STPS41H100C-Y Automotive low drop power Schottky rectifier Features ■ A1 Negligible switching losses K A2 ■ Low leakage current ■ Good trade off between leakage current and foward voltage drop ■ Low thermal resistance ■ Avalanche capability specified ■ AEC-Q101 qualified K A2 A1 Description Dual center tab Schottky rectifier suited for switch mode power supply and high frequency DC to DC converters. D2PAK, D2PAK STPS41H100CG-Y j Table 1. Packaged in this device is intended for use in high frequency inverters for automotive application. October 2011 Doc ID 018564 Rev 1 Device summary Symbol Value IF(AV) 2 x 20 A VRRM 100 V Tj (max) 175 °C VF(max) 0.67 V 1/7 www.st.com 7 Characteristics 1 STPS41H100C-Y Characteristics Table 2. Absolute ratings (limiting values, per diode) Symbol VRRM IF(RMS) Value Unit Repetitive peak reverse voltage 100 V Forward rms current 30 A Tc = 50 °C δ = 0.5 20 Per diode Per device IF(AV) Average forward current IFSM Surge non repetitive forward current tp = 10 ms sinusoidal IRRM Repetitive peak reverse current tp = 2 µs square F = 1 kHz PARM Repetitive peak avalanche power tp = 1 µs Tj = 25 °C Tstg Tj dV/dt 1. Parameter A 40 220 A 1 A 18100 W Storage temperature range -65 to + 175 °C Maximum operating junction temperature range(1) -40 to + 175 °C 10000 V/µs Value Unit Critical rate of rise of reverse voltage 1 dPtot < condition to avoid thermal runaway for a diode on its own heatsink Rth(j-a) dTj Table 3. Thermal resistance Symbol Parameter Rth(j-c) Junction to case Rth(c) Coupling Per diode 1.5 Total 0.8 °C/W 0.1 When the diodes 1 and 2 are used simultaneously: ΔTj(diode 1) = P(diode1) x Rth(j-c)(Per diode) + P(diode 2) x Rth(c) Table 4. Symbol IR(1) VF(1) Static electrical characteristics (per diode) Parameter Reverse leakage current Forward voltage drop Test conditions Tj = 25 °C Tj = 125 °C Min. VR = VRRM Tj = 25 °C IF = 20 A Tj = 125 °C IF = 20 A Tj = 25 °C IF = 40 A Tj = 125 °C IF = 40 A 1. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.58 x IF(AV) + 0.0045 IF2(RMS) 2/7 Doc ID 018564 Rev 1 Typ. 3 Max. Unit 10 μA 10 mA 0.80 0.62 0.67 V 0.90 0.70 0.76 STPS41H100C-Y Figure 1. Characteristics Conduction losses versus average Figure 2. current PF(av)(W) Average forward current versus ambient temperature (δ = 0.5) IF(av)(A) 16 22 δ = 0.5 14 Rth(j-a)=Rth(j-c) 20 δ = 0.2 18 δ=1 12 16 δ = 0.1 14 10 δ = 0.05 12 8 10 6 8 4 6 T Rth(j-a)=50°C/W 4 2 IF(av)(A) 0 5 Figure 3. 1 10 2 δ=tp/T 0 15 T tp δ=tp/T 0 20 0 25 Normalized avalanche power derating versus pulse duration 25 Figure 4. PARM(tp) PARM(1µs) 1.2 Tamb(°C) tp 50 75 100 125 150 175 Normalized avalanche power derating versus junction temperature PARM(Tj) PARM(25 °C) 1 0.1 0.8 0.6 0.4 0.01 0.2 tp(µs) 0.001 0.01 0.1 Figure 5. 1 10 1000 100 Non repetitive surge peak forward current versus overload duration (maximum values) Tj(°C) 0 25 50 Figure 6. IM(A) 75 100 150 125 Relative variation of thermal impedance junction to case versus pulse duration Zth(j-c)/Rth(j-c) 1.0 300 0.9 250 0.8 0.7 200 Tc=25°C 150 0.6 δ = 0.5 0.5 Tc=75°C 100 50 Tc=125°C δ = 0.2 0.3 δ = 0.1 T 0.2 IM Single pulse t 0.1 t(s) δ=0.5 0 1.E-03 0.4 1.E-02 1.E-01 1.E+00 0.0 1.E-03 Doc ID 018564 Rev 1 tp(s) 1.E-02 δ=tp/T 1.E-01 tp 1.E+00 3/7 Characteristics Figure 7. STPS41H100C-Y Reverse leakage current versus reverse voltage applied (typical values) Figure 8. Junction capacitance versus reverse voltage applied (typical values) C(nF) IR(mA) 10.0 1.E+02 F=1MHz Vosc=30mV Tj=25°C Tj=150°C 1.E+01 Tj=125°C 1.E+00 Tj=100°C 1.0 1.E-01 Tj=75°C 1.E-02 Tj=50°C 1.E-03 Tj=25°C VR(V) VR(V) 0.1 1.E-04 0 Figure 9. 10 20 30 40 50 60 70 80 90 100 Forward voltage drop versus forward current 1 10 100 Figure 10. Thermal resistance junction to ambient versus copper surface under tab IFM(A) Rth(j-a)(°C/W) 100 80 (epoxy printed board FR4, Cu = 35 µm) - STPS41H100CG only 70 Tj=125°C (Maximum values) 60 50 Tj=125°C (Typical values) 10 40 Tj=25°C (Maximum values) 30 20 10 VFM(V) 0.0 4/7 S(cm²) 0 1 0.2 0.4 0.6 0.8 1.0 1.2 0 Doc ID 018564 Rev 1 5 10 15 20 25 30 35 40 STPS41H100C-Y 2 Package information Package information ● Epoxy meets UL94, V0 ● Cooling method: by conduction (C) In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 5. D2PAK dimensions Dimensions Ref. A E C2 L2 D L L3 A1 B2 R C B M * V2 * FLAT ZONE NO LESS THAN 2mm Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009 B 0.70 0.93 0.027 0.037 B2 1.14 1.70 0.045 0.067 C 0.45 0.60 0.017 0.024 C2 1.23 1.36 0.048 0.054 D 8.95 9.35 0.352 0.368 E 10.00 10.40 0.393 0.409 G 4.88 5.28 0.192 0.208 L 15.00 15.85 0.590 0.624 L2 1.27 1.40 0.050 0.055 L3 1.40 1.75 0.055 0.069 M 2.40 3.20 0.094 0.126 G A2 Millimeters R V2 0.40 typ. 0° 0.016 typ. 8° 0° 8° Figure 11. Footprint (dimensions in mm) 16.90 10.30 5.08 1.30 8.90 Doc ID 018564 Rev 1 3.70 5/7 Ordering information 3 STPS41H100C-Y Ordering information Table 6. Ordering information Order code Marking STPS41H100CGY-TR STPS41H100CGY 4 Weight Base qty Delivery mode D2PAK 1.48 g 1000 Tape and reel Revision history Table 7. 6/7 Package Document revision history Date Revision 21-Oct-2011 1 Changes Initial release. Doc ID 018564 Rev 1 STPS41H100C-Y Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. 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