STMICROELECTRONICS STGP3NB60HDFP

STGP3NB60HD - STGP3NB60HDFP
STGB3NB60HD
N-CHANNEL 3A - 600V - TO-220/TO-220FP/D2PAK
PowerMESH™ IGBT
TYPE
VCES
VCE(sat) (Max)
@25°C
IC(#)
@100°C
STGB3NB60HD
STGP3NB60HD
STGP3NB60HDFP
600 V
600 V
600 V
< 2.8 V
< 2.8 V
< 2.8 V
6A
6A
6A
■
■
■
■
■
■
HIGH INPUT IMPEDANCE (VOLTAGE DRIVEN)
LOW GATE CHARGE
HIGH FREQUENCY OPERATION
HIGH CURRENT CAPABILITY
OFF LOSSES INCLUDE TAIL CURRENT
CO-PACKAGED WITH TURBOSWITCH™
ANTIPARALLEL DIODE
3
1
3
2
1
TO-220
2
TO-220FP
3
1
D2PAK
INTERNAL SCHEMATIC DIAGRAM
DESCRIPTION
Using the latest high voltage technology based on a
patented strip layout, STMicroelectronics has designed an advanced family of IGBTs, the PowerMESH™ IGBTs, with outstanding perfomances.
The suffix "H" identifies a family optimized for high
frequency applications (up to 50kHz)in order to
achieve very high switching performances (reduced
tfall) mantaining a low voltage drop.
APPLICATIONS
HIGH FREQUENCY MOTOR CONTROLS
■ SMPS and PFC IN BOTH HARD SWITCH AND
RESONANT TOPOLOGIES
■
ORDERING INFORMATION
SALES TYPE
MARKING
PACKAGE
PACKAGING
STGB3NB60HDT4
GB3NB60HD
D2PAK
TAPE & REEL
STGP3NB60HD
GP3NB60HD
TO-220
TUBE
STGP3NB60HDFP
GP3NB60HDFP
TO-220FP
TUBE
September 2003
1/12
STGP3NB60HD - STGP3NB60HDFP - STGB3NB60HD
ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Value
STGP3NB60HD
STGB3NB60HD
Unit
STGP3NB60HDFP
VCES
Collector-Emitter Voltage (VGS = 0)
600
V
VGE
Gate-Emitter Voltage
± 20
V
IC
Collector Current (continuous) at TC = 25°C (#)
10
A
IC
Collector Current (continuous) at TC = 100°C (#)
6
A
Collector Current (pulsed)
24
A
ICM ()
PTOT
Tstg
Tj
Total Dissipation at TC = 25°C
50
25
W
Derating Factor
0.4
0.2
W/°C
Storage Temperature
–55 to 150
Operating Junction Temperature
°C
() Pulse width limited by safe operating area
THERMAL DATA
TO-220/D2PAK
Rthj-case
Thermal Resistance Junction-case Max
Rthj-amb
Thermal Resistance Junction-ambient Max
TO-220FP
2.5
5
°C/W
62.5
°C/W
ELECTRICAL CHARACTERISTICS (TCASE = 25 °C UNLESS OTHERWISE SPECIFIED)
OFF
Symbol
VBR(CES)
ICES
IGES
Parameter
Test Conditions
Min.
Typ.
Max.
Collector-Emitter Breakdown
Voltage
IC = 250 µA, VGE = 0
Collector cut-off
(VGE = 0)
VCE = Max Rating, TC = 25 °C
50
µA
VCE = Max Rating, TC = 125 °C
100
µA
VGE = ±20V , VCE = 0
±100
nA
Max.
Unit
5
V
2.8
V
Gate-Emitter Leakage
Current (VCE = 0)
600
Unit
V
ON (1)
Symbol
Parameter
VGE(th)
Gate Threshold Voltage
VCE(sat)
Collector-Emitter Saturation
Voltage
(#) Calculated according to the iterative formula:
T JMAX – T C
I C ( T C ) = -------------------------------------------------------------------------------------R THJ – C × VCESAT ( MAX )(T C, I C)
2/12
Test Conditions
VCE = VGE, IC = 250µA
Min.
Typ.
3
VGE = 15V, IC = 3 A
2.4
VGE = 15V, IC = 3 A, Tj =125°C
1.9
V
STGP3NB60HD - STGP3NB60HDFP - STGB3NB60HD
ELECTRICAL CHARACTERISTICS (CONTINUED)
DYNAMIC
Symbol
gfs
Parameter
Forward Transconductance
Test Conditions
Min.
VCE = 25 V , IC =3 A
Cies
Coes
Cres
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
VCE = 25V, f = 1 MHz, VGE = 0
Qg
Qge
Qgc
Total Gate Charge
Gate-Emitter Charge
Gate-Collector Charge
VCE = 480V, IC = 3 A,
VGE = 15V
ICL
Latching Current
Vclamp = 480 V , Tj = 125°C
RG = 10 Ω
Typ.
Max.
Unit
2.4
S
235
33
6.6
pF
pF
pF
21
6
7.6
27
12
nC
nC
nC
A
SWITCHING ON
Symbol
td(on)
tr
(di/dt)on
Eon
Parameter
Test Conditions
Turn-on Delay Time
Rise Time
VCC = 480 V, IC = 3 A
RG = 10Ω , VGE = 15 V
Turn-on Current Slope
Turn-on Switching Losses
VCC= 480 V, IC = 3 A RG=10Ω
VGE = 15 V,Tj = 125°C
Min.
Typ.
Max.
Unit
5
11
ns
ns
400
77
A/µs
µJ
SWITCHING OFF
Symbol
tc
Parameter
Cross-over Time
Unit
ns
53
ns
Fall Time
77
ns
Turn-off Switching Loss
33
µJ
Total Switching Loss
110
µJ
180
ns
82
ns
Delay Time
tc
Max.
36
Off Voltage Rise Time
Ets
Vcc = 480 V, IC =3 A,
RGE = 10 Ω , VGE = 15 V
Typ.
ns
td(off)
Eoff(**)
Min.
76
tr(Voff)
tf
Test Conditions
Cross-over Time
Vcc = 480 V, IC = 3 A,
RGE = 10 Ω , VGE = 15 V
Tj = 125 °C
tr(Voff)
Off Voltage Rise Time
td(off)
Delay Time
58
ns
Fall Time
110
ns
Turn-off Switching Loss
88
µJ
Total Switching Loss
165
µJ
tf
Eoff(**)
Ets
Note: 1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.
2. Pulse width limited by max. junction temperature.
(**)Losses include Also the Tail (Jedec Standardization)
COLLECTOR-EMITTER DIODE
Symbol
Parameter
Test Conditions
Min.
Typ.
Ifm
Forward Current
Forward Current pulsed
Vf
Forward On-Voltage
If = 3 A
If = 3 A, Tj = 125 °C
1.6
1.4
Reverse Recovery Time
Reverse Recovery Charge
Reverse Recovery Current
If = 3 A ,VR = 35 V,
Tj =125°C, di/dt = 100 A/µs
45
70
2.7
If
trr
Qrr
Irrm
Max.
Unit
3
24
A
A
2.0
V
V
ns
nC
A
3/12
STGP3NB60HD - STGP3NB60HDFP - STGB3NB60HD
Thermal Impedance for TO-220/D2PAK
Thermal Impedance for TO-220FP
Output Characteristics
Transfer Characteristics
Transconductance
Collector-Emitter On Voltage vs Temperature
4/12
STGP3NB60HD - STGP3NB60HDFP - STGB3NB60HD
Collector-Emitter On Voltage vs Collettor Current
Gate Threshold vs Temperature
Normalized Breakdown Voltage vs Temperature
Capacitance Variations
Gate Charge vs Gate-Emitter Voltage
Total Switching Losses vs Gate Resistance
5/12
STGP3NB60HD - STGP3NB60HDFP - STGB3NB60HD
Total Switching Losses vs Temperature
Emitter-collector Diode Characteristics
Total Switching Losses vs Collector Current
Switching Off Safe Operating Area
6/12
STGP3NB60HD - STGP3NB60HDFP - STGB3NB60HD
Fig. 1: Gate Charge test Circuit
Fig. 2: Test Circuit For Inductive Load Switching
7/12
STGP3NB60HD - STGP3NB60HDFP - STGB3NB60HD
TO-220 MECHANICAL DATA
DIM.
8/12
mm.
MIN.
TYP
inch
MAX.
MIN.
4.60
0.173
TYP.
MAX.
A
4.40
0.181
b
0.61
0.88
0.024
0.034
b1
1.15
1.70
0.045
0.066
c
0.49
0.70
0.019
0.027
D
15.25
15.75
0.60
0.620
E
10
10.40
0.393
0.409
e
2.40
2.70
0.094
0.106
e1
4.95
5.15
0.194
0.202
F
1.23
1.32
0.048
0.052
H1
6.20
6.60
0.244
0.256
J1
2.40
2.72
0.094
0.107
L
13
14
0.511
0.551
L1
3.50
3.93
0.137
0.154
L20
16.40
L30
28.90
0.645
1.137
øP
3.75
3.85
0.147
0.151
Q
2.65
2.95
0.104
0.116
STGP3NB60HD - STGP3NB60HDFP - STGB3NB60HD
TO-220FP MECHANICAL DATA
mm.
DIM.
MIN.
A
4.4
inch
TYP
MAX.
MIN.
TYP.
4.6
0.173
0.181
MAX.
0.106
B
2.5
2.7
0.098
D
2.5
2.75
0.098
0.108
E
0.45
0.7
0.017
0.027
F
0.75
1
0.030
0.039
F1
1.15
1.7
0.045
0.067
F2
1.15
1.7
0.045
0.067
G
4.95
5.2
0.195
0.204
G1
2.4
2.7
0.094
0.106
H
10
10.4
0.393
L2
0.409
16
0.630
28.6
30.6
1.126
1.204
L4
9.8
10.6
.0385
0.417
L5
2.9
3.6
0.114
0.141
L6
15.9
16.4
0.626
0.645
L7
9
9.3
0.354
0.366
Ø
3
3.2
0.118
0.126
B
D
A
E
L3
L3
L6
F2
H
G
G1
F
F1
L7
L2
L5
1 2 3
L4
9/12
STGP3NB60HD - STGP3NB60HDFP - STGB3NB60HD
D2PAK MECHANICAL DATA
mm.
inch
DIM.
MIN.
TYP
MAX.
MIN.
TYP.
MAX.
A
4.4
4.6
0.173
0.181
A1
2.49
2.69
0.098
0.106
A2
0.03
0.23
0.001
0.009
B
0.7
0.93
0.027
0.036
B2
1.14
1.7
0.044
0.067
C
0.45
0.6
0.017
0.023
C2
1.23
1.36
0.048
0.053
D
8.95
9.35
0.352
0.368
D1
E
8
0.315
10
E1
10.4
0.393
8.5
0.334
G
4.88
5.28
0.192
0.208
L
15
15.85
0.590
0.625
L2
1.27
1.4
0.050
0.055
L3
1.4
1.75
0.055
0.068
M
2.4
3.2
0.094
0.126
R
0.015
0º
4º
3
V2
0.4
10/12
1
STGP3NB60HD - STGP3NB60HDFP - STGB3NB60HD
D2PAK FOOTPRINT
TUBE SHIPMENT (no suffix)*
TAPE AND REEL SHIPMENT (suffix ”T4”)*
REEL MECHANICAL DATA
DIM.
mm
MIN.
A
B
DIM.
mm
inch
MIN.
MAX.
MIN.
A0
10.5
10.7
0.413 0.421
B0
15.7
15.9
0.618 0.626
D
1.5
1.6
0.059 0.063
D1
1.59
1.61
0.062 0.063
E
1.65
1.85
0.065 0.073
MIN.
330
1.5
C
12.8
D
20.2
G
24.4
N
100
T
TAPE MECHANICAL DATA
inch
MAX.
MAX.
12.992
0.059
13.2
0.504 0.520
0795
26.4
0.960 1.039
3.937
30.4
1.197
BASE QTY
BULK QTY
1000
1000
MAX.
F
11.4
11.6
0.449 0.456
K0
4.8
5.0
0.189 0.197
P0
3.9
4.1
0.153 0.161
P1
11.9
12.1
0.468 0.476
P2
1.9
2.1
R
50
1.574
T
0.25
0.35 0.0098 0.0137
0.075 0.082
* on sales type
11/12
STGP3NB60HD - STGP3NB60HDFP - STGB3NB60HD
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the
consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from
its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications
mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information
previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or
systems without express written approval of STMicroelectronics.
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© 2003 STMicroelectronics - Printed in Italy - All Rights Reserved
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