STMICROELECTRONICS STTHR5R06B

STTH5R06
®
TURBO 2 ULTRAFAST HIGH VOLTAGE RECTIFIER
Table 1: Main Product Characteristics
IF(AV)
5A
VRRM
600 V
Tj
175°C
VF (typ)
1.4 V
trr (max)
K
40 ns
TO-220AC
STTH5R06D
FEATURES AND BENEFITS
■
■
■
■
Ultrafast switching
Low reverse recovery current
Low thermal resistance
Reduces switching losses
A
A
K
K
TO-220FPAC
STTH5R06FP
K
A
A
NC
NC
DESCRIPTION
The STTH5R06, which is using ST Turbo 2 600V
technology, is specially suited as boost diode in
continuous mode power factor corrections and
hard switching conditions. This device is also
intended for use as a free wheeling diode in power
supplies and other power switching applications.
D2PAK
STTH5R06G
DPAK
STTH5R06B
Table 2: Order Codes
Part Number
STTH5R06D
STTH5R06FP
STTH5R06B
Part Number
STTH5R06B-TR
STTH5R06G
STTH5R06G-TR
Marking
STTH5R06D
STTH5R06FP
STTH5R06B
Marking
STTH5R06B
STTH5R06G
STTH5R06G
Table 3: Absolute Ratings (limiting values)
Symbol
Parameter
VRRM Repetitive peak reverse voltage
IF(RMS)
RMS forward voltage
IFSM
TO-220AC / TO-220FPAC / D2PAK
DPAK
Average forward current TO-220AC / DPAK Tc = 135°C δ = 0.5
/ D2PAK
TO-220FPAC
Tc = 105°C
δ = 0.5
Surge non repetitive forward current
tp = 10ms sinusoidal
Tstg
Storage temperature range
IF(AV)
Tj
Maximum operating junction temperature
September 2004
REV. 4
Value
600
Unit
V
20
A
10
5
A
5
50
A
-65 to + 175
°C
175
°C
1/9
STTH5R06
Table 4: Thermal Resistance
Symbol
Parameter
Junction to case
Rth(j-c)
Value (max).
Unit
TO-220AC / DPA / D2PAK
3.0
°C/W
TO-220FPAC
5.5
Table 5: Static Electrical Characteristics
Symbol
IR *
Parameter
Test conditions
Reverse leakage current Tj = 25°C
Min.
Typ
VR = VRRM
Tj = 125°C
VF **
Forward voltage drop
25
Tj = 25°C
Max.
Unit
20
µA
250
IF = 5A
2.9
Tj = 125°C
1.4
V
1.8
* tp = 5 ms, δ < 2%
Pulse test:
** tp = 380 µs, δ < 2%
2
To evaluate the conduction losses use the following equation: P = 1.164 x IF(AV) + 0.128 IF (RMS)
Table 6: Dynamic Characteristics
Symbol
Parameter
trr
Reverse recovery
time
Tj = 25°C
Reverse recovery
current
Tj = 125°C IF = 5A
VR = 400V
dIF/dt = -200 A/µs
IRM
Test conditions
Min. Typ Max. Unit
IF = 0.5A Irr = 0.25A IR =1A
25
IF = 1A dIF/dt = -50 A/µs VR =30V
40
5.0
S factor Softness factor
ns
6.0
A
0.35
Qrr
Reverse recovery
charges
110
tfr
Forward recovery
time
Tj = 25°C
IF = 5A
dIF/dt = 40 A/µs
VFR = 1.1 x VFmax
150
ns
VFP
Forward recovery
voltage
Tj = 25°C
IF = 5A dIF/dt = 40 A/µs
VFR = 1.1 x VFmax
4.5
V
Figure 1: Conduction losses versus average
current
nC
Figure 2: Forward voltage drop versus forward
current
IFM(A)
P(W)
13
δ = 0.1
δ = 0.05
12
δ = 0.2
50
δ = 0.5
45
11
40
δ=1
10
9
35
8
30
7
Tj=125°C
(maximum values)
Tj=125°C
(typical values)
25
6
20
5
4
Tj=25°C
(maximum values)
15
T
3
10
2
IF(AV)(A)
1
δ=tp/T
0
0
2/9
1
2
3
4
5
6
5
VFM(V)
tp
0
7
0
1
2
3
4
5
6
STTH5R06
Figure 3: Relative variation of thermal
impedance junction to case versus pulse
duration (TO-220AC, DPAK, D2PAK)
Figure 4: Relative variation of thermal
impedance junction to case versus pulse
duration (TO-220FPAC)
Zth(j-c)/Rth(j-c)
Zth(j-c)/Rth(j-c)
1.0
1.0
0.9
0.9
0.8
0.8
0.7
0.7
δ = 0.5
0.6
0.6
0.5
δ = 0.5
0.5
0.4
δ = 0.2
0.3
δ = 0.1
0.4
δ = 0.2
0.3
T
0.2
T
δ = 0.1
0.2
Single pulse
0.1
tp(s)
δ=tp/T
0.0
1.E-03
1.E-02
1.E-01
Single pulse
1.E+00
1.E-03
1.E-02
1.E-01
1.E+00
tp
1.E+01
Figure 6: Reverse recovery time versus dIF/dt
(90% confidence)
trr(ns)
IRM(A)
80
VR=400V
Tj=125°C
20
δ=tp/T
0.0
Figure 5: Peak reverse recovery current versus
dIF/dt (90% confidence)
22
tp(s)
0.1
tp
IF=2 x IF(AV)
VR=400V
Tj=125°C
70
18
16
14
IF=2 x IF(AV)
60
IF=IF(AV)
IF=IF(AV)
50
IF=0.5 x IF(AV)
IF=0.5 x IF(AV)
12
40
IF=0.25 x IF(AV)
10
30
8
6
20
4
2
10
dIF/dt(A/µs)
dIF/dt(A/µs)
0
0
0
200
400
600
800
1000
Figure 7: Reverse recovery charges versus
dIF /dt (90% confidence)
0
200
400
600
800
1000
Figure 8: Softness factor versus dIF/dt (typical
values)
S factor
Qrr(nC)
0.70
350
VR=400V
Tj=125°C
300
IF=IF(AV)
VR=400V
Tj=125°C
0.65
0.60
IF=2 x IF(AV)
0.55
250
0.50
IF=IF(AV)
200
0.45
0.40
150
0.35
IF=0.5 x IF(AV)
0.30
100
0.25
0.20
50
dIF/dt(A/µs)
0.15
0
dIF/dt(A/µs)
0.10
0
200
400
600
800
1000
0
200
400
600
800
1000
3/9
STTH5R06
Figure 9: Relative variations of dynamic
parameters versus junction temperature
Figure 10: Transient peak forward voltage
versus dIF/dt (90% confidence)
VFP(V)
20
2.50
IF=IF(AV)
Tj=125°C
18
2.25
16
S factor
2.00
14
1.75
12
1.50
10
1.25
8
1.00
6
0.75
IRM
4
0.50
IF=IF(AV)
VR=400V
Reference: Tj=125°C
QRR
0.25
Tj(°C)
dIF/dt(A/µs)
2
0
0.00
25
50
75
100
125
Figure 11: Forward recovery time versus dIF/dt
(90% confidence)
0
100
200
300
400
500
Figure 12: Junction capacitance versus
reverse voltage applied (typical values)
C(pF)
tfr(ns)
120
100
IF=IF(AV)
VFR=1.1 x VF max.
Tj=125°C
F=1MHz
VOSC=30mVRMS
Tj=25°C
100
80
60
40
20
VR(V)
dIF/dt(A/µs)
0
10
0
100
200
300
400
500
Figure 13: Thermal resistance junction to
ambient versus copper surface under tab
(epoxy FR4, eCU=35µm) (DPAK and D2PAK)
Rth(j-a)(°C/W)
100
90
80
70
60
50
40
30
20
10
S(Cu)(cm²)
0
0
4/9
2
4
6
8
10
12
14
16
18
20
1
10
100
1000
STTH5R06
Figure 14: DPAK Package Mechanical Data
REF.
A
A1
A2
B
B2
C
C2
D
E
G
H
L2
L4
V2
DIMENSIONS
Millimeters
Inches
Min.
Max
Min.
Max.
2.20
2.40
0.086
0.094
0.90
1.10
0.035
0.043
0.03
0.23
0.001
0.009
0.64
0.90
0.025
0.035
5.20
5.40
0.204
0.212
0.45
0.60
0.017
0.023
0.48
0.60
0.018
0.023
6.00
6.20
0.236
0.244
6.40
6.60
0.251
0.259
4.40
4.60
0.173
0.181
9.35
10.10
0.368
0.397
0.80 typ.
0.031 typ.
0.60
1.00
0.023
0.039
0°
8°
0°
8°
Figure 15: DPAK Foot Print Dimensions
(in millimeters)
6.7
6.7
3
3
1.6
1.6
2.3
2.3
5/9
STTH5R06
Figure 16: D2PAK Package Mechanical Data
REF.
A
E
C2
L2
D
L
L3
A1
B2
R
C
B
G
A2
M
*
V2
* FLAT ZONE NO LESSTHAN 2mm
Figure 17: D2PAK Foot Print Dimensions
(in millimeters)
16.90
10.30
5.08
1.30
3.70
8.90
6/9
A
A1
A2
B
B2
C
C2
D
E
G
L
L2
L3
M
R
V2
DIMENSIONS
Millimeters
Inches
Min.
Max.
Min.
Max.
4.40
4.60
0.173
0.181
2.49
2.69
0.098
0.106
0.03
0.23
0.001
0.009
0.70
0.93
0.027
0.037
1.14
1.70
0.045
0.067
0.45
0.60
0.017
0.024
1.23
1.36
0.048
0.054
8.95
9.35
0.352
0.368
10.00
10.40
0.393
0.409
4.88
5.28
0.192
0.208
15.00
15.85
0.590
0.624
1.27
1.40
0.050
0.055
1.40
1.75
0.055
0.069
2.40
3.20
0.094
0.126
0.40 typ.
0.016 typ.
0°
8°
0°
8°
STTH5R06
Figure 18: TO-220FPAC Package Mechanical Data
REF.
A
H
A
B
D
E
F
F1
F2
G
G1
H
L2
L3
L4
L6
L7
Dia.
B
Dia
L6
L2
L7
L3
L5
D
F1
L4
F
E
G1
G
DIMENSIONS
Millimeters
Inches
Min.
Max.
Min.
Max.
4.4
4.6
0.173
0.181
2.5
2.7
0.098
0.106
2.5
2.75
0.098
0.108
0.45
0.70
0.017
0.027
0.75
1
0.030
0.039
1.15
1.70
0.045
0.067
1.15
1.70
0.045
0.067
4.95
5.20
0.195
0.204
2.40
2.70
0.094
0.106
10
10.4
0.393
0.409
16 Typ.
0.63 Typ.
28.6
30.6
1.126
1.204
9.8
10.6
0.385
0.417
15.9
16.4
0.626
0.645
9.00
9.30
0.354
0.366
3
3.20
0.118
0.126
Figure 19: TO-220AC Package Mechanical Data
REF.
H2
A
C
L5
L7
ØI
L6
L2
D
L9
F1
L4
M
F
E
G
A
C
D
E
F
F1
G
H2
L2
L4
L5
L6
L7
L9
M
Diam. I
DIMENSIONS
Millimeters
Inches
Min.
Max.
Min.
Max.
4.40
4.60
0.173
0.181
1.23
1.32
0.048
0.051
2.40
2.72
0.094
0.107
0.49
0.70
0.019
0.027
0.61
0.88
0.024
0.034
1.14
1.70
0.044
0.066
4.95
5.15
0.194
0.202
10.00
10.40
0.393
0.409
16.40 typ.
0.645 typ.
13.00
14.00
0.511
0.551
2.65
2.95
0.104
0.116
15.25
15.75
0.600
0.620
6.20
6.60
0.244
0.259
3.50
3.93
0.137
0.154
2.6 typ.
0.102 typ.
3.75
3.85
0.147
0.151
7/9
STTH5R06
Table 7: Ordering Information
Ordering type
STTH5R06D
STTHR5R06G
Marking
STTH5R06D
STTH5R06G
Package
TO-220AC
STTHR5R06G-TR
STTHR5R06FP
STTHR5R06B
STTHR5R06B-TR
STTHR5R06G
STTHR5R06FP
STTHR5R06B
STTHR5R06B-TR
■
■
■
■
D2PAK
Weight
1.90 g
1.48 g
Base qty
50
50
Delivery mode
Tube
Tube
D2PAK
TO-220FPAC
DPAK
DPAK
1.48 g
1.70 g
0.3 g
0.3 g
1000
50
75
2500
Tape & reel
Tube
Tube
Tape & reel
Epoxy meets UL94, V0
Cooling method: by conduction (C)
Recommended torque value: 0.8 m.N. (TO-220FPAC) / 0.55 m.N. (TO-220AC)
Maximum torque value: 1.0 m.N. (TO-220FPAC) / 0.70 m.N. (TO-220AC)
Table 8: Revision History
Date
Oct-2002
07-Sep-2004
8/9
Revision
3
4
Description of Changes
Last update
Tcases values splitted for TO-220FPAC package
STTH5R06
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of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
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