MICROCHIP TC2054_06

TC2054/2055/2186
50 mA, 100 mA, and 150 mA CMOS LDOs
with Shutdown and Error Output
Features
General Description
• Low Supply Current (55 µA Typ.) for Longer Battery Life
• Low Dropout Voltage: 140 mV (Typ.) @ 150 mA
• High Output Voltage Accuracy: ±0.4% (Typ)
• Standard or Custom Output Voltages
• Power-Saving Shutdown Mode
• ERROR Output Can Be Used as a Low Battery
Detector or Processor Reset Generator
• Fast Shutdown Reponse Time: 60 μsec (Typ)
• Overcurrent and Overtemperature Protection
• Space-Saving 5-Pin SOT-23A Package
• Pin Compatible Upgrades for Bipolar Regulators
• Standard Output Voltage Options:
- 1.8V, 2.5V, 2.6V, 2.7V, 2.8V, 2.85V, 3.0V,
The TC2054, TC2055 and TC2186 are high accuracy
(typically ±0.4%) CMOS upgrades for older (bipolar)
low dropout regulators. Designed specifically for battery-operated systems, the devices’ total supply current
is typically 55 µA at full load (20 to 60 times lower than
in bipolar regulators).
3.3V, 5.0V
The TC2054, TC2055 and TC2186 are stable with a
low esr ceramic output capacitor of 1 µF and have a
maximum output current of 50 mA, 100 mA and
150 mA, respectively. This LDO Family also features a
fast response time (60 µs typically) when released from
shutdown.
Applications
•
•
•
•
•
•
Battery Operated Systems
Portable Computers
Medical Instruments
Instrumentation
Cellular / GSMS / PHS Phones
Pagers
Package Type
Typical Application
VIN
1 V
IN
VOUT 5
3
ERROR
ERROR
5
4
TC2054
TC2055
TC2186
1
VIN
GND TC2054
TC2055
TC2186
SHDN
VOUT
VOUT
1 µF
1 µF
2
The devices’ key features include low noise operation,
low dropout voltage – typically 45 mV (TC2054); 90 mV
(TC2055); and 140 mV (TC2186) at full load - and fast
response to step changes in load. An error output
(ERROR) is asserted when the devices are out-of-regulation (due to a low input voltage or excessive output
current). Supply current is reduced to 0.5 µA (max) and
both VOUT and ERROR are disabled when the shutdown input is low. The devices also incorporate overcurrent and overtemperature protection.
2
3
GND SHDN
5-Pin SOT-23A
Top View
1M
4
ERROR
Shutdown Control
(from Power Control Logic)
© 2006 Microchip Technology Inc.
DS21663C-page 1
TC2054/2055/2186
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings †
Input Voltage .........................................................6.5V
Output Voltage................................(-0.3) to (VIN + 0.3)
Operating Temperature .................. -40°C < TJ< 125°C
† Notice: Stresses above those listed under “Absolute
Maximum Ratings” may cause permanent damage to
the device. These are stress ratings only and functional
operation of the device at these or any other conditions
above those indicated in the operation sections of the
specifications is not implied. Exposure to Absolute
Maximum Rating conditions for extended periods my
affect device reliability.
Storage Temperature..........................-65°C to +150°C
Maximum Voltage on Any Pin ........VIN +0.3V to -0.3V
ELECTRICAL SPECIFICATIONS
Electrical Specifications: Unless otherwise noted, VIN = VR + 1V, IL = 100 µA, CL = 3.3 µF, SHDN > VIH, TA = +25°C.
BOLDFACE type specifications apply for junction temperature of -40°C to +125°C.
Parameter
Input Operating Voltage
Maximum Output Current
Output Voltage
Sym
Min
Typ
Max
VIN
2.7
—
6.0
V
Note 1
IOUTMAX
50
100
150
—
—
—
—
—
—
mA
TC2054
TC2055
TC2186
V
Note 2
VOUT
VR - 2.0% VR ± 0.4% VR + 2.0%
Units
Conditions
VOUT Temperature
Coefficient
TCVOUT
—
—
20
40
—
—
Line Regulation
ΔVOUT/
ΔVIN
—
0.05
0.5
%
(VR + 1V) < VIN < 6V
Load Regulation
ΔVOUT/
VOUT
-1.5
-2.5
0.5
0.5
0.5
0.5
%
TC2054;TC2055IL = 0.1 mA to IOUTMAX
TC2186
IL = 0.1 mA to IOUTMAX
Note 4
VIN – VOUT
—
—
—
—
2
45
90
140
—
70
140
210
mV
Dropout Voltage, Note 5
Supply Current
Shutdown Supply Current
Power Supply Rejection
Ratio
Output Short Circuit Current
Thermal Regulation
Thermal Shutdown Die
Temperature
ppm/°C Note 3
TC2015; TC2185
TC2185
Note 5
IIN
—
55
80
µA
SHDN = VIH, IL=0
IINSD
—
0.05
0.5
µA
SHDN = 0V
PSRR
—
50
—
dB
FRE ≤ 100 kHz
IOUTSC
160
300
—
mA
VOUT = 0V
ΔVOUT/ΔPD
—
0.04
—
V/W
Note 6
TSD
—
160
—
°C
IL = 100 µA
IL = 50 mA
IL = 100 mA
IL = 150 mA
Note 1: The minimum VIN has to meet two conditions: VIN = 2.7V and VIN = VR + VDROPOUT.
2: VR is the regulator output voltage setting. For example: VR = 1.8V, 2.7V, 2.8V, 2.85V, 3.0V, 3.3V.
3: TCVOUT =
6
(V
–V
) × 10
OUTMAX
OUTMIN
----------------------------------------------------------------------------------------V
× ΔT
OUT
4: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested
over a load range from 1.0mA to the maximum specified output current. Changes in output voltage due to heating
effects are covered by the thermal regulation specification.
5: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value
at a 1V differential.
6: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied,
excluding load or line regulation effects. Specifications are for a current pulse equal to IMAX at VIN = 6V for T = 10 ms.
7: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e. TA, TJ, θJA).
8: Hysteresis voltage is referenced by VR.
9: Time required for VOUT to reach 95% of VR (output voltage setting), after VSHDN is switched from 0 to VIN.
DS21663C-page 2
© 2006 Microchip Technology Inc.
TC2054/2055/2186
ELECTRICAL SPECIFICATIONS (CONTINUED)
Electrical Specifications: Unless otherwise noted, VIN = VR + 1V, IL = 100 µA, CL = 3.3 µF, SHDN > VIH, TA = +25°C.
BOLDFACE type specifications apply for junction temperature of -40°C to +125°C.
Parameter
Sym
Min
Typ
Max
Units
Conditions
Output Noise
eN
—
600
—
nV /
√Hz
IL = IOUTMAX, F = 10 kHz
Response Time
(from Shutdown Mode)
tR
—
60
—
µs
VIN = 4V
CIN = 1 µF, COUT = 10 µF
IL = 0.1 mA, Note 9
SHDN Input High Threshold VIH
60
—
—
%VIN
VIN = 2.5V to 6.0V
SHDN Input Low Threshold
VIL
—
—
15
%VIN
VIN = 2.5V to 6.0V
Minimum VIN Operating
Voltage
VINMIN
1.0
—
—
V
Output Logic Low Voltage
VOL
—
—
400
mV
ERROR Threshold Voltage
VTH
SHDN Input
ERROR OUTPUT
IOL = 0.1 mA
1 mA Flows to ERROR,
IOL = 1 mA, VIN = 2V
—
0.95 x VR
—
V
ERROR Positive Hysteresis VHYS
—
50
—
mV
Note 8
See Figure 4-2
VOUT to ERROR Delay
tDELAY
—
2
—
ms
VOUT from VR = 3V to 2.8V
Resistance from ERROR to
GND
RERROR
—
126
—
Ω
VDD = 2.5V, VOUT = 2.5V
Note 1: The minimum VIN has to meet two conditions: VIN = 2.7V and VIN = VR + VDROPOUT.
2: VR is the regulator output voltage setting. For example: VR = 1.8V, 2.7V, 2.8V, 2.85V, 3.0V, 3.3V.
3: TCVOUT =
6
( V OUTMAX – V OUTMIN ) × 10
----------------------------------------------------------------------------------------V OUT × ΔT
4: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested
over a load range from 1.0mA to the maximum specified output current. Changes in output voltage due to heating
effects are covered by the thermal regulation specification.
5: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value
at a 1V differential.
6: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied,
excluding load or line regulation effects. Specifications are for a current pulse equal to IMAX at VIN = 6V for T = 10 ms.
7: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e. TA, TJ, θJA).
8: Hysteresis voltage is referenced by VR.
9: Time required for VOUT to reach 95% of VR (output voltage setting), after VSHDN is switched from 0 to VIN.
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, VDD = +2.7V to +6.0V and VSS = GND.
Parameters
Sym
Min
Typ
Max
Units
Extended Temperature Range
TA
-40
—
+125
°C
Operating Temperature Range
TA
-40
—
+125
°C
Storage Temperature Range
TA
-65
—
+150
°C
θJA
—
255
—
°C/W
Conditions
Temperature Ranges:
Thermal Package Resistances:
Thermal Resistance, 5L-SOT-23
© 2006 Microchip Technology Inc.
DS21663C-page 3
TC2054/2055/2186
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, VIN = VR + 1V, IL = 100 µA, COUT = 3.3 µF, SHDN > VIH, TA = +25°C.
0
VINDC = 4V
VINAC = 100mVp-p
VOUTDC = 3V
-20
PSRR (dB)
PSRR (dB)
-20
0
IOUT = 100µA
COUT = 1 µF Ceramic
-40
-60
-40
-60
-80
-80
-100
VINDC = 4V
VINAC = 100 mVp-p
VOUTDC = 3V
-100
10
10
100
100
1000
1,000
10k
10,000
100k
100,000
1M
1,000,000
IOUT = 150 mA
COUT = 10 µF Ceramic
10
10
100
100
1000
1,000
FIGURE 2-1:
Ratio.
0
0
-20
-40
-60
-80
-100
FIGURE 2-4:
Ratio.
PSRR (dB)
PSRR (dB)
Power Supply Rejection
VINDC = 4V
VINAC = 100 mVp-p
VOUTDC = 3V
-20
1,000
1000
10,000
10k
100,000
100k
VINDC = 4V
VINAC = 100 mVp-p
VOUTDC = 3V
-60
1,000,000
1M
IOUT = 150 mA
COUT = 10 µF Tantalum
10
10
100
100
1000
1,000
Power Supply Rejection
FIGURE 2-5:
Ratio.
0.100
COUT = 1µF
DOV (V)
Noise (µV/ √Hz)
Power Supply Rejection
0.120
1
0.1
0.01
DS21663C-page 4
1M
1,000,000
VOUT = 1.8V
0.140
FIGURE 2-3:
100k
100,000
0.160
10
0.001
0.01
10k
10,000
f (Hz)
f (Hz)
FIGURE 2-2:
Ratio.
1M
1,000,000
-40
-100
100
100
100k
100,000
Power Supply Rejection
-80
IOUT = 150 mA
COUT = 1 µF Ceramic
10
10
10k
10,000
f (Hz)
f (Hz)
T = 25°C
T = 130°C
0.080
T = -45°C
0.060
0.040
0.020
0.1
1
10
Frequency (kHz)
100
1000
Output Noise vs. Frequency.
0.000
0
FIGURE 2-6:
50
100
150
ILOAD (mA)
Dropout Voltage vs. ILOAD.
© 2006 Microchip Technology Inc.
TC2054/2055/2186
Note: Unless otherwise indicated, VIN = VR + 1V, IL = 100 µA, COUT = 3.3 µF, SHDN > VIH, TA = +25°C.
65.00
1.9
VOUT = 1.8V
1.88
63.00
1.86
1.84
59.00
VOUT (V)
IDD (µA)
61.00
VIN = 2.8V
1.82
VIN = 2.8V
1.8
1.78
57.00
1.76
1.74
55.00
1.72
1.7
53.00
-45
5
55
105
0
155
15
30
45
60
FIGURE 2-7:
FIGURE 2-10:
Current.
IDD vs. Temperature.
2.9
120
135
150
Output Voltage vs. Output
Temp = +130˚C
2.8
VIN = 6.0V
VIN = 3.8V
2.75
VOUT (V)
2.75
VOUT (V)
105
VOUT = 2.8V
IOUT = 0.1mA
2.85
VIN = 6.5V
2.8
2.7
2.65
Temp = +25˚C
Temp = -45˚C
2.7
2.65
2.6
2.6
2.55
2.55
2.5
2.5
-50
-35
-20
-5
10
25
40
55
70
85 100
115 130
145
3.5
4
4.5
5
FIGURE 2-8:
Temperature.
Output Voltage vs.
FIGURE 2-11:
Voltage.
1.9
6
6.5
7
Output Voltage vs. Supply
1.9
VOUT = 1.8V
IOUT = 0.1mA
1.88
5.5
VIN (V)
Temperature (˚C)
VOUT = 1.8V
IOUT = 0.1mA
1.88
1.86
1.86
1.84
VIN = 6.0V
1.84
VIN = 6.5V
1.82
VOUT (V)
VOUT (V)
90
2.9
VOUT = 2.8V
IOUT = 0.1mA
2.85
75
ILOAD (mA)
Temperature (°C)
1.8
1.78
VIN = 2.8V
Temp = +130˚C
1.82
1.8
1.78
Temp = +25˚C
Temp = -45˚C
1.76
1.76
1.74
1.74
1.72
1.72
1.7
1.7
-50
-35
-20
-5
10
25
40
55
70
85
100
115 130 145
2.7
3.2
FIGURE 2-9:
Temperature.
Output Voltage vs.
© 2006 Microchip Technology Inc.
3.7
4.2
4.7
5.2
5.7
6.2
6.7
VIN (V)
Temperature (˚C)
FIGURE 2-12:
Voltage.
Dropout Voltage vs. Supply
DS21663C-page 5
TC2054/2055/2186
Note: Unless otherwise indicated, VIN = VR + 1V, IL = 100 µA, COUT = 3.3 µF, SHDN > VIH, TA = +25°C.
V IN = 3.8V
VOUT = 2.8V
C IN = 1 µF Ceramic
V IN = 3.0V
VOUT = 2.8V
C IN = 1µF Ceramic
C OUT= 1 µF Ceramic
C OUT= 10µF Ceramic
Frequency = 10KHz
Frequency = 1 KHz
V OUT
100mV/DIV
V OUT
100mV / DIV
Load Current
Load Current
150mA
Load
100µA
FIGURE 2-13:
Load Transient Response.
150mA
Load
100µA
FIGURE 2-16:
Load Transient Response.
Load Transient Response in Dropout Mode
V IN = 4.0V
VOUT = 3.0V
C OUT = 10μF
C BYP = 0.01μF
I OUT = 100µA
VOUT
100mV/DIV
V SHDN
150mA
VIN = 3.105V
VOUT = 3.006V
CIN = 1µF Ceramic
COUT = 1µF Ceramic
RLOAD = 20Ω
FIGURE 2-14:
Dropout Mode.
100µA
V OUT
Load Transient Response in
FIGURE 2-17:
VOUT = 2.8V
C OUT= 1μF Ceramic
C BYP = 470pF
I OUT= 100μA
Shutdown Delay.
V SHDN
50mV / DIV
V OUT
2V / DIV
Input Voltage
V OUT
6V
4V
V IN = 4.0V
VOUT = 3.0V
C OUT = 10μF
C BYP = 0.01μF
I OUT = 100µA
FIGURE 2-15:
DS21663C-page 6
Line Transient Response.
FIGURE 2-18:
Shutdown Wake-up Time.
© 2006 Microchip Technology Inc.
TC2054/2055/2186
Note: Unless otherwise indicated, VIN = VR + 1V, IL = 100 µA, COUT = 3.3 µF, SHDN > VIH, TA = +25°C.
RPULLUP = 100kΩ
IOUT = 0.3mA
VIN
1V/Div
3.42V
2.8V
VOUT
1V/Div
3.0V
2.8V
VERROR 2V/Div
0V
FIGURE 2-19:
VOUT to ERROR Delay.
© 2006 Microchip Technology Inc.
DS21663C-page 7
TC2054/2055/2186
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
Pin Number
3.1
PIN FUNCTION TABLE
Symbol
Description
Unregulated supply input.
1
VIN
2
GND
3
SHDN
Shutdown control input. The regulator is fully enabled when a logic high is applied
to this input. The regulator enters shutdown when a logic low is applied to this
input. During shutdown, output voltage falls to zero, ERROR is open circuited
and supply current is reduced to 0.5µA (max).
4
ERROR
Out-of-Regulation Flag. (Open-drain output). This output goes low when VOUT is
out-of-tolerance by approximately -5%.
5
VOUT
Ground terminal.
Regulated voltage output.
Unregulated Supply Input (VIN)
3.4
Out-of-Regulation Flag (ERROR)
Connect the unregulated input supply to the VIN pin. If
there is a large distance between the input supply and
the LDO regulator, some input capacitance is
necessary for proper operation. A 1 µF capacitor,
connected from VIN to ground, is recommended for
most applications.
The open-drain ERROR flag provides indication that
the regulator output voltage is not in regulation. The
ERROR pin will be low when the output is typically
below 5% of its specified value.
3.2
Connect the output load to VOUT of the LDO. Also
connect one side of the LDO output decoupling
capacitor as close as possible to the VOUT pin.
Ground Terminal (GND)
Connect the unregulated input supply ground return to
GND. Also connect one side of the 1 µF typical input
decoupling capacitor close to this pin and one side of
the output capacitor COUT to this pin.
3.3
3.5
Regulated Voltage Output (VOUT)
Shutdown Control Input (SHDN)
The regulator is fully enabled when a logic-high is
applied to SHDN. The regulator enters shutdown when
a logic-low is applied to this input. During shutdown, the
output voltage falls to zero and the supply current is
reduced to 0.5 µA (max).
DS21663C-page 8
© 2006 Microchip Technology Inc.
TC2054/2055/2186
4.0
DETAILED DESCRIPTION
The TC2054, TC2055 and TC2186 are precision fixed
output voltage regulators. (If an adjustable version is
desired, refer to the TC1070/TC1071/TC1187 data
sheet (DS21353). Unlike bipolar regulators, the
TC2054, TC2055 and TC2186 supply current does not
increase with load current. In addition, VOUT remains
stable and within regulation over the entire 0 mA to
maximum output current operating load range.
Figure 4-1 shows a typical application circuit. The
regulator is enabled any time the shutdown input
(SHDN) is at or above VIH, and shutdown (disabled)
when SHDN is at or below VIL. SHDN may be controlled by a CMOS logic gate, or I/O port of a microcontroller. If the SHDN input is not required, it should be
connected directly to the input supply. While in shutdown, supply current decreases to 0.05 µA (typical),
VOUT falls to zero volts, and ERROR is open-circuited.
VIN
VOUT
VOUT
1 µF
C1
1 µF
BATTERY
TC2054
GND TC2055
TC2186
V+
SHDN
Shutdown Control
(to CMOS Logic or Tie
to VIN if unused)
FIGURE 4-1:
4.1
ERROR
C2 Required Only
if ERROR is used as a
Processor RESET Signal
(See Text)
R1
1MΩ
0.2 µF
C2
BATTLOW
or RESET
Typical Application Circuit.
ERROR Open-Drain Output
ERROR is driven low whenever VOUT falls out of
regulation by more than -5% (typical). This condition
may be caused by low input voltage, output current
limiting or thermal limiting. The ERROR threshold is 5%
below rated VOUT regardless of the programmed output voltage value (e.g. ERROR = VOL at 4.75V (typ.) for
a 5.0V regulator and 2.85V (typ.) for a 3.0V regulator).
ERROR output operation is shown in Figure 4-2.
VOUT
HYSTERESIS (VHYS)
VTH
ERROR
VIH
VOL
FIGURE 4-2:
4.2
Error Output Operation.
Output Capacitor
A 1 µF (min) capacitor from VOUT to ground is required.
The output capacitor should have an effective series
resistance of 0.01Ω. to 5Ω for VOUT = 2.5V, and 0.05Ω.
to 5Ω for VOUT < 2.5V. Ceramic, tantalum and
aluminum electrolytic capacitors can be used. (Since
many aluminum electrolytic capacitors freeze at
approximately
-30°C,
solid
tantalums
are
recommended for applications operating below -25°C).
When operating from sources other than batteries,
supply-noise rejection and transient response can be
improved by increasing the value of the input and
output capacitors and employing passive filtering
techniques.
4.3
Input Capacitor
A 1 µF capacitor should be connected from VIN to GND
if there is more than 10 inches of wire between the
regulator and this AC filter capacitor, or if a battery is
used as the power source. Aluminum electrolytic or
tantalum capacitors can be used (since many
aluminum electrolytic capacitors freeze at approximately -30°C, solid tantalum are recommended for
applications operating below -25°C). When operating
from sources other than batteries, supply-noise
rejection and transient response can be improved by
increasing the value of the input and output capacitors
and employing passive filtering techniques.
Note that ERROR is active when VOUT falls to VTH, and
inactive when VOUT rises above VTH by VHYS.
As shown in Figure 4-1, ERROR can be used as a
battery low flag or as a processor RESET signal (with
the addition of timing capacitor C2). R1 x C2 should be
chosen to maintain ERROR below VIH of the processor
RESET input for at least 200 ms to allow time for the
system to stabilize. Pull-up resistor R1 can be tied to
VOUT, VIN or any other voltage less than (VIN + 0.3V).
The ERROR pin sink current is self-limiting to
approximately 18 mA.
© 2006 Microchip Technology Inc.
DS21663C-page 9
TC2054/2055/2186
5.0
THERMAL CONSIDERATIONS
5.1
Thermal Shutdown
Integrated thermal protection circuitry shuts the regulator off when the die temperature exceeds approximately 160°C. The regulator remains off until the die
temperature cools to approximatley 150°C.
5.2
Equation 5-1 can be used in conjunction with
Equation 5-2 to ensure regulator thermal operation is
within limits. For example:
Given:
= 2.7V – 2.5%
TAMAX
= +55°C
Find:
1. Actual power dissipation
Equation 5-1 is used to calculate worst case power
dissipation:
EQUATION 5-1:
= 3.0V +10%
VOUTMIN
ILOADMAX = 40 mA
Power Dissipation
The amount of power the regulator dissipates is
primarily a function of input and output voltage, and
output current.
VINMAX
2. Maximum allowable dissipation
Actual power dissipation:
P D ≈ ( V INMAX – V OUTMIN )I LOADMAX
P D = ( V INMAX – V OUTMIN )I LOADMAX
= [ ( 3.0 × 1.1 ) – ( 2.7 × 0.975 ) ]40 × 10
Where:
PD
= Worst-case actual power dissipation
VINMAX
= Maximum voltage on VIN
VOUTMIN
= Minimum regulator output voltage
= 26.7mW
Maximum allowable power dissipation:
T JMAX – T AMAX
P DMAX = -------------------------------------θ JA
ILOADMAX = Maximum output (load) current
The
maximum
allowable
power
dissipation
(Equation 5-2) is a function of the maximum ambient
temperature (TAMAX), the maximum allowable die
temperature (125 °C) and the thermal resistance from
junction-to-air (θJA). The 5-Pin SOT-23A package has
a θJA of approximately 220°C/Watt when mounted on a
typical two layer FR4 dielectric copper clad PC board.
EQUATION 5-2:
T JMAX – T AMAX
P DMAX = -------------------------------------θ JA
Where all terms are previously defined.
DS21663C-page 10
–3
– 55= 125
-------------------220
= 318mW
In this example, the TC2054 dissipates a maximum of
only 26.7 mW; far below the allowable limit of 318 mW.
In a similar manner, Equation 5-1 and Equation 5-2 can
be used to calculate maximum current and/or input
voltage limits.
5.3
Layout Considerations
The primary path of heat conduction out of the package
is via the package leads. Therefore, layouts having a
ground plane, wide traces at the pads, and wide power
supply bus lines combine to lower θJA and, therefore,
increase the maximum allowable power dissipation
limit.
© 2006 Microchip Technology Inc.
TC2054/2055/2186
6.0
PACKAGING INFORMATION
6.1
Package Marking Information
TABLE 6-1:
(V)
cdef
c & d represents part number code + temperature
range and voltage
e
represents year and 2-month period code
f
represents lot ID number
6.2
PART NUMBER CODE AND
TEMPERATURE RANGE
TC2054
TC2055
TC2186
1.8
SA
TA
VA
2.5
SB
TB
VB
2.7
SC
TC
VC
2.8
SD
TD
VD
2.85
SE
TE
VE
3.0
SF
TF
VF
5.0
SJ
TG
VG
Taping Information
Component Taping Orientation for 5-Pin SOT-23A (EIAJ SC-74A) Devices
User Direction of Feed
Device
Marking
W
PIN 1
P
Standard Reel Component Orientation
for 713 Suffix Device
(Mark Right Side Up)
Carrier Tape, Number of Components Per Reel and Reel Size:
Package
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
8 mm
4 mm
3000
7 in.
5-Pin SOT-23A
© 2006 Microchip Technology Inc.
DS21663C-page 11
TC2054/2055/2186
5-Lead Plastic Small Outline Transistor (CT) (SOT-23)
E
E1
p
B
p1
n
D
1
α
c
A
φ
L
β
A1
INCHES*
Units
Dimension Limits
A2
MIN
MILLIMETERS
NOM
MAX
MIN
NOM
Pitch
n
p
.038
0.95
Outside lead pitch (basic)
p1
.075
1.90
Number of Pins
Overall Height
5
MAX
5
A
.035
.046
.057
0.90
1.18
1.45
Molded Package Thickness
A2
.035
.043
.051
0.90
1.10
1.30
Standoff
A1
.000
.003
.006
0.00
0.08
0.15
Overall Width
E
.102
.110
.118
2.60
2.80
3.00
Molded Package Width
E1
.059
.064
.069
1.50
1.63
1.75
Overall Length
D
.110
.116
.122
2.80
2.95
3.10
Foot Length
.014
.018
.022
0.35
0.45
Foot Angle
L
f
Lead Thickness
c
.004
Lead Width
B
a
.014
Mold Draft Angle Top
Mold Draft Angle Bottom
b
0
5
.006
.017
10
0
0.55
5
.008
0.09
0.15
.020
0.35
0.43
10
0.20
0.50
0
5
10
0
5
10
0
5
10
0
5
10
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side.
EIAJ Equivalent: SC-74A
Revised 09-12-05
Drawing No. C04-091
DS21663C-page 12
© 2006 Microchip Technology Inc.
TC2054/2055/2186
APPENDIX A:
REVISION HISTORY
Revision C (May 2006)
• Page 1: Added overtemperature to bullet for overcurrent protection in features and general description verbiage.
• Page 3: Added “Thermal Shutdown Die Temperature” to electrical characteristics table. Changed
codition for “Minimum VIN Operating Voltage”
• Page 3: Added Thermal Characteristics Table.
• Page 5: Added new section 5.1 and new verbiage.
• Page 13: Updated package outline drawing.
Revision B (May 2002)
• Data Sheet converted to Microchip standards.
Revision A (May 2001)
• Original Release of this Document under Telcom.
© 2006 Microchip Technology Inc.
DS21663C-page 13
TC2054/2055/2186
NOTES:
DS21663C-page 14
© 2006 Microchip Technology Inc.
TC2054/2055/2186
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
-XX
X
XXXX
Device
Output
Voltage
Temperature
Range
Package
Device:
TC2054:
TC2055:
TC2186:
50 mA LDO with Shutdown and ERROR Output
100 mA LDO with Shutdown and ERROR Output
150 mA LDO with Shutdown and ERROR Output
Output Voltage:
XX
XX
XX
XX
XX
XX
XX
=
=
=
=
=
=
=
Temperature Range:
V
= -40°C to +125°C
Package:
CTTR = Plastic Small Outline Transistor (SOT-23),
5-lead, Tape and Reel
1.8V
2.5V
2.7V
2.8V
2.85V
3.0V
3.3V
© 2006 Microchip Technology Inc.
Examples:
a)
TC2054-1.8VCTTR: 5LD SOT-23-A, 1.8V,
Tape and Reel.
b)
TC2054-2.85VCTTR: 5LD SOT-23-A, 2.85V,
Tape and Reel.
c)
TC2054-3.3VCTTR: 5LD SOT-23-A, 3.3V,
Tape and Reel.
a)
TC2055-1.8VCTTR: 5LD SOT-23-A, 1.8V,
Tape and Reel.
b)
TC2055-2.85VCTTR: 5LD SOT-23-A, 2.85V,
Tape and Reel.
c)
TC2055-3.0VCTTR: 5LD SOT-23-A, 3.0V,
Tape and Reel.
a)
TC2186-1.8VCTTR: 5LD SOT-23-A, 1.8V,
Tape and Reel.
b)
TC2186-2.8VCTTR: 5LD SOT-23-A, 2.8V,
Tape and Reel.
DS21663C-page 15
TC2054/2055/2186
NOTES:
DS21663C-page 16
© 2006 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro,
PICSTART, PRO MATE, PowerSmart, rfPIC, and
SmartShunt are registered trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB,
SEEVAL, SmartSensor and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, dsPICDEM,
dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR,
FanSense, FlexROM, fuzzyLAB, In-Circuit Serial
Programming, ICSP, ICEPIC, Linear Active Thermistor, Mindi,
MiWi, MPASM, MPLIB, MPLINK, PICkit, PICDEM,
PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo,
PowerMate, PowerTool, REAL ICE, rfLAB, rfPICDEM, Select
Mode, Smart Serial, SmartTel, Total Endurance, UNI/O,
WiperLock and ZENA are trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2006, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona, Gresham, Oregon and Mountain View, California. The
Company’s quality system processes and procedures are for its
PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial
EEPROMs, microperipherals, nonvolatile memory and analog
products. In addition, Microchip’s quality system for the design and
manufacture of development systems is ISO 9001:2000 certified.
© 2006 Microchip Technology Inc.
DS21663C-page 17
WORLDWIDE SALES AND SERVICE
AMERICAS
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ASIA/PACIFIC
EUROPE
Corporate Office
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Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
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Web Address:
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02/16/06
DS21663C-page 18
© 2006 Microchip Technology Inc.