TC2054/2055/2186 50 mA, 100 mA, and 150 mA CMOS LDOs with Shutdown and Error Output Features General Description • Low Supply Current (55 µA Typ.) for Longer Battery Life • Low Dropout Voltage: 140 mV (Typ.) @ 150 mA • High Output Voltage Accuracy: ±0.4% (Typ) • Standard or Custom Output Voltages • Power-Saving Shutdown Mode • ERROR Output Can Be Used as a Low Battery Detector or Processor Reset Generator • Fast Shutdown Reponse Time: 60 μsec (Typ) • Overcurrent and Overtemperature Protection • Space-Saving 5-Pin SOT-23A Package • Pin Compatible Upgrades for Bipolar Regulators • Standard Output Voltage Options: - 1.8V, 2.5V, 2.6V, 2.7V, 2.8V, 2.85V, 3.0V, The TC2054, TC2055 and TC2186 are high accuracy (typically ±0.4%) CMOS upgrades for older (bipolar) low dropout regulators. Designed specifically for battery-operated systems, the devices’ total supply current is typically 55 µA at full load (20 to 60 times lower than in bipolar regulators). 3.3V, 5.0V The TC2054, TC2055 and TC2186 are stable with a low esr ceramic output capacitor of 1 µF and have a maximum output current of 50 mA, 100 mA and 150 mA, respectively. This LDO Family also features a fast response time (60 µs typically) when released from shutdown. Applications • • • • • • Battery Operated Systems Portable Computers Medical Instruments Instrumentation Cellular / GSMS / PHS Phones Pagers Package Type Typical Application VIN 1 V IN VOUT 5 3 ERROR ERROR 5 4 TC2054 TC2055 TC2186 1 VIN GND TC2054 TC2055 TC2186 SHDN VOUT VOUT 1 µF 1 µF 2 The devices’ key features include low noise operation, low dropout voltage – typically 45 mV (TC2054); 90 mV (TC2055); and 140 mV (TC2186) at full load - and fast response to step changes in load. An error output (ERROR) is asserted when the devices are out-of-regulation (due to a low input voltage or excessive output current). Supply current is reduced to 0.5 µA (max) and both VOUT and ERROR are disabled when the shutdown input is low. The devices also incorporate overcurrent and overtemperature protection. 2 3 GND SHDN 5-Pin SOT-23A Top View 1M 4 ERROR Shutdown Control (from Power Control Logic) © 2006 Microchip Technology Inc. DS21663C-page 1 TC2054/2055/2186 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings † Input Voltage .........................................................6.5V Output Voltage................................(-0.3) to (VIN + 0.3) Operating Temperature .................. -40°C < TJ< 125°C † Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods my affect device reliability. Storage Temperature..........................-65°C to +150°C Maximum Voltage on Any Pin ........VIN +0.3V to -0.3V ELECTRICAL SPECIFICATIONS Electrical Specifications: Unless otherwise noted, VIN = VR + 1V, IL = 100 µA, CL = 3.3 µF, SHDN > VIH, TA = +25°C. BOLDFACE type specifications apply for junction temperature of -40°C to +125°C. Parameter Input Operating Voltage Maximum Output Current Output Voltage Sym Min Typ Max VIN 2.7 — 6.0 V Note 1 IOUTMAX 50 100 150 — — — — — — mA TC2054 TC2055 TC2186 V Note 2 VOUT VR - 2.0% VR ± 0.4% VR + 2.0% Units Conditions VOUT Temperature Coefficient TCVOUT — — 20 40 — — Line Regulation ΔVOUT/ ΔVIN — 0.05 0.5 % (VR + 1V) < VIN < 6V Load Regulation ΔVOUT/ VOUT -1.5 -2.5 0.5 0.5 0.5 0.5 % TC2054;TC2055IL = 0.1 mA to IOUTMAX TC2186 IL = 0.1 mA to IOUTMAX Note 4 VIN – VOUT — — — — 2 45 90 140 — 70 140 210 mV Dropout Voltage, Note 5 Supply Current Shutdown Supply Current Power Supply Rejection Ratio Output Short Circuit Current Thermal Regulation Thermal Shutdown Die Temperature ppm/°C Note 3 TC2015; TC2185 TC2185 Note 5 IIN — 55 80 µA SHDN = VIH, IL=0 IINSD — 0.05 0.5 µA SHDN = 0V PSRR — 50 — dB FRE ≤ 100 kHz IOUTSC 160 300 — mA VOUT = 0V ΔVOUT/ΔPD — 0.04 — V/W Note 6 TSD — 160 — °C IL = 100 µA IL = 50 mA IL = 100 mA IL = 150 mA Note 1: The minimum VIN has to meet two conditions: VIN = 2.7V and VIN = VR + VDROPOUT. 2: VR is the regulator output voltage setting. For example: VR = 1.8V, 2.7V, 2.8V, 2.85V, 3.0V, 3.3V. 3: TCVOUT = 6 (V –V ) × 10 OUTMAX OUTMIN ----------------------------------------------------------------------------------------V × ΔT OUT 4: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 1.0mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. 5: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value at a 1V differential. 6: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to IMAX at VIN = 6V for T = 10 ms. 7: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e. TA, TJ, θJA). 8: Hysteresis voltage is referenced by VR. 9: Time required for VOUT to reach 95% of VR (output voltage setting), after VSHDN is switched from 0 to VIN. DS21663C-page 2 © 2006 Microchip Technology Inc. TC2054/2055/2186 ELECTRICAL SPECIFICATIONS (CONTINUED) Electrical Specifications: Unless otherwise noted, VIN = VR + 1V, IL = 100 µA, CL = 3.3 µF, SHDN > VIH, TA = +25°C. BOLDFACE type specifications apply for junction temperature of -40°C to +125°C. Parameter Sym Min Typ Max Units Conditions Output Noise eN — 600 — nV / √Hz IL = IOUTMAX, F = 10 kHz Response Time (from Shutdown Mode) tR — 60 — µs VIN = 4V CIN = 1 µF, COUT = 10 µF IL = 0.1 mA, Note 9 SHDN Input High Threshold VIH 60 — — %VIN VIN = 2.5V to 6.0V SHDN Input Low Threshold VIL — — 15 %VIN VIN = 2.5V to 6.0V Minimum VIN Operating Voltage VINMIN 1.0 — — V Output Logic Low Voltage VOL — — 400 mV ERROR Threshold Voltage VTH SHDN Input ERROR OUTPUT IOL = 0.1 mA 1 mA Flows to ERROR, IOL = 1 mA, VIN = 2V — 0.95 x VR — V ERROR Positive Hysteresis VHYS — 50 — mV Note 8 See Figure 4-2 VOUT to ERROR Delay tDELAY — 2 — ms VOUT from VR = 3V to 2.8V Resistance from ERROR to GND RERROR — 126 — Ω VDD = 2.5V, VOUT = 2.5V Note 1: The minimum VIN has to meet two conditions: VIN = 2.7V and VIN = VR + VDROPOUT. 2: VR is the regulator output voltage setting. For example: VR = 1.8V, 2.7V, 2.8V, 2.85V, 3.0V, 3.3V. 3: TCVOUT = 6 ( V OUTMAX – V OUTMIN ) × 10 ----------------------------------------------------------------------------------------V OUT × ΔT 4: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 1.0mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. 5: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value at a 1V differential. 6: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to IMAX at VIN = 6V for T = 10 ms. 7: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e. TA, TJ, θJA). 8: Hysteresis voltage is referenced by VR. 9: Time required for VOUT to reach 95% of VR (output voltage setting), after VSHDN is switched from 0 to VIN. TEMPERATURE CHARACTERISTICS Electrical Specifications: Unless otherwise noted, VDD = +2.7V to +6.0V and VSS = GND. Parameters Sym Min Typ Max Units Extended Temperature Range TA -40 — +125 °C Operating Temperature Range TA -40 — +125 °C Storage Temperature Range TA -65 — +150 °C θJA — 255 — °C/W Conditions Temperature Ranges: Thermal Package Resistances: Thermal Resistance, 5L-SOT-23 © 2006 Microchip Technology Inc. DS21663C-page 3 TC2054/2055/2186 2.0 TYPICAL PERFORMANCE CURVES Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Note: Unless otherwise indicated, VIN = VR + 1V, IL = 100 µA, COUT = 3.3 µF, SHDN > VIH, TA = +25°C. 0 VINDC = 4V VINAC = 100mVp-p VOUTDC = 3V -20 PSRR (dB) PSRR (dB) -20 0 IOUT = 100µA COUT = 1 µF Ceramic -40 -60 -40 -60 -80 -80 -100 VINDC = 4V VINAC = 100 mVp-p VOUTDC = 3V -100 10 10 100 100 1000 1,000 10k 10,000 100k 100,000 1M 1,000,000 IOUT = 150 mA COUT = 10 µF Ceramic 10 10 100 100 1000 1,000 FIGURE 2-1: Ratio. 0 0 -20 -40 -60 -80 -100 FIGURE 2-4: Ratio. PSRR (dB) PSRR (dB) Power Supply Rejection VINDC = 4V VINAC = 100 mVp-p VOUTDC = 3V -20 1,000 1000 10,000 10k 100,000 100k VINDC = 4V VINAC = 100 mVp-p VOUTDC = 3V -60 1,000,000 1M IOUT = 150 mA COUT = 10 µF Tantalum 10 10 100 100 1000 1,000 Power Supply Rejection FIGURE 2-5: Ratio. 0.100 COUT = 1µF DOV (V) Noise (µV/ √Hz) Power Supply Rejection 0.120 1 0.1 0.01 DS21663C-page 4 1M 1,000,000 VOUT = 1.8V 0.140 FIGURE 2-3: 100k 100,000 0.160 10 0.001 0.01 10k 10,000 f (Hz) f (Hz) FIGURE 2-2: Ratio. 1M 1,000,000 -40 -100 100 100 100k 100,000 Power Supply Rejection -80 IOUT = 150 mA COUT = 1 µF Ceramic 10 10 10k 10,000 f (Hz) f (Hz) T = 25°C T = 130°C 0.080 T = -45°C 0.060 0.040 0.020 0.1 1 10 Frequency (kHz) 100 1000 Output Noise vs. Frequency. 0.000 0 FIGURE 2-6: 50 100 150 ILOAD (mA) Dropout Voltage vs. ILOAD. © 2006 Microchip Technology Inc. TC2054/2055/2186 Note: Unless otherwise indicated, VIN = VR + 1V, IL = 100 µA, COUT = 3.3 µF, SHDN > VIH, TA = +25°C. 65.00 1.9 VOUT = 1.8V 1.88 63.00 1.86 1.84 59.00 VOUT (V) IDD (µA) 61.00 VIN = 2.8V 1.82 VIN = 2.8V 1.8 1.78 57.00 1.76 1.74 55.00 1.72 1.7 53.00 -45 5 55 105 0 155 15 30 45 60 FIGURE 2-7: FIGURE 2-10: Current. IDD vs. Temperature. 2.9 120 135 150 Output Voltage vs. Output Temp = +130˚C 2.8 VIN = 6.0V VIN = 3.8V 2.75 VOUT (V) 2.75 VOUT (V) 105 VOUT = 2.8V IOUT = 0.1mA 2.85 VIN = 6.5V 2.8 2.7 2.65 Temp = +25˚C Temp = -45˚C 2.7 2.65 2.6 2.6 2.55 2.55 2.5 2.5 -50 -35 -20 -5 10 25 40 55 70 85 100 115 130 145 3.5 4 4.5 5 FIGURE 2-8: Temperature. Output Voltage vs. FIGURE 2-11: Voltage. 1.9 6 6.5 7 Output Voltage vs. Supply 1.9 VOUT = 1.8V IOUT = 0.1mA 1.88 5.5 VIN (V) Temperature (˚C) VOUT = 1.8V IOUT = 0.1mA 1.88 1.86 1.86 1.84 VIN = 6.0V 1.84 VIN = 6.5V 1.82 VOUT (V) VOUT (V) 90 2.9 VOUT = 2.8V IOUT = 0.1mA 2.85 75 ILOAD (mA) Temperature (°C) 1.8 1.78 VIN = 2.8V Temp = +130˚C 1.82 1.8 1.78 Temp = +25˚C Temp = -45˚C 1.76 1.76 1.74 1.74 1.72 1.72 1.7 1.7 -50 -35 -20 -5 10 25 40 55 70 85 100 115 130 145 2.7 3.2 FIGURE 2-9: Temperature. Output Voltage vs. © 2006 Microchip Technology Inc. 3.7 4.2 4.7 5.2 5.7 6.2 6.7 VIN (V) Temperature (˚C) FIGURE 2-12: Voltage. Dropout Voltage vs. Supply DS21663C-page 5 TC2054/2055/2186 Note: Unless otherwise indicated, VIN = VR + 1V, IL = 100 µA, COUT = 3.3 µF, SHDN > VIH, TA = +25°C. V IN = 3.8V VOUT = 2.8V C IN = 1 µF Ceramic V IN = 3.0V VOUT = 2.8V C IN = 1µF Ceramic C OUT= 1 µF Ceramic C OUT= 10µF Ceramic Frequency = 10KHz Frequency = 1 KHz V OUT 100mV/DIV V OUT 100mV / DIV Load Current Load Current 150mA Load 100µA FIGURE 2-13: Load Transient Response. 150mA Load 100µA FIGURE 2-16: Load Transient Response. Load Transient Response in Dropout Mode V IN = 4.0V VOUT = 3.0V C OUT = 10μF C BYP = 0.01μF I OUT = 100µA VOUT 100mV/DIV V SHDN 150mA VIN = 3.105V VOUT = 3.006V CIN = 1µF Ceramic COUT = 1µF Ceramic RLOAD = 20Ω FIGURE 2-14: Dropout Mode. 100µA V OUT Load Transient Response in FIGURE 2-17: VOUT = 2.8V C OUT= 1μF Ceramic C BYP = 470pF I OUT= 100μA Shutdown Delay. V SHDN 50mV / DIV V OUT 2V / DIV Input Voltage V OUT 6V 4V V IN = 4.0V VOUT = 3.0V C OUT = 10μF C BYP = 0.01μF I OUT = 100µA FIGURE 2-15: DS21663C-page 6 Line Transient Response. FIGURE 2-18: Shutdown Wake-up Time. © 2006 Microchip Technology Inc. TC2054/2055/2186 Note: Unless otherwise indicated, VIN = VR + 1V, IL = 100 µA, COUT = 3.3 µF, SHDN > VIH, TA = +25°C. RPULLUP = 100kΩ IOUT = 0.3mA VIN 1V/Div 3.42V 2.8V VOUT 1V/Div 3.0V 2.8V VERROR 2V/Div 0V FIGURE 2-19: VOUT to ERROR Delay. © 2006 Microchip Technology Inc. DS21663C-page 7 TC2054/2055/2186 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. TABLE 3-1: Pin Number 3.1 PIN FUNCTION TABLE Symbol Description Unregulated supply input. 1 VIN 2 GND 3 SHDN Shutdown control input. The regulator is fully enabled when a logic high is applied to this input. The regulator enters shutdown when a logic low is applied to this input. During shutdown, output voltage falls to zero, ERROR is open circuited and supply current is reduced to 0.5µA (max). 4 ERROR Out-of-Regulation Flag. (Open-drain output). This output goes low when VOUT is out-of-tolerance by approximately -5%. 5 VOUT Ground terminal. Regulated voltage output. Unregulated Supply Input (VIN) 3.4 Out-of-Regulation Flag (ERROR) Connect the unregulated input supply to the VIN pin. If there is a large distance between the input supply and the LDO regulator, some input capacitance is necessary for proper operation. A 1 µF capacitor, connected from VIN to ground, is recommended for most applications. The open-drain ERROR flag provides indication that the regulator output voltage is not in regulation. The ERROR pin will be low when the output is typically below 5% of its specified value. 3.2 Connect the output load to VOUT of the LDO. Also connect one side of the LDO output decoupling capacitor as close as possible to the VOUT pin. Ground Terminal (GND) Connect the unregulated input supply ground return to GND. Also connect one side of the 1 µF typical input decoupling capacitor close to this pin and one side of the output capacitor COUT to this pin. 3.3 3.5 Regulated Voltage Output (VOUT) Shutdown Control Input (SHDN) The regulator is fully enabled when a logic-high is applied to SHDN. The regulator enters shutdown when a logic-low is applied to this input. During shutdown, the output voltage falls to zero and the supply current is reduced to 0.5 µA (max). DS21663C-page 8 © 2006 Microchip Technology Inc. TC2054/2055/2186 4.0 DETAILED DESCRIPTION The TC2054, TC2055 and TC2186 are precision fixed output voltage regulators. (If an adjustable version is desired, refer to the TC1070/TC1071/TC1187 data sheet (DS21353). Unlike bipolar regulators, the TC2054, TC2055 and TC2186 supply current does not increase with load current. In addition, VOUT remains stable and within regulation over the entire 0 mA to maximum output current operating load range. Figure 4-1 shows a typical application circuit. The regulator is enabled any time the shutdown input (SHDN) is at or above VIH, and shutdown (disabled) when SHDN is at or below VIL. SHDN may be controlled by a CMOS logic gate, or I/O port of a microcontroller. If the SHDN input is not required, it should be connected directly to the input supply. While in shutdown, supply current decreases to 0.05 µA (typical), VOUT falls to zero volts, and ERROR is open-circuited. VIN VOUT VOUT 1 µF C1 1 µF BATTERY TC2054 GND TC2055 TC2186 V+ SHDN Shutdown Control (to CMOS Logic or Tie to VIN if unused) FIGURE 4-1: 4.1 ERROR C2 Required Only if ERROR is used as a Processor RESET Signal (See Text) R1 1MΩ 0.2 µF C2 BATTLOW or RESET Typical Application Circuit. ERROR Open-Drain Output ERROR is driven low whenever VOUT falls out of regulation by more than -5% (typical). This condition may be caused by low input voltage, output current limiting or thermal limiting. The ERROR threshold is 5% below rated VOUT regardless of the programmed output voltage value (e.g. ERROR = VOL at 4.75V (typ.) for a 5.0V regulator and 2.85V (typ.) for a 3.0V regulator). ERROR output operation is shown in Figure 4-2. VOUT HYSTERESIS (VHYS) VTH ERROR VIH VOL FIGURE 4-2: 4.2 Error Output Operation. Output Capacitor A 1 µF (min) capacitor from VOUT to ground is required. The output capacitor should have an effective series resistance of 0.01Ω. to 5Ω for VOUT = 2.5V, and 0.05Ω. to 5Ω for VOUT < 2.5V. Ceramic, tantalum and aluminum electrolytic capacitors can be used. (Since many aluminum electrolytic capacitors freeze at approximately -30°C, solid tantalums are recommended for applications operating below -25°C). When operating from sources other than batteries, supply-noise rejection and transient response can be improved by increasing the value of the input and output capacitors and employing passive filtering techniques. 4.3 Input Capacitor A 1 µF capacitor should be connected from VIN to GND if there is more than 10 inches of wire between the regulator and this AC filter capacitor, or if a battery is used as the power source. Aluminum electrolytic or tantalum capacitors can be used (since many aluminum electrolytic capacitors freeze at approximately -30°C, solid tantalum are recommended for applications operating below -25°C). When operating from sources other than batteries, supply-noise rejection and transient response can be improved by increasing the value of the input and output capacitors and employing passive filtering techniques. Note that ERROR is active when VOUT falls to VTH, and inactive when VOUT rises above VTH by VHYS. As shown in Figure 4-1, ERROR can be used as a battery low flag or as a processor RESET signal (with the addition of timing capacitor C2). R1 x C2 should be chosen to maintain ERROR below VIH of the processor RESET input for at least 200 ms to allow time for the system to stabilize. Pull-up resistor R1 can be tied to VOUT, VIN or any other voltage less than (VIN + 0.3V). The ERROR pin sink current is self-limiting to approximately 18 mA. © 2006 Microchip Technology Inc. DS21663C-page 9 TC2054/2055/2186 5.0 THERMAL CONSIDERATIONS 5.1 Thermal Shutdown Integrated thermal protection circuitry shuts the regulator off when the die temperature exceeds approximately 160°C. The regulator remains off until the die temperature cools to approximatley 150°C. 5.2 Equation 5-1 can be used in conjunction with Equation 5-2 to ensure regulator thermal operation is within limits. For example: Given: = 2.7V – 2.5% TAMAX = +55°C Find: 1. Actual power dissipation Equation 5-1 is used to calculate worst case power dissipation: EQUATION 5-1: = 3.0V +10% VOUTMIN ILOADMAX = 40 mA Power Dissipation The amount of power the regulator dissipates is primarily a function of input and output voltage, and output current. VINMAX 2. Maximum allowable dissipation Actual power dissipation: P D ≈ ( V INMAX – V OUTMIN )I LOADMAX P D = ( V INMAX – V OUTMIN )I LOADMAX = [ ( 3.0 × 1.1 ) – ( 2.7 × 0.975 ) ]40 × 10 Where: PD = Worst-case actual power dissipation VINMAX = Maximum voltage on VIN VOUTMIN = Minimum regulator output voltage = 26.7mW Maximum allowable power dissipation: T JMAX – T AMAX P DMAX = -------------------------------------θ JA ILOADMAX = Maximum output (load) current The maximum allowable power dissipation (Equation 5-2) is a function of the maximum ambient temperature (TAMAX), the maximum allowable die temperature (125 °C) and the thermal resistance from junction-to-air (θJA). The 5-Pin SOT-23A package has a θJA of approximately 220°C/Watt when mounted on a typical two layer FR4 dielectric copper clad PC board. EQUATION 5-2: T JMAX – T AMAX P DMAX = -------------------------------------θ JA Where all terms are previously defined. DS21663C-page 10 –3 – 55= 125 -------------------220 = 318mW In this example, the TC2054 dissipates a maximum of only 26.7 mW; far below the allowable limit of 318 mW. In a similar manner, Equation 5-1 and Equation 5-2 can be used to calculate maximum current and/or input voltage limits. 5.3 Layout Considerations The primary path of heat conduction out of the package is via the package leads. Therefore, layouts having a ground plane, wide traces at the pads, and wide power supply bus lines combine to lower θJA and, therefore, increase the maximum allowable power dissipation limit. © 2006 Microchip Technology Inc. TC2054/2055/2186 6.0 PACKAGING INFORMATION 6.1 Package Marking Information TABLE 6-1: (V) cdef c & d represents part number code + temperature range and voltage e represents year and 2-month period code f represents lot ID number 6.2 PART NUMBER CODE AND TEMPERATURE RANGE TC2054 TC2055 TC2186 1.8 SA TA VA 2.5 SB TB VB 2.7 SC TC VC 2.8 SD TD VD 2.85 SE TE VE 3.0 SF TF VF 5.0 SJ TG VG Taping Information Component Taping Orientation for 5-Pin SOT-23A (EIAJ SC-74A) Devices User Direction of Feed Device Marking W PIN 1 P Standard Reel Component Orientation for 713 Suffix Device (Mark Right Side Up) Carrier Tape, Number of Components Per Reel and Reel Size: Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 8 mm 4 mm 3000 7 in. 5-Pin SOT-23A © 2006 Microchip Technology Inc. DS21663C-page 11 TC2054/2055/2186 5-Lead Plastic Small Outline Transistor (CT) (SOT-23) E E1 p B p1 n D 1 α c A φ L β A1 INCHES* Units Dimension Limits A2 MIN MILLIMETERS NOM MAX MIN NOM Pitch n p .038 0.95 Outside lead pitch (basic) p1 .075 1.90 Number of Pins Overall Height 5 MAX 5 A .035 .046 .057 0.90 1.18 1.45 Molded Package Thickness A2 .035 .043 .051 0.90 1.10 1.30 Standoff A1 .000 .003 .006 0.00 0.08 0.15 Overall Width E .102 .110 .118 2.60 2.80 3.00 Molded Package Width E1 .059 .064 .069 1.50 1.63 1.75 Overall Length D .110 .116 .122 2.80 2.95 3.10 Foot Length .014 .018 .022 0.35 0.45 Foot Angle L f Lead Thickness c .004 Lead Width B a .014 Mold Draft Angle Top Mold Draft Angle Bottom b 0 5 .006 .017 10 0 0.55 5 .008 0.09 0.15 .020 0.35 0.43 10 0.20 0.50 0 5 10 0 5 10 0 5 10 0 5 10 * Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side. EIAJ Equivalent: SC-74A Revised 09-12-05 Drawing No. C04-091 DS21663C-page 12 © 2006 Microchip Technology Inc. TC2054/2055/2186 APPENDIX A: REVISION HISTORY Revision C (May 2006) • Page 1: Added overtemperature to bullet for overcurrent protection in features and general description verbiage. • Page 3: Added “Thermal Shutdown Die Temperature” to electrical characteristics table. Changed codition for “Minimum VIN Operating Voltage” • Page 3: Added Thermal Characteristics Table. • Page 5: Added new section 5.1 and new verbiage. • Page 13: Updated package outline drawing. Revision B (May 2002) • Data Sheet converted to Microchip standards. Revision A (May 2001) • Original Release of this Document under Telcom. © 2006 Microchip Technology Inc. DS21663C-page 13 TC2054/2055/2186 NOTES: DS21663C-page 14 © 2006 Microchip Technology Inc. TC2054/2055/2186 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. -XX X XXXX Device Output Voltage Temperature Range Package Device: TC2054: TC2055: TC2186: 50 mA LDO with Shutdown and ERROR Output 100 mA LDO with Shutdown and ERROR Output 150 mA LDO with Shutdown and ERROR Output Output Voltage: XX XX XX XX XX XX XX = = = = = = = Temperature Range: V = -40°C to +125°C Package: CTTR = Plastic Small Outline Transistor (SOT-23), 5-lead, Tape and Reel 1.8V 2.5V 2.7V 2.8V 2.85V 3.0V 3.3V © 2006 Microchip Technology Inc. Examples: a) TC2054-1.8VCTTR: 5LD SOT-23-A, 1.8V, Tape and Reel. b) TC2054-2.85VCTTR: 5LD SOT-23-A, 2.85V, Tape and Reel. c) TC2054-3.3VCTTR: 5LD SOT-23-A, 3.3V, Tape and Reel. a) TC2055-1.8VCTTR: 5LD SOT-23-A, 1.8V, Tape and Reel. b) TC2055-2.85VCTTR: 5LD SOT-23-A, 2.85V, Tape and Reel. c) TC2055-3.0VCTTR: 5LD SOT-23-A, 3.0V, Tape and Reel. a) TC2186-1.8VCTTR: 5LD SOT-23-A, 1.8V, Tape and Reel. b) TC2186-2.8VCTTR: 5LD SOT-23-A, 2.8V, Tape and Reel. DS21663C-page 15 TC2054/2055/2186 NOTES: DS21663C-page 16 © 2006 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Linear Active Thermistor, Mindi, MiWi, MPASM, MPLIB, MPLINK, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2006, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona, Gresham, Oregon and Mountain View, California. The Company’s quality system processes and procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. © 2006 Microchip Technology Inc. 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