STMICROELECTRONICS STW160N75F3

STB160N75F3
STP160N75F3 - STW160N75F3
N-channel 75V - 3.5mΩ - 120A - TO-220 - TO-247 - D2PAK
MDmesh™ low voltage Power MOSFET
TARGET SPECIFICATION
General features
Type
VDSS
RDS(on)
ID
STB160N75F3
75V
4.2mΩ
120A (1)
STP160N75F3
75V
4.5mΩ
120A (1)
STW160N75F3
75V
4.5mΩ
(1)
3
120A
1
2
TO-220
TO-247
1. Current limited by package
■
Ultra low on-resistance
■
100% Avalanche tested
3
1
D²PAK
Description
This N-channel enhancement mode Power
MOSFET is the latest refinement of
STMicroelectronics unique “Single Feature
Size™“strip-based process with less critical
alignment steps and therefore a remarkable
manufacturing reproducibility. The resulting
transistor shows extremely high packing density
for low on-resistance, rugged avalanche
characteristics and low gate charge.
Internal schematic diagram
Applications
■
Switching application
Order codes
Part number
Marking
Package
Packaging
STB160N75F3
160N75F3
D²PAK
Tape & reel
STP160N75F3
160N75F3
TO-220
Tube
STW160N75F3
160N75F3
TO-247
Tube
February 2007
Rev 1
This is preliminary information on a new product foreseen to be developed. Details are subject to change without notice.
1/13
www.st.com
13
Contents
STB160N75F3 - STP160N75F3 - STW160N75F3
Contents
1
Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3
Test circuit
4
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
5
Packaging mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
6
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2/13
................................................ 6
STB160N75F3 - STP160N75F3 - STW160N75F3
1
Electrical ratings
Electrical ratings
Table 1.
Absolute maximum ratings
Symbol
Parameter
Value
Unit
75
V
VDS
Drain-source voltage (VGS = 0)
VGS
Gate-source voltage
± 20
V
Drain current (continuous) at TC = 25°C
120
A
Drain current (continuous) at TC = 100°C
96
A
Drain current (pulsed)
480
A
Total dissipation at TC = 25°C
315
W
Derating factor
2.1
W/°C
dv/dt
Peak diode recovery voltage slope
Tbd
V/ns
EAS
Single pulse avalanche energy
Tbd
mJ
Tj
Operating junction temperature
Storage temperature
-55 to 175
°C
Value
Unit
ID
(1)
ID (1)
IDM
(2)
PTOT (3)
Tstg
1. Current limited by package
2. Pulse width limited by safe operating area
3. Rated according to Rthj-case
Table 2.
Symbol
Thermal resistance
Parameter
Rthj-case
Thermal resistance junction-case max
0.48
°C/W
Rthj-amb
Thermal resistance junction-ambient max
62.5
°C/W
Tl
Maximum lead temperature for soldering
purpose
300
°C
3/13
Electrical characteristics
2
STB160N75F3 - STP160N75F3 - STW160N75F3
Electrical characteristics
(TCASE=25°C unless otherwise specified)
Table 3.
Symbol
V(BR)DSS
On/off states
Parameter
Drain-source breakdown
voltage
Test conditions
ID = 250µA, VGS= 0
75
V
VDS = Max rating,
VDS = Max rating,@125°C
10
100
µA
µA
Gate body leakage
current
(VDS = 0)
VGS = ±20V
±200
nA
VGS(th)
Gate threshold voltage
VDS= VGS, ID = 250µA
4
V
RDS(on)
Static drain-source on
resistance
VGS= 10V, ID= 60A
4.5
4.2
mΩ
mΩ
IDSS
Zero gate voltage drain
current (VGS = 0)
IGSS
Table 4.
Symbol
Parameter
Test conditions
VDS =15V, ID= 4.5A
Forward
transconductance
Ciss
Input capacitance
Output capacitance
Reverse transfer
capacitance
VDS =25V, f=1 MHz, VGS=0
Total gate charge
Gate-source charge
Gate-drain charge
VGS =10V
Crss
Qg
Qgs
Qgd
2
3.5
3.2
D²PAK
Dynamic
gfs(1)
Coss
ID = 10A
VDD=44V, ID = 60A
(see Figure 2)
1. Pulsed: pulse duration = 300µs, duty cycle 1.5%
4/13
Min. Typ. Max Unit
Min
Typ
Max Unit
Tbd
S
7000
1100
32
pF
pF
pF
110
Tbd
Tbd
Tbd
nC
nC
nC
STB160N75F3 - STP160N75F3 - STW160N75F3
Table 5.
Symbol
td(on)
tr
td(off)
tf
Table 6.
Symbol
ISD
Electrical characteristics
Switching times
Parameter
Turn-on delay time
Rise time
Turn-off delay time
Fall time
Test conditions
RG=4.7Ω, VGS=10V,
(see Figure 4)
Parameter
Test conditions
VSD(2)
Forward on voltage
ISD=120A, VGS=0
Reverse recovery time
Reverse recovery charge
Reverse recovery current
ISD=120A, di/dt =
100A/µs, VDD=30 V,
Tj=150°C
(see Figure 3)
IRRM
Max. Unit
ns
ns
ns
ns
Source drain diode
Source-drain current
Source-drain current (pulsed)
Qrr
Typ.
Tbd
Tbd
Tbd
Tbd
VDD=35 V, ID= 60A,
ISDM(1)
trr
Min.
Min.
Typ.
75
195
5
Max. Unit
120
480
A
A
1.5
V
ns
nC
A
1. Pulse with limited by safe operating area
2. Pulsed: pulse duration = 300µs, duty cycle 1.5%
5/13
Test circuit
STB160N75F3 - STP160N75F3 - STW160N75F3
3
Test circuit
Figure 1.
Switching times test circuit for
resistive load
Figure 3.
Test circuit for inductive load
Figure 4.
switching and diode recovery times
Unclamped inductive load test
circuit
Figure 5.
Unclamped inductive waveform
Switching time waveform
6/13
Figure 2.
Figure 6.
Gate charge test circuit
STB160N75F3 - STP160N75F3 - STW160N75F3
4
Package mechanical data
Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com
7/13
Package mechanical data
STB160N75F3 - STP160N75F3 - STW160N75F3
TO-220 MECHANICAL DATA
DIM.
mm.
MIN.
inch
MAX.
MIN.
TYP.
MAX.
A
4.40
4.60
0.173
0.181
b
0.61
0.88
0.024
0.034
b1
1.15
1.70
0.045
0.066
c
0.49
0.70
0.019
0.027
D
15.25
15.75
0.60
0.620
E
10
10.40
0.393
0.409
e
2.40
2.70
0.094
0.106
e1
4.95
5.15
0.194
0.202
F
1.23
1.32
0.048
0.052
H1
6.20
6.60
0.244
0.256
J1
2.40
2.72
0.094
0.107
0.551
L
13
14
0.511
L1
3.50
3.93
0.137
L20
16.40
L30
8/13
TYP
0.154
0.645
28.90
1.137
øP
3.75
3.85
0.147
0.151
Q
2.65
2.95
0.104
0.116
STB160N75F3 - STP160N75F3 - STW160N75F3
Package mechanical data
TO-247 MECHANICAL DATA
DIM.
mm.
MIN.
TYP
inch
MAX.
MIN.
TYP.
MAX.
A
4.85
5.15
0.19
0.20
A1
2.20
2.60
0.086
0.102
b
1.0
1.40
0.039
0.055
b1
2.0
2.40
0.079
0.094
0.134
b2
3.0
3.40
0.118
c
0.40
0.80
0.015
0.03
D
19.85
20.15
0.781
0.793
E
15.45
15.75
0.608
e
5.45
L
14.20
14.80
0.560
L1
3.70
4.30
0.14
L2
0.620
0.214
18.50
0.582
0.17
0.728
øP
3.55
3.65
0.140
0.143
øR
4.50
5.50
0.177
0.216
S
5.50
0.216
9/13
Package mechanical data
STB160N75F3 - STP160N75F3 - STW160N75F3
D2PAK MECHANICAL DATA
TO-247 MECHANICAL DATA
mm.
inch
DIM.
MIN.
TYP
MAX.
MIN.
TYP.
MAX.
A
4.4
4.6
0.173
0.181
A1
2.49
2.69
0.098
0.106
A2
0.03
0.23
0.001
0.009
B
0.7
0.93
0.027
0.036
B2
1.14
1.7
0.044
0.067
C
0.45
0.6
0.017
0.023
C2
1.23
1.36
0.048
0.053
D
8.95
9.35
0.352
0.368
10.4
0.393
D1
E
8
10
E1
0.315
8.5
0.334
G
4.88
5.28
0.192
0.208
L
15
15.85
0.590
0.625
L2
1.27
1.4
0.050
0.055
L3
1.4
1.75
0.055
0.068
M
2.4
3.2
0.094
R
0º
0.126
0.015
4º
3
V2
0.4
1
10/13
STB160N75F3 - STP160N75F3 - STW160N75F3
5
Packaging mechanical data
Packaging mechanical data
D2PAK FOOTPRINT
TAPE AND REEL SHIPMENT
REEL MECHANICAL DATA
DIM.
mm
MIN.
A
B
1.5
C
12.8
D
20.2
G
24.4
N
100
T
TAPE MECHANICAL DATA
DIM.
mm
inch
MIN.
MAX.
MIN.
A0
10.5
10.7
0.413 0.421
B0
15.7
15.9
0.618 0.626
D
1.5
1.6
0.059 0.063
D1
1.59
1.61
0.062 0.063
E
1.65
1.85
0.065 0.073
F
11.4
11.6
0.449 0.456
K0
4.8
5.0
0.189 0.197
P0
3.9
4.1
0.153 0.161
P1
11.9
12.1
0.468 0.476
P2
1.9
2.1
0.075 0.082
inch
MAX.
MIN.
MAX.
330
12.992
13.2
0.504 0.520
26.4
0.960 1.039
0.059
0795
3.937
30.4
1.197
BASE QTY
BULK QTY
1000
1000
MAX.
R
50
1.574
T
0.25
0.35 0.0098 0.0137
W
23.7
24.3
0.933 0.956
* on sales type
11/13
Revision history
6
STB160N75F3 - STP160N75F3 - STW160N75F3
Revision history
Table 7.
12/13
Revision history
Date
Revision
07-Feb-2007
1
Changes
First release
STB160N75F3 - STP160N75F3 - STW160N75F3
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2007 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
13/13