TN4035-600G ® 40A SCRs MAIN FEATURES: A Symbol Value Unit IT(RMS) 40 A VDRM/VRRM 600 V IGT 35 mA G K A DESCRIPTION K A G The TN4035-600G is designed for applications where in-rush current conditions are critical, such as overvoltage crowbar protection circuits in power supplies. Using clip assembly technology, provides higher fusing threshold than wires. Mounting precautions detailled in application note AN533 on www.st.com. D2PAK ABSOLUTE RATINGS (limiting values) Symbol IT(RMS) Parameter Value Unit RMS on-state current (180° conduction angle) Tc = 95°C 40 A IT(AV) Average on-state current (180° conduction angle) Tc = 95°C 25 A ITSM Non repetitive surge peak on-state current Tj = 25°C I ²t tp = 8.3 ms tp = 10 ms I²t Value for fusing 480 A 460 Tj = 25°C 1060 A2S dI/dt Critical rate of rise of on-state current IG = 2 x IGT , tr ≤ 100 ns F = 60 Hz Tj = 125°C 50 A/µs IGM Peak gate current tp = 20 µs Tj = 125°C 4 A Tj = 125°C 1 W PG(AV) Average gate power dissipation Tstg Tj Storage junction temperature range Operating junction temperature range - 40 to + 150 - 40 to + 125 °C VRGM Maximum peak reverse gate voltage 5 V April 2004 - Ed: 3 1/5 TN4035-600G ELECTRICAL CHARACTERISTICS (Tj = 25°C, unless otherwise specified) Symbol Test Conditions Value IGT MIN. 3.5 MAX. 35 MAX. 1.3 V MIN. 0.2 V MAX. 75 mA MAX. 150 mA Tj = 125°C MIN. 1000 V/µs Tj = 25°C MAX. 1.6 V RL = 33 Ω VD = 12 V VGT VGD VD = VDRM RL = 3.3 kΩ IH IT = 500 mA Gate open IL IG = 1.2 IGT Tj = 125°C mA dV/dt VD = 67 % VDRM VTM ITM = 80 A Vt0 Threshold voltage Tj = 125°C MAX. 0.85 V Rd Dynamic resistance Tj = 125°C MAX. 10 mΩ Tj = 25°C MAX. 5 µA 4 mA IDRM IRRM Gate open Unit tp = 380 µs VDRM = VRRM Tj = 125°C THERMAL RESISTANCES Symbol Parameter Rth(j-c) Junction to case (DC) Rth(j-a) Junction to ambient (DC) S = 1cm2 (*) Value Unit 0.8 °C/W 45 °C/W * Surface under tab/Epoxy printed circuit board FR4, copper thickness 85µm ORDERING INFORMATION TN STANDARD SCR SERIES 40 35 CURRENT: 40A - 600 G (-TR) PACKING MODE: Blank: Tube -TR: Tape & Reel VOLTAGE: 600: 600V SENSITIVITY: 35: 35mA PACKAGE: G: D2PAK OTHER INFORMATION Part Number Marking Weight Base Quantity Packing mode TN4035-600G TN4035-600G 1.5 g 50 Tube TN4035-600G-TR TN4035-600G 1.5 g 1000 Tape & Reel ■ Epoxy meets UL94, V0 2/5 TN4035-600G Fig. 1: Maximum average power dissipation versus average on-state current. Fig. 2: Average and DC on-state current versus case temperature. IT(av)(A) P(W) 50 40 α = 180° 35 D.C. 40 30 25 30 α = 180° 20 20 15 360° 10 10 5 0 α IT(av)(A) 0 5 10 15 20 Tcase(°C) 25 30 Fig. 3: Relative variation of thermal impedance versus pulse duration. 0 0 25 50 75 100 125 Fig. 4: Relative variation of gate trigger current, holding current and latching current versus junction temperature. IGT,IH,IL [Tj] / IGT,IH,IL [Tj = 25 °C] K = [Zth/Rth] 2.5 1.00 2.0 Zth(j-c) IGT 1.5 0.10 Zth(j-a) IH & IL 1.0 0.5 tp(s) 0.01 1E-3 1E-2 1E-1 1E+0 Tj(°C) 1E+1 1E+2 5E+2 Fig. 5: Surge peak on-state current versus number of cycles. 0.0 -40 0 20 40 60 80 100 120 140 Fig. 6: Non-repetitive surge peak on-state current for a sinusoidal pulse with width tp < 10 ms, and corresponding value of I²t. ITSM(A),I 2t(A2s) ITSM(A) 500 450 400 350 300 250 200 150 100 50 0 -20 5000 Tj initial = 25 °C tp = 10ms ITSM One cycle Non repetitive Tj initial = 25 °C I2t 1000 dI/dt limitattion Repetitive Tcase = 95 °C Number of cycles 1 10 100 tp(ms) 1000 100 0.01 0.10 1.00 10.00 3/5 TN4035-600G Fig. 7: values). On-state characteristics (maximum Fig. 8: Thermal resistance junction to ambient versus surface under tab (Epoxy printed circuit board FR4, copper thickness: 35µm) ITM(A) 500 Rth(j-a) (°C/W) 80 Tj max.: Vto = 0.85V Rd = 10m Ω 70 60 100 50 Tj = Tj max. 40 10 30 Tj = 25°C 20 10 1 0.0 4/5 VTM(V) 0.5 1.0 1.5 2.0 2.5 S(cm²) 0 3.0 3.5 4.0 4.5 5.0 0 10 20 30 40 50 TN4035-600G PACKAGE MECHANICAL DATA D2PAK JEDEC REFERENCE: TO-263 DIMENSIONS REF. A E Min. C2 L2 D L L3 A1 B2 Millimeters R C B G A2 2.0 MIN. FLAT ZONE V2 A A1 A2 B B2 C C2 D E G L L2 L3 R V2 4.30 2.49 0.03 0.70 1.25 0.45 1.21 8.95 10.00 4.88 15.00 1.27 1.40 Typ. Min. Typ. Max. 4.60 2.69 0.23 0.93 1.40 0.40 0° Max. Inches 0.169 0.181 0.098 0.106 0.001 0.009 0.027 0.037 0.048 0.055 0.60 0.017 0.024 1.36 0.047 0.054 9.35 0.352 0.368 10.28 0.393 0.405 5.28 0.192 0.208 15.85 0.590 0.624 1.40 0.050 0.055 1.75 0.055 0.069 0.016 8° 0° 8° FOOTPRINT DIMENSIONS (in millimeters) D2PAK (Plastic) 16.90 10.30 5.08 1.30 3.70 8.90 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. 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