BAT48 Series Small signal Schottky diodes Main product characteristics IF 350 mA VRRM 40 V C (typ) 18 pF Tj (max) 150° C BAT48ZFILM (Single) SOD-123 Features and benefits BAT48JFILM (Single) ■ Low leakage current losses ■ Negligible switching losses ■ Low forward and reverse recovery times ■ Extremely fast switching ■ Surface mount device ■ Low capacitance diode SOD-323 Configurations in top view Order codes Description The BAT48 series uses 40 V Schottky barrier diodes packaged in SOD-123 or SOD-323. This series is general purpose and features very low turn-on voltage and fast switching Table 1. IF BAT48ZFILM Z48 BAT48JFILM 48 Parameter Value Unit Repetitive peak reverse voltage 40 V Continuous forward current 350 mA 2 A -65 to +150 °C 150 °C IFSM Surge non repetitive forward current Tstg Storage temperature range Tj Marking Absolute ratings (limiting values at Tj = 25° C, unless otherwise specified) Symbol VRRM Part Number tp = 10 ms Sinusoidal Maximum operating junction temperature August 2006 Rev 1 1/8 www.st.com Characteristics BAT48 Series 1 Characteristics Table 2. Thermal parameters Symbol Rth(j-a) Parameter Value Junction to ambient(1) SOD-123 500 SOD-323 550 Unit °C/W 1. Epoxy printed circuit board with recommended pad layout Table 3. Symbol VBR Static electrical characteristics Parameter Breakdown reverse voltage Test conditions Tj = 25° C Tj = 25° C IR(1) Reverse leakage current Tj = 60° C VF(2) Forward voltage drop Tj = 25° C Ir = 25 µA Min. Typ Max. 40 Unit V VR = 1.5 V 1 VR = 10 V 2 VR = 20 V 5 VR = 40 V 25 VR = 1.5 V 10 VR = 10 V 15 VR = 20 V 25 VR = 40 V 50 µA IF = 0.1 mA 0.25 IF = 1 mA 0.3 IF = 10 mA 0.4 IF = 50 mA 0.5 IF = 200 mA 0.75 IF = 500 mA 0.9 V 1. Pulse test: tp = 5 ms, δ < 2 % 2. Pulse test: tp = 380 µs, δ < 2 % Table 4. Dynamic characteristics Symbol Parameter C 2/8 Diode capacitance Test conditions Min. Typ VR = 0 V, F = 1 MHz 30 VR = 1 V, F = 1 MHz 18 Max. Unit pF BAT48 Series Figure 1. Characteristics Average forward power dissipation Figure 2. versus average forward current Average forward current versus ambient temperature (δ = 1) IF(AV)(A) P(W) 0.40 0.30 δ = 0.05 0.25 δ = 0.1 δ = 0.2 δ = 0.5 0.35 0.30 0.20 δ=1 0.25 0.15 0.20 0.15 0.10 0.10 T T 0.05 0.05 IF(AV)(A) δ=tp/T 0.00 0.00 0.05 Figure 3. 0.10 0.15 0.20 0.25 0.30 δ=tp/T tp 0.00 0.35 0.40 Reverse leakage current versus reverse applied voltage (typical values) 0 25 Figure 4. IR(µA) Tamb(°C) tp 50 75 100 125 150 Reverse leakage current versus junction temperature (typical values) IR(µA) 1.E+04 1.E+04 VR=40V 1.E+03 Tj=125°C 1.E+03 Tj=100°C 1.E+02 1.E+02 Tj=75°C 1.E+01 1.E+01 Tj=50°C 1.E+00 1.E+00 Tj=25°C Tj(°C) VR(V) 1.E-01 0 5 Figure 5. 10 15 20 1.E-01 25 30 35 0 40 Junction capacitance versus reverse applied voltage (typical values) Figure 6. C(pF) 25 50 75 100 125 Forward voltage drop versus forward current (typical values) IFM(A) 35 1.E+00 F=1MHz VOSC=30mVRMS Tj=25°C 30 1.E-01 25 Tj=125°C 20 Tj=25°C 1.E-02 15 10 1.E-03 5 VFM(V) VR(V) 1.E-04 0 0 5 10 15 20 25 30 35 40 0.0 0.2 0.4 0.6 0.8 1.0 3/8 Ordering information scheme Figure 7. BAT48 Series Relative variation of thermal impedance junction to ambient versus pulse duration (epoxy FR4 with recommended pad layout, eCU = 35 µm) (SOD-323) Figure 8. Thermal resistance junction to ambient versus copper surface under each lead (printed circuit board, epoxy FR4, eCU=35 µm, SOD-323) Rth(j-a)(°C/W) Zth(j-a)/Rth(j-a) 600 1.00 550 SOD-323 Epoxy FR4 SCU = 2.25 mm2 eCU = 35 µm 0.10 500 Single pulse 450 400 350 tp(s) 0.01 1.E-02 2 SCU(mm²) 300 1.E-01 1.E+00 1.E+01 1.E+02 5 10 Ordering information scheme BAT48 Signal Schottky diodes VRRM = 40 V Configuration No letter = Single diode Package J = SOD-323 Z = SOD-123 Packing FILM = Tape and reel 4/8 0 xx xx FILM 15 20 25 30 35 40 45 50 BAT48 Series 3 Package information Package information Epoxy meets UL94, V0 Table 5. SOD-123 dimensions Dimensions Ref. H Millimeters Inches A2 A1 b Min. A E D A c Max. Min. 1.45 Max. 0.057 A1 0 0.1 0 0.004 A2 0.85 1.35 0.033 0.053 b 0.55 Typ. 0.022 Typ. c 0.15 Typ. 0.039 Typ. D 2.55 2.85 0.1 0.112 E 1.4 1.7 0.055 0.067 G 0.25 H 3.55 G Figure 9. 0.01 3.95 0.14 0.156 SOD-123 footprint (dimensions in mm) 4.45 0.65 0.97 2.51 0.97 5/8 Package information Table 6. BAT48 Series SOD-323 dimensions Dimensions H A1 Ref. b Millimeters Min. E A A D c Q1 L Max. Inches Min. 1.17 Max. 0.046 A1 0 0.1 0 0.004 b 0.25 0.44 0.01 0.017 c 0.1 0.25 0.004 0.01 D 1.52 1.8 0.06 0.071 E 1.11 1.45 0.044 0.057 H 2.3 2.7 0.09 0.106 L 0.1 0.46 0.004 0.02 Q1 0.1 0.41 0.004 0.016 Figure 10. SOD-323 footprint (dimensions in mm) 3.20 0.54 1.06 1.08 1.06 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 6/8 BAT48 Series 4 5 Ordering information Ordering information Part Number Marking Package Weight Base qty Delivery mode BAT48ZFILM Z48 SOD-123 Single 10 mg 3000 Tape and reel BAT48JFILM 48 SOD-323 Single 5 mg 3000 Tape and reel Revision history Date Revision 08-Aug-2006 1 Description of Changes Initial release. 7/8 BAT48 Series Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. 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