MICROCHIP TC1264

TC1264
800 mA Fixed-Output CMOS LDO with Shutdown
Features
Description
•
•
•
•
•
The TC1264 is a fixed output, high accuracy (typically
±0.5%) CMOS low dropout regulator. Designed
specifically for battery-operated systems, the TC1264’s
CMOS construction eliminates wasted ground current,
significantly extending battery life. Total supply current
is typically 80 µA at full load (20 to 60 times lower than
in bipolar regulators).
Very Low Dropout Voltage
800 mA Output Current
High Output Voltage Accuracy
Standard or Custom Output Voltages
Overcurrent and Overtemperature Protection
Applications
•
•
•
•
•
•
•
TC1264 key features include ultra low noise operation,
very low dropout voltage (typically 450 mV at full load),
and fast response to step changes in load.
Battery Operated Systems
Portable Computers
Medical Instruments
Instrumentation
Cellular/GSM/PHS Phones
Linear Post-Regulators for SMPS
Pagers
The TC1264 incorporates both over temperature and
over current protection. The TC1264 is stable with an
output capacitor of only 1μF and has a maximum
output current of 800 mA. It is available in 3-Pin
SOT-223, 3-Pin TO-220 and 3-Pin DDPAK packages.
Package Type
Typical Application
3-Pin DDPAK
3-Pin TO-220
VIN
VIN
VOUT
TC1264
+
C1
1 µF
FRONT VIEW
VOUT
TAB IS GND
TC1264
TC1264
1 2
1 2
TAB IS GND
3 VOUT
2 GND
TC1264
© 2006 Microchip Technology Inc.
GND
FRONT VIEW
3
VOUT
3-Pin SOT-223
VIN
3
GND
VOUT
VIN
GND
1 VIN
DS21375C-page 1
TC1264
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings †
Input Voltage .........................................................6.5V
Output Voltage.................. (VSS – 0.3V) to (VIN + 0.3V)
Power Dissipation................Internally Limited (Note 8)
Maximum Voltage on Any Pin ........VIN +0.3V to -0.3V
Operating Temperature Range...... -40°C < TJ < 125°C
Storage Temperature..........................-65°C to +150°C
† Notice: Stresses above those listed under "Maximum
Ratings" may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operation listings of this specification is not implied. Exposure
to maximum rating conditions for extended periods may affect
device reliability.
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, VIN = VR + 1.5V, (Note 1), IL = 100 µA, CL = 3.3 µF, SHDN > VIH,
TA = +25°C. Boldface type specifications apply for junction temperatures of -40°C to +125°C.
Parameters
Input Operating Voltage
Maximum Output Current
Output Voltage
VOUT Temperature Coefficient
Sym
Min
Typ
Max
Units
VIN
2.7
—
6.0
V
—
—
mA
IOUTMAX
800
VOUT
VR – 2.5%
ΔVOUT/ΔT
VR ± 0.5% VR + 2.5%
Conditions
Note 2
VR ≥ 2.5V
V
VR – 2%
VR ± 0.5%
VR + 3%
VR = 1.8V
VR – 7%
—
VR + 3%
IL = 0.1 mA to 800 mA
(Note 3)
—
40
—
ppm/°C
Note 4
(VR + 1V) ≤ VIN ≤ 6V
Line Regulation
ΔVOUT/ΔVIN
—
0.007
0.35
%
Load Regulation (Note 5)
ΔVOUT/VOUT
-0.01
0.002
0
%/mA
IL = 0.1 mA to IOUTMAX
Dropout Voltage (Note 6)
VIN–VOUT
—
20
30
mV
VR ≥ 2.5V, IL = 100 µA
—
50
160
VR ≥ 2.5V, IL = 100 mA
—
150
480
VR ≥ 2.5V, IL = 300 mA
—
260
800
VR ≥ 2.5V, IL = 500 mA
—
450
1300
VR ≥ 2.5V, IL = 800 mA
—
1000
1200
VR = 1.8V, IL = 500 mA
—
1200
1400
IDD
—
80
130
Power Supply Rejection Ratio
PSRR
—
64
Output Short Circuit Current
IOUTSC
—
1200
Supply Current
Note 1:
IL = 800 mA
µA
SHDN = VIH, IL = 0
—
db
F ≤ 1 kHz
—
mA
VOUT = 0V
VR is the regulator output voltage setting.
2:
The minimum VIN has to justify the conditions: VIN ≥ VR + VDROPOUT and VIN ≥ 2.7V for IL = 0.1 mA to IOUTMAX.
3:
4:
This accuracy represents the worst-case over the entire output current and temperature range.
5:
Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested
over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating
effects are covered by the thermal regulation specification.
Dropout voltage is defined as the input-to-output differential at which the output voltage drops 2% below its nominal
value measured at a 1.5V differential.
Thermal regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied,
excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 ms.
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e., TA, TJ, θJA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. Please see Section 5.0 “Thermal Considerations” for more
details..
6:
7:
8:
6
( V OUTMAX – V OUTMIN ) – 10
TCV OUT = -----------------------------------------------------------------------V OUT × ΔT
DS21375C-page 2
© 2006 Microchip Technology Inc.
TC1264
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated, VIN = VR + 1.5V, (Note 1), IL = 100 µA, CL = 3.3 µF, SHDN > VIH,
TA = +25°C. Boldface type specifications apply for junction temperatures of -40°C to +125°C.
Parameters
Sym
Thermal Regulation
Output Noise
Note 1:
Min
Typ
Max
Units
ΔVOUT/ΔPD
—
0.04
—
V/W
eN
—
260
—
nV/√Hz
Conditions
Note 7
IL = IOUTMAX, F = 10 kHZ
VR is the regulator output voltage setting.
2:
The minimum VIN has to justify the conditions: VIN ≥ VR + VDROPOUT and VIN ≥ 2.7V for IL = 0.1 mA to IOUTMAX.
3:
4:
This accuracy represents the worst-case over the entire output current and temperature range.
6
TCV OUT
5:
6:
7:
8:
( V OUTMAX – V OUTMIN ) – 10
= -----------------------------------------------------------------------V OUT × ΔT
Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested
over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating
effects are covered by the thermal regulation specification.
Dropout voltage is defined as the input-to-output differential at which the output voltage drops 2% below its nominal
value measured at a 1.5V differential.
Thermal regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied,
excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 ms.
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e., TA, TJ, θJA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. Please see Section 5.0 “Thermal Considerations” for more
details..
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, VIN = VR + 1.5V, IL = 100 µA, CL = 3.3 µF, SHDN > VIH, TA = +25°C.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Temperature Ranges
Specified Temperature Range
TA
-40
—
+125
°C
Operating Temperature Range
TJ
-40
—
+125
°C
Storage Temperature Range
TA
-65
—
+150
°C
Thermal Resistance, 3L-SOT-223
θJA
—
59
—
°C/W
Thermal Resistance, 3L-DDPAK
θJA
—
71
—
°C/W
Thermal Resistance, 3L-TO-220
θJA
—
71
—
°C/W
(Note 1)
Thermal Package Resistances
Note 1:
Operation in this range must not cause TJ to exceed Maximum Junction Temperature (+125°C).
© 2006 Microchip Technology Inc.
DS21375C-page 3
TC1264
TYPICAL PERFORMANCE CURVES
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
LINE REGULATION (%)
Note:
0.020
150
0.018
135
0.016
120
0.014
105
0.012
90
IDD (mA)
2.0
0.010
0.008
60
0.006
45
0.004
30
0.002
15
0.000
-40°C
0°C
25°C
70°C
VOUT = 3V
75
0
-40°C
85°C 125°C
0°C
TEMPERATURE (°C)
FIGURE 2-1:
Temperature.
Line Regulation vs.
FIGURE 2-4:
RLOAD = 50:
COUT = 1 μF
DROPOUT VOLTAGE (V)
NOISE (μV/¥Hz)
10.0
25°C
70°C
85°C 125°C
TEMPERATURE (°C)
1.0
0.1
IDD vs. Temperature.
0.600
0.550
0.500
0.450
0.400
0.350
125°C
85°C
70°C
25°C
0.300
0°C
0.250
0.200
-40°C
0.150
0.100
0.050
0.000
0.0
0.01
0.01
1
10
100
1000
0 100 200 300 400 500 600 700 800
ILOAD (mA)
FREQUENCY (kHz)
FIGURE 2-2:
Output Noise vs. Frequency.
FIGURE 2-5:
ILOAD.
0.0100
3.030
3.020
ILOAD = 0.1 mA
3.010
3.000
0.0080
0.0070
0.0060
VOUT = 3V
1 mA to 800 mA
0.0040
0.0030
VOUT (V)
LOAD REGULATION (%/mA)
0.0090
0.0050
3.0V Dropout Voltage vs.
2.980
2.960
2.950
2.940
0.0010
2.930
0°C
25°C
70°C
85°C
125°C
2.920
-40°C
DS21375C-page 4
Load Regulation vs.
ILOAD = 800 mA
0°C
25°C
70°C
85°C 125°C
TEMPERATURE (°C)
TEMPERATURE (°C)
FIGURE 2-3:
Temperature.
ILOAD = 500 mA
2.970
0.0020
0.0100
-40°C
ILOAD = 300 mA
2.990
FIGURE 2-6:
3.0V VOUT vs.Temperature.
© 2006 Microchip Technology Inc.
TC1264
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
Pin No.
3-Pin SOT-223
3-Pin TO-220
3-Pin DDPAK
Symbol
1
VIN
2
GND
Ground terminal
3
VOUT
Regulated voltage output.
3.1
Unregulated supply input
Unregulated Supply (VIN)
Unregulated supply input.
3.2
Description
3.3
Regulated Output Voltage (VOUT)
Regulated voltage output.
Ground (GND)
Ground terminal.
© 2006 Microchip Technology Inc.
DS21375C-page 5
TC1264
4.0
DETAILED DESCRIPTION
The TC1264 is a precision, fixed output LDO. Unlike
bipolar regulators, the TC1264’s supply current does
not increase with load current. In addition, VOUT
remains stable and within regulation over the entire
0mA to ILOADMAX load current range (an important
consideration in RTC and CMOS RAM battery back-up
applications).
Figure 4-1 shows a typical application circuit.
FIGURE 4-1:
VIN
TYPICAL APPLICATION
CIRCUIT
VIN
VOUT
TC1264
GND
DS21375C-page 6
+
C1
1 µF
VOUT
4.1
Output Capacitor
A 1 µF (min) capacitor from VOUT to ground is required.
The output capacitor should have an effective series
resistance greater than 0.1Ω and less than 5Ω. A 1 µF
capacitor should be connected from VIN to GND if there
is more than 10 inches of wire between the regulator
and the AC filter capacitor, or if a battery is used as the
power source. Aluminum electrolytic or tantalum
capacitor types can be used. (Since many aluminum
electrolytic capacitors freeze at approximately -30°C,
solid tantalums are recommended for applications
operating below -25°C.) When operating from sources
other than batteries, supply-noise rejection and
transient response can be improved by increasing the
value of the input and output capacitors and employing
passive filtering techniques.
SHDN
© 2006 Microchip Technology Inc.
TC1264
5.0
THERMAL CONSIDERATIONS
5.1
Thermal Shutdown
Integrated thermal protection circuitry shuts the
regulator off when die temperature exceeds 160°C.
The regulator remains off until the die temperature
drops to approximately 150°C.
5.2
Power Dissipation
EQUATION 5-1:
P D = ( V INMAX – V OUTMIN )I LOADMAX
Where:
PD = Worst-case actual power dissipation
VINMAX = Maximum voltage on VIN
VOUTMIN = Minimum regulator output voltage
ILOADMAX = Maximum output (load) current
The
maximum
allowable
power
dissipation
(Equation 5-2) is a function of the maximum ambient
temperature (TAMAX), the maximum allowable die temperature (TJMAX) and the thermal resistance from junction-to-air (θJA).
EQUATION 5-2:
Thermal
Resistance
(θJA)
Board
Area
25°C/W
1000 sq mm 2500 sq mm 2500 sq mm
27°C/W
125 sq mm
35°C/W
2500 sq mm 2500 sq mm
* Tab of device attached to topside copper
Equation 5-1 can be used in conjunction with
Equation 5-2 to ensure regulator thermal operation is
within limits. For example:
Given:
VINMAX = 3.3V ± 10%
VOUTMIN = 2.7V ± 0.5%
ILOADMAX = 275 mA
TJMAX = 125°C
TAMAX = 95°C
θJA = 59°C/W (SOT-223)
Find:
1. Actual power dissipation.
2. Maximum allowable dissipation
Actual power dissipation:
P D = ( 3.3 × 1.1 ) – ( 2.7 × .995 ) 275 × 10
Where all terms are previously defined.
Table 5-1 and Table 5-2 show various values of θJA for
the TC1264 packages.
THERMAL RESISTANCE
GUIDELINES FOR TC1264 IN
SOT-223 PACKAGE
Copper
Area
(Backside)
Board
Area
Thermal
Resistance
(θJA)
2500 sq mm 2500 sq mm 2500 sq mm
45°C/W
1000 sq mm 2500 sq mm 2500 sq mm
45°C/W
225 sq mm
2500 sq mm 2500 sq mm
53°C/W
100 sq mm
2500 sq mm 2500 sq mm
59°C/W
1000 sq mm 1000 sq mm 1000 sq mm
52°C/W
1000 sq mm
55°C/W
0 sq mm
Copper
Area
(Backside)
P D ≈ ( V INMAX – V OUTMIN )I LOADMAX
PDMAX = (TJMAX – TAMAX)
θJA
Copper
Area
(Topside)*
Copper
Area
(Topside)*
THERMAL RESISTANCE
GUIDELINES FOR TC1264 IN
3-PIN DDPAK/TO-220
PACKAGE
2500 sq mm 2500 sq mm 2500 sq mm
The amount of power the regulator dissipates is
primarily a function of input and output voltage, and
output current. The following equation is used to
calculate worst-case actual power dissipation:
TABLE 5-1:
TABLE 5-2:
1000 sq mm
–3
P D = 260 mW
Maximum allowable power dissipation:
T JMAX – T AMAX
P DMAX = -------------------------------------θ JA
( 125 – 95 )
P DMAX = ------------------------59
P DMAX = 508 mW
In this example, the TC1264 dissipates a maximum of
260 mW; below the allowable limit of 508 mW. In a
similar manner, Equation 5-1 and Equation 5-2 can be
used to calculate maximum current and/or input
voltage limits. For example, the maximum allowable
VIN, is found by substituting the maximum allowable
power dissipation of 508mW into Equation 5-1, from
which VINMAX = 4.6V.
* Tab of device attached to topside copper
© 2006 Microchip Technology Inc.
DS21375C-page 7
TC1264
6.0
PACKAGING INFORMATION
6.1
Package Marking Information
3-Lead DDPAK
Example
XXXXXXXXX
XXXXXXXXX
YYWWNNN
3-Lead SOT-223
XXXXXXX
XXXYYWW
NNN
3-Lead TO-220
XXXXXXXXX
XXXXXXXXX
YYWWNNN
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
DS21375C-page 8
TC1264
e3
1.8VEB^^
0643256
Example
1264-25
VDB0643
256
Example
TC1264
e3
3.0VAB^^
0643256
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
© 2006 Microchip Technology Inc.
TC1264
3-Lead Plastic (EB) (DDPAK)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
E
L3
E1
D2
D
D1
1
b
e
BOTTOM VIEW
TOP VIEW
α
(5X)
b1
c2
A
φ
A1
c
L
INCHES*
Units
MILLIMETERS
NOM
MIN
Dimension Limits
MAX
NOM
MIN
3
Number of Pins
e
MAX
3
A
.170
1.00 BSC
.177
.183
4.32
2.54 BSC
4.50
A1
.000
.005
.010
0.00
0.13
0.25
Overall Width
Exposed Pad Width
E
E1
.385
.398
.256 REF
.410
9.78
10.11
6.50 REF
10.41
Molded Package Length
Overall Length
D
D1
.330
.549
.350
.577
.370
.605
8.38
13.94
8.89
14.66
9.40
15.37
Exposed Pad Length
Lead Thickness
D2
c
.014
.020
.026
0.36
0.51
0.66
Pad Thickness
c2
.045
--
.055
1.14
--
1.40
Lower Lead Width
b
.026
.032
.037
0.66
0.81
0.94
Upper Lead Width
b1
.049
.050
.051
1.24
1.27
1.30
Foot Length
L
.068
--
.110
1.73
--
2.79
Pad Length
L3
φ
.045
--
.067
1.14
--
1.70
--
--
8°
--
--
8°
--
7°
--
7°
Pitch
Overall Height
Standoff
Foot Angle
Mold Draft Angle
§
α
7.70 REF
.303 REF
3°
4.65
3°
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.
BSC: Basic Dimension. Theoretically, exact value shown without tolerances.
See ASME Y14.5M
REF: Reference Dimension, usually without tolerance, for information purposes only.
See ASME Y14.5M
Revised 07-19-05
JEDEC equivalent: TO-252
Drawing No. C04-011
© 2006 Microchip Technology Inc.
DS21375C-page 9
TC1264
3-Lead Plastic Small Outline Transistor (DB) (SOT-223)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
b2
E1
E
1
e
e1
α
A2
A
c
φ
β
b
L
A1
Units
Dimension Limits
INCHES
Pitch
e
Outside lead pitch (basic)
e1
Overall Height
A
Standoff
Molded Package Height
MILLIMETERS*
NOM
MIN
MAX
NOM
MIN
.091 BSC
MAX
2.30 BSC
.181 BSC
4.60 BSC
–
–
.071
–
–
A1
.001
–
.004
0.02
–
0.10
A2
.061
.063
.065
1.55
1.60
1.65
1.80
Overall Width
E
.264
.276
.287
6.70
7.00
7.30
Molded Package Width
E1
.130
.138
.146
3.30
3.50
3.70
Overall Length
D
c
.248
.256
.264
6.30
6.50
6.70
.009
.012
.014
0.23
0.30
0.35
Lead Thickness
b
.026
.030
.033
0.65
0.76
0.85
b2
.114
.118
.124
2.90
3.00
3.15
L
φ
.035
–
–
0.90
–
–
Lead Angle
0°
–
10°
–
0.37
10°
Mold Draft Angle, Top
α
10°
–
16°
10°
–
16°
Mold Draft Angle, Bottom
β
10°
–
16°
10°
–
16°
Lead Width
Tab Lead Width
Foot Length
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
See ASME Y14.5M
JEDEC Equivalent TO-261 AA
Revised 09-13-05
Drawing No. C04-032
DS21375C-page 10
© 2006 Microchip Technology Inc.
TC1264
3-Lead Plastic Transistor Outline (AB) (TO-220)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A
E
φP
E/2
A1
E3
E1
Q
D3
H1
D2
α
D
D4
5X
D1
L1
BOTTOM: VARIANT A
BOTTOM: VARIANT B
L
b2
PIN 1
PIN n
b
c
e
A2
e1
Units
Dimension Limits
n
e
Number of Pins
Pitch
Overall Pin Pitch
Overall Height
Tab Thickness
Base to Lead
Overall Width
Exposed Tab Width
– (SEE BOTTOM VARIANT B)
Hole Center to Tab Edge
Overall Length
Molded Package Length
Exposed Tab Length
– (SEE BOTTOM VARIANT B)
– (SEE BOTTOM VARIANT B)
Tab Length
Mounting Hole Diameter
Lead Length
Lead Shoulder
Foot Angle
Lead Thickness
Lead Width
Shoulder Width
e1
A
A1
A2
E
E1
E3
Q
D
D1
D2
D3
D4
H1
φP
L
L1
α
c
b
b2
MIN
.140
.020
.080
.380
.270
.251
.100
.560
.330
.480
.243
.303
.230
.139
.500
0
.012
.015
.045
INCHES*
NOM
3
.100 BSC
.200 BSC
.256
.248
.308
.027
.057
MAX
.190
.055
.120
.420
.350
.261
.120
.650
.361
.507
.253
.313
.270
.156
.580
.250
8°
.024
.040
.070
MILLIMETERS
NOM
3
2.54 BSC
5.08 BSC
3.56
0.51
2.03
9.65
6.86
6.38
6.50
2.54
14.22
8.38
12.19
6.17
6.30
7.70
7.82
5.84
3.53
12.70
2.10
0
0.30
0.38
0.69
1.14
1.45
MIN
MAX
4.83
1.40
3.05
10.67
8.89
6.63
3.05
16.51
9.17
12.88
6.43
7.95
6.86
3.96
14.73
6.35
8°
0.61
1.02
1.78
*Controlling Parameter
Notes:
Dimensions D1 and E do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
See ASME Y14.5M
Drawing No. C04-158
© 2006 Microchip Technology Inc.
DS21375C-page 11
TC1264
NOTES:
DS21375C-page 12
© 2006 Microchip Technology Inc.
TC1264
APPENDIX A:
REVISION HISTORY
Revision C (October 2006)
• Section 1.0 “Electrical Characteristics”:
Changed dropout voltage voltage typical value for
IL = 500 mA from 700 to 1000 and maximum
value from 1000 to 1200 for. Changed typical
value for IL = 800 mA from 890 to 1200
• Section 6.0 “PackAging Information”: Added
package marking information and package outline
drawings
• Added disclaimer to package outline drawings.
Revision B (May 2002)
• Not Documented
Revision A (March 2002)
• Original Release of this Document.
© 2006 Microchip Technology Inc.
DS21375C-page 13
TC1264
NOTES:
DS21375C-page 14
© 2006 Microchip Technology Inc.
TC1264
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
X.XX
XX
XX
Device
Voltage
Option
Package
Tape and
Reel
Device
TC1264 Fixed Output CMOS LDO
Voltage Option:*
1.8V
2.5V
3.0V
3.3V
Examples:
a)
b)
c)
d)
TC1264-1.8VAB
TC1264-2.5VAB
TC1264-3.0VAB
TC1264-3.3VAB
a)
TC1264-1.8VEBTR 1.8V LDO, DDPAK-3 pkg.,
Tape and Reel
TC1264-2.5VEBTR 2.5V LDO, DDPAK-3 pkg.,
Tape and Reel
TC1264-3.0VEBTR 3.0V LDO, DDPAK-3 pkg.,
Tape and Reel
TC1264-3.3VEBTR 3.3V LDO, DDPAK-3 pkg.,
Tape and Reel
b)
=
=
=
=
1.8V
2.5V
3.0V
3.3V
* Other output voltages are available. Please contact your local
Microchip sales office for details.
Package
AB
=
DB
=
DBTR =
EB
=
EBTR =
Plastic (TO-220), 3-Lead
Plastic (SOT-223), 3-lead
Plastic (SOT-223), 3-lead,
Tape and Reel
Plastic Transistor Outline (DDPAK), 3-Lead
Plastic Transistor Outline (DDPAK), 3-Lead,
Tape and Reel
c)
d)
a)
b)
c)
d)
e)
f)
g)
h)
© 2006 Microchip Technology Inc.
1.8V LDO, TO-220-3 pkg.
2.5V LDO, TO-220-3 pkg.
3.0V LDO, TO-220-3 pkg.
3.3V LDO, TO-220-3 pkg.
TC1264-1.8VDB
1.8V LDO, SOT-223 pkg.
TC1264-1.8VDBTR 1.8V LDO, SOT-223 pkg.,
Tape and Reel
TC1264-2.5VDB
2.5V LDO, SOT-223 pkg.
TC1264-2.5VDBTR 2.5V LDO, SOT-223 pkg.,
Tape and Reel
TC1264-3.0VDB
3.0V LDO, SOT-223 pkg.
TC1264-3.0VDBTR 3.0V LDO, SOT-223 pkg.,
Tape and Reel
TC1264-3.3VDB
3.3V LDO, SOT-223 pkg.
TC1264-3.3VDBTR 3.3V LDO, SOT-223 pkg.,
Tape and Reel
DS21375C-page 15
TC1264
NOTES:
DS21375C-page 16
© 2006 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART,
PRO MATE, PowerSmart, rfPIC, and SmartShunt are
registered trademarks of Microchip Technology Incorporated
in the U.S.A. and other countries.
AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB,
SEEVAL, SmartSensor and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, ECAN,
ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,
In-Circuit Serial Programming, ICSP, ICEPIC, Linear Active
Thermistor, Mindi, MiWi, MPASM, MPLIB, MPLINK, PICkit,
PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal,
PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB,
rfPICDEM, Select Mode, Smart Serial, SmartTel, Total
Endurance, UNI/O, WiperLock and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2006, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona, Gresham, Oregon and Mountain View, California. The
Company’s quality system processes and procedures are for its PIC®
8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs,
microperipherals, nonvolatile memory and analog products. In addition,
Microchip’s quality system for the design and manufacture of
development systems is ISO 9001:2000 certified.
© 2006 Microchip Technology Inc.
DS21375C-page 17
WORLDWIDE SALES AND SERVICE
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://support.microchip.com
Web Address:
www.microchip.com
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Habour City, Kowloon
Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
India - Bangalore
Tel: 91-80-4182-8400
Fax: 91-80-4182-8422
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Japan - Yokohama
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Atlanta
Alpharetta, GA
Tel: 770-640-0034
Fax: 770-640-0307
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260
Kokomo
Kokomo, IN
Tel: 765-864-8360
Fax: 765-864-8387
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Santa Clara
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
China - Beijing
Tel: 86-10-8528-2100
Fax: 86-10-8528-2104
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Korea - Gumi
Tel: 82-54-473-4301
Fax: 82-54-473-4302
China - Fuzhou
Tel: 86-591-8750-3506
Fax: 86-591-8750-3521
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
China - Hong Kong SAR
Tel: 852-2401-1200
Fax: 852-2401-3431
Malaysia - Penang
Tel: 60-4-646-8870
Fax: 60-4-646-5086
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Taiwan - Hsin Chu
Tel: 886-3-572-9526
Fax: 886-3-572-6459
China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760
Taiwan - Kaohsiung
Tel: 886-7-536-4818
Fax: 886-7-536-4803
China - Shunde
Tel: 86-757-2839-5507
Fax: 86-757-2839-5571
Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
China - Xian
Tel: 86-29-8833-7250
Fax: 86-29-8833-7256
10/19/06
DS21375C-page 18
© 2006 Microchip Technology Inc.