC ELECTRICAL CHARACTERISTICS Symbol Tests Conditions IR * VF * Tests Conditions Min. Typ. Max. Unit 6 mA Reverse leakage current Tj = 25°C VR = 15V Tj = 100°C VR = 15V Forward voltage drop Tj = 25°C IF = 19 A 0.41 Tj = 25°C IF = 40 A 0.52 Tj = 125°C IF = 19 A 0.28 0.33 Tj = 125°C IF = 40 A 0.42 0.50 200 500 V * tp = 380 µs, δ < 2% Pulse test : To evaluate the maximum conduction losses use the following equation : P = 0.18 x IF(AV) + 8.10-3 x IF2(RMS) Fig. 1: Average forward power dissipation versus average forward current. 8 PF(av)(W) δ = 0.1 7 δ = 0.05 δ = 0.5 δ = 0.2 δ=1 6 5 4 3 T 2 1 0 Fig. 2: Average forward current versus ambient temperature ( δ = 1). δ=tp/T IF(av) (A) 0 2 4 6 8 10 12 14 16 18 tp 20 22 Fig. 3: Non repetitive surge peak forward current versus overload duration (maximum values). 22 20 18 16 14 12 10 8 6 4 2 0 IF(av)(A) Rth(j-a)=Rth(j -c) Rth(j-a)=15°C/W Rth(j-a)=35°C/W T δ=tp/T 0 tp 25 Tamb(°C) 50 75 100 Fig. 4: Relative variation of thermal impedance junction to case versus pulse duration. Zth(j-c)/Rth(j-c) IM(A) 250 1.0 200 0.8 150 0.6 δ = 0.5 Tc=50°C 100 0.4 δ = 0.2 T Tc=75°C 50 IM 0.2 t 2/5 1E-2 δ = 0.1 tp (s) Tc=110°C t(s) δ=0.5 0 1E-3 125 Single pulse 1E-1 1E+0 0.0 1.0E-4 1.0E-3 1.0E-2 δ=tp/T 1.0E-1 tp 1.0E+0 STPS20L15D/G Fig. 5: Reverse leakage current versus reverse voltage applied (typical values). 5E+2 IR(mA) C(nF) 5.0 F=1MHz Tj=25°C Tj=100°C 1E+2 1.0 1E+1 Tj=25°C 1E+0 1E-1 Fig. 6: Junction capacitance versus reverse voltage applied (typical values). VR(V) VR(V) 0 2 4 6 8 10 12 14 16 Fig. 7: Forward voltage drop versus forward current (typical values). 0.1 1 2 5 10 20 Fig. 8: Forward voltage drop versus forward current (maximum values). IFM(A) 200.0 200 100.0 100 IFM(A) Tj=100°C Tj=125°C 10.0 Tj=75°C 10 Tj=25°C 1.0 VFM(V) 0.1 0 0.2 0.4 0.6 0.8 1 1 1.2 1.4 1.6 VFM(V) 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 Fig. 9: Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board FR4, copper thickness : 35 µm). (STPS20L15G only) Rth(j-a) (°C/W) 80 70 60 50 40 30 20 10 0 S(Cu) (cm²) 0 4 8 12 16 20 24 28 32 36 40 3/5 STPS20L15D/G PACKAGE MECHANICAL DATA D2PAK DIMENSIONS REF. Millimeters Min. A E C2 L2 D L L3 A1 B2 R C B G A2 M * V2 * FLAT ZONE NO LESS THAN 2mm FOOT PRINT DIMENSIONS (in millimeters) 16.90 10.30 5.08 1.30 3.70 8.90 4/5 A A1 A2 B B2 C C2 D E G L L2 L3 M R V2 Max. 4.40 4.60 2.49 2.69 0.03 0.23 0.70 0.93 1.14 1.70 0.45 0.60 1.23 1.36 8.95 9.35 10.00 10.40 4.88 5.28 15.00 15.85 1.27 1.40 1.40 1.75 2.40 3.20 0.40 typ. 0° 8° Inches Min. Max. 0.173 0.181 0.098 0.106 0.001 0.009 0.027 0.037 0.045 0.067 0.017 0.024 0.048 0.054 0.352 0.368 0.393 0.409 0.192 0.208 0.590 0.624 0.050 0.055 0.055 0.069 0.094 0.126 0.016 typ. 0° 8° STPS20L15D/G PACKAGE MECHANICAL DATA TO-220AC DIMENSIONS REF. Min. A H2 C L5 L7 ØI L6 L2 D L9 F1 L4 M F Millimeters E G A C D E F F1 G H2 L2 L4 L5 L6 L7 L9 M Diam. I Max. 4.40 4.60 1.23 1.32 2.40 2.72 0.49 0.70 0.61 0.88 1.14 1.70 4.95 5.15 10.00 10.40 16.40 typ. 13.00 14.00 2.65 2.95 15.25 15.75 6.20 6.60 3.50 3.93 2.6 typ. 3.75 3.85 Inches Min. Max. 0.173 0.181 0.048 0.051 0.094 0.107 0.019 0.027 0.024 0.034 0.044 0.066 0.194 0.202 0.393 0.409 0.645 typ. 0.511 0.551 0.104 0.116 0.600 0.620 0.244 0.259 0.137 0.154 0.102 typ. 0.147 0.151 Ordering type Marking Package Weight Base qty Delivery mode STPS20L15D STPS20L15D TO-220AC STPS20L15G STPS20L15G-TR STPS20L15G STPS20L15G 1.86 g. 50 Tube 2 1.48g. 50 Tube 2 1.48 g. 1000 Tape and reel D PAK D PAK Cooling method: by conduction (C) Recommended torque value: 0.55 m.N Maximum torque value: 0.7 m.N Epoxy meets UL94,V0 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics © 1999 STMicroelectronics - Printed in Italy - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A. http://www.st.com 5/5